Here are relevant reports on : thermal-paper-market
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Thermal Paper Market by Type (Conventional Thermal Paper, Top-Coated Thermal Paper, Synthetic-Base Thermal Paper), Technology (Direct Thermal, Thermal Transfer), Application (Point Of Sale, Lottery & Gaming, Tags & Labels), End-Use Industry (Packaging and Labelling, Printing, Retail), Region - Global Forecast to 2025
The research methodology used to estimate and forecast the Thermal Paper market began with capturing data on key vendor revenues through secondary sources, such as Hoovers, Bloomberg, Chemical Weekly, Factiva, and various other government and private websites and databases. The vendor offerings were taken into consideration to determine the market segmentation. After arriving at the overall market size, the total market was split into several segments and sub-segments, which were later verified through primary research by conducting extensive interviews with key personnel, such as CEOs, VPs, directors, and executives. Data triangulation and market breakdown procedures were employed to complete the overall market engineering process and arrive at the exact statistics for all segments and sub-segments of the market. The breakdown of profiles of primaries is depicted in the figure below.
- Published: May 2026
- Price: $ 4950
- TOC Available:
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Thermal Conductive Adhesives Market by Type (Silicones, Epoxies, Polyurethanes, and Acrylics), Application (Battery Thermal, Heat Sink, IC Packaging Heat Conduction, LED Lighting Thermal, Thermal Material Potting) - Global Forecast to 2022
Thermal adhesive is a type of thermally conductive glue used for electronic components and heatsinks. Thermal adhesive is similar to thermal paste in that it is used for transferring heat from one surface to another. It is commonly used to bond heatsinks to motherboard chipsets and video card processors where there are no mounting holes to clamp a heatsink down. Thermally conductive adhesives offer superior heat dissipation for a wide range of electronic applications. Both one and two component systems are used. They include epoxies, silicones and elastomeric products. Thermally conductive adhesive are also used for managing heat in next-generation automotive applications, including power electronics for electric and hybrid electric vehicles.
- Published: May 2026
- Price: $ 4950
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Thermal Interface Pads & Material Market by Type (Phase Change Material, Thermal Grease, Thermal Pads), Products (MOSFET, Thyristor, IGBT), Application (Consumer Electronics, Telecom Equipment, Power Supply Units) - Forecast to 2020
The thermal interface pads & material market comprises products used for transferring heat from electronic components to heat sinks in a wide range of electronic applications in different industries. Thermal interface pads & materials are widely used in consumer electronics, telecom equipment, power supply unit, aerospace, and other industries. The thermal interface pads & materials market was value at $850.06 Million in 2014 and is expected to grow at a rate of 8.47% in the near future.
- Published: April 2015
- Price: $ 4950
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Variable Data Printing Market in Labels by Label Type (Release Liner, Linerless), Composition (Facestock, Topcoat), Printing Technology (Thermal Transfer, Direct Thermal, Electrophotography, Inkjet), End-use Sector, Region - Forecast to 2021
The variable data printing market size will grow from USD 10.79 Billion in 2016 to reach USD 22.27 Billion by 2021, at an estimated CAGR of 15.61%. The global variable data printing market is driven by basic factors, which include strong growth in demand, especially in pharmaceutical, food & beverage and other sectors. These drivers are supported by the high rise in demand from the Asia-Pacific region. Product innovations and technological developments in the market are expected to create strong investment opportunities.
- Published: June 2016
- Price: $ 4950
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Release Liners Market by Substrate Type (Glassine/Calendered Kraft Paper, Polyolefin Coated Paper, Clay Coated Paper), Application (Labels, Pressure-Sensitive Tapes, Hygiene), Material Type, Labeling Technology, and Region - Global Forecast to 2029
The release liners market is expected to grow from USD 12.7 billion in 2024 to USD 15.4 Billion by 2029, at a CAGR of 4.0% during the forecast period. The Release liners market comprises key manufacturers such as are 3M (US), Mondi (Austria), Ahlstrom (Finland), Loparex (US), LINTEC Corporation (Japan), Sappi (South Africa), Polyplex Corporation Ltd. (India), Gascogne (France), UPM (Finland), and Avery Dennison Corporation (US) among others are the major players in the release liners market.
- Published: September 2024
- Price: $ 4950
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Thin Insulation Market by Type (Sheets & Films, Vacuum Insulation Panels, Coatings), Material (Metals, Aersgels, Silica), Application (Building Thermal Insulation, Pipe Coating Insulation, Thermal Packaging), and by Region - Global Trends & Forecasts to 2021
The global thin insulation market size, in terms of value, is projected to reach USD 2.12 Billion by 2021, at a CAGR of 5.8% between 2016 and 2021. The increasing infrastructure development activities in Asia-Pacific and North America and continuous new product launches and joint ventures & collaborations undertaken by different companies are the key factors for the growth of the global thin insulation market.
- Published: July 2016
- Price: $ 4950
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Video as a Sensor Market by Camera Type (IP, Thermal, Machine Vision, Hyperspectral), Sensor (Image Motion, Infrared), Product Type (Video Surveillance, Thermal Imaging, Hyperspectral Imaging, Machine Vision & Monitoring) - Global Forecast to 2029
The global video as a sensor market is expected to grow from USD 69.52 billion in 2024 to USD 101.89 billion by 2029, at a compound annual growth rate (CAGR) of 7.9% during the forecast period.The key players Honeywell International Inc. (US), Motorola Solutions, Inc. (US), Dahua Technology Co., Ltd (China), Bosch Security Systems GmbH (Germany),Hangzhou Hikvision Digital, Technology Co., Ltd. (China), AT&T (US), IBM Corporation (US), Cisco Systems, Inc. (US), Axis Communications AB (Sweden), Johnson Controls Inc. (Ireland), Sony Group Corporation (Japan), Sharp Corporation (Japan),Teledyne Technologies Incorporated (US),Corning Incorporated (US),Pixart Imaging Inc. (Taiwan).
- Published: February 2025
- Price: $ 4950
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Temperature Monitoring and Processor Cooling Systems (Thermal Management) Market, Global Forecast & Analysis (2011 - 2016)
The benefits of various temperature monitoring devices and cooling methods, such as forced air flow, within a processor or FPGA-based system, help control overall temperature of ICs and internal cabinet temperatures. Electronics cooling is done by thermal conduction, convection, and radiation, as well as phase change processes. Successful thermal packaging relies on a judicious combination of materials and heat transfer mechanisms to soothe the component temperature at an adequate level. The Temperature Monitoring and Processor Cooling Systems (Thermal Management) Market research report aims to capture the market roadmap with market sizes, revenue forecasts, value chain, market & product trends, price trends and regulations, competitive landscape, leading players and their key developments, strategies, and profiles. It also aims to analyze the market by products, applications, and geography.
- Published: May 2026
- Price: $ 4950
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Fever Detection Thermal Scanners and Cameras Market - Global Forecast 2025
Fever Detection Thermal Scanners and Cameras Market
- Published: May 2026
- Price: $ 4950
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Thermal & Heat Resistant Coating Market - By Type, Application & Geography - 2018
- Published: May 2026
- Price: $ 4950
- TOC Available:
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