Here are relevant reports on : 3d-semiconductor-packaging-market
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Vision Sensor Market by Sensor Type (Less than 3D, 3D), Application (Inspection, Gauging, Code Reading & Localization), End-User Industry (Automotive, Electronics & Semiconductor, Pharmaceuticals, Food & Packaging), and Geography - Global Forecast to 2025-2035
The global vision sensor market was valued at USD 5.15 billion in 2024 and is estimated to reach USD 24.90 billion by 2035, at a CAGR of 14.1% between 2025 and 2036. Factors driving the demand for these sensors include the growth of the electronics and electrical industry, the use of machine vision technology in the automotive industry, and the focus of manufacturing companies on cost and time savings.Cognex (US), Teledyne (US), Keyence (Japan), Sick AG (Germany), Baumer (Switzerland), Omron (Japan), Datalogic (Italy), Ifm Electronics (Germany), Balluff (Germany), and Basler (Germany).
- Published: January 2026
- Price: $ 4950
- TOC Available:
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IC Packaging Technology Market - By Type(3D IC Packaging, Multi-Chip Packaging & System-in-Package), Technology, Application & Geography – 2018
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029
The semiconductor & ic packaging materials market is expected to grow from USD 43.9 billion in 2024 to USD 70.9 billion by 2029, at a CAGR of 10.1% during the forecast period. The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc.
- Published: March 2024
- Price: $ 4950
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3D Digital Asset Market by Hardware (3D Scanners, Motion Capture Systems), Software (3D Modeling, 3D Scanning, 3D Rendering & Visualization, 3D Animation, Image Reconstruction), Application (Visualization, Gaming & Animation) - Global Forecast to 2029
The 3D Digital Asset market is projected to reach USD 51.8 billion by 2029 at a Compound Annual Growth Rate (CAGR) of 12.9% during the forecast period. Some of the key players operating in the 3D Digital Asset are – Autodesk (US), Siemens (Germany), Adobe (US), Unity (US), NVIDIA (US), Microsoft (US), Ansys (US), Epic Games (US), PTC (US), Trimble (US), Sony (Tokyo), Apple (US), Meta (US), Reply (Italy), Google (US), IKEA (Netherlands), Hexa (Israel), Threekit (US), Sitecore (US), Daminion (US), Consortiq (UK), Modelry (US), Design Connected (Bulgaria), VNTANA (US), Cesium (US), Keyshot (US), and Moovly (Belgium).
- Published: July 2024
- Price: $ 4950
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Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Wafer Cleaning, Deposition, Assembly & Packaging, Dicing, Metrology, Bonding, Wafer Testing/IC Testing, Memory, Logic, Discrete, Analog - Global Forecast to 2032
The global semiconductor manufacturing equipment market is expected to grow from USD 166.35 billion in 2025 to USD 344.36 billion by 2032, at a compound annual growth rate (CAGR) of 11.0%. during the forecast period. The Key Players Applied Materials, Inc. (US), ASML (Netherlands), LAM RESEARCH CORPORATION (US), Tokyo Electron Limited (Japan), and KLA Corporation (US).
- Published: November 2025
- Price: $ 4950
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China Semiconductor Market for Automotive by Component (Microcontroller, Power Semiconductor, Sensor & MEMS Device, Memory Chip, Analog & Mixed Signal IC), Global & China Semiconductor Export, Alternate Destination - Trends and Strategic Recommendation
China’s exports of automotive semiconductors reached USD 419.15 billion in 2024, from USD 280.81 billion in 2020, with a CAGR of 8.9%. The major players in the China semiconductor market for automotive include SMIC (SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION), GigaDevice Semiconductor Inc., Novosense Microelectronics, Silan Microelectronics, and HiSilicon.
- Published: June 2025
- Price: $ 4950
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Top 10 Advanced Materials & Technologies Market by Product (G. Fast Chipset, Quantum Dots, Flexible Battery, Graphene, 3D IC & 2.5D IC Packaging, Organic Electronics, Smart Glass, Others) - Global Forecast to 2021
The top 10 advanced materials & technologies in electronics refers to the new or modifications to the existing materials & technologies to obtain superior performance or efficiency. The market for top 10 advanced materials & technologies in electronics is witnessing high growth owing to the increasing end-use applications, technological advances, and the high demand of these technologies from both the developed and emerging regions.
- Published: February 2017
- Price: $ 4950
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3D Imaging Market by Hardware (3D Cameras, 3D Sensors, 3D Scanners), Software (Modeling, Scanning, Layout & Animation, Visualization & Rendering, Image Reconstruction), Technology (Stereoscopic Imaging, Laser-based Imaging) - Global Forecast to 2028
The global market for 3D Imaging market is projected to reach USD 88.4 billion by 2028, at a CAGR of 20.8% during the forecast period. Major vendors in the global 3D Imaging market are GE Healthcare (US), Autodesk (US), STMicroelectronics (Switzerland), Panasonic (Japan), Sony Corporation (Japan), Trimble (US), FARO Technologies (US), Philips (Netherlands), Google (US), Adobe (US), HP (US), Dassault Systemes (France), Bentley Systems (US), Lockheed Martin (US), Topcon (Japan), Able Software (US), Maxon (Germany), ESRI (US), Archilogic (Switzerland), Pix4D (Switzerland), Brainkey (US), Precismo (US), Kaarta (US), LightCode Photonics (Estonia), Vzense Technology (US), Capoom (Istanbul), Atomontage (US), Hivemapper (US), Shapr3D (Hungary), Innersight (UK).
- Published: January 2024
- Price: $ 4950
- TOC Available:
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Mobile 3D Market [3D Mobile; 3D Displays; 3D Notebooks; 3D Smartphones; 3D Tablets; 3D Mobile Gaming; 3D Mobile Advertisements; 3D Mobile Projection; 3D Mobile Maps; 3D Mobile Navigation; 3D Mobile Animation] – Global Advancements, Worldwide Market Forecasts & Analysis (2013 – 2018)
The past decade witnessed a giant leap in the entertainment industry, with 3Dl motion pictures trickling out of cinemas to 3D television screens. New generation 3D mobile phones are next to follow suit, without the need for 3D viewing glasses.
- Published: February 2013
- Price: $ 4950
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Top Packaging Trends – (Aseptic Packaging, Insulated Packaging, Antimicrobial Packaging, Modified Atmosphere Packaging, Protective Packaging, Smart Labels, Sterile Packaging, Anti-counterfeit Packaging, and Vacuum Packaging) - Forecast to 2021
In this report on top packaging trends, the packaging market has been segmented on the basis of technology and type. In the anti-counterfeit packaging market, the pharmaceutical & healthcare segment is projected to be the fastest-growing end-use sector that requires advanced packaging technologies to prevent counterfeiting of medicines and healthcare products. On the basis of technology, the RFID segment is projected to grow at highest rate during the forecast period in the anti-counterfeit packaging market, due to its ability to read and capture information stored on the tag attached to the product.
- Published: March 2017
- Price: $ 4950
- TOC Available:
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