Here are relevant reports on : epoxy-curing-agent-market
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Epoxy Curing Agents Market by Type (Amine-Based Curing Agents, Anhydride Curing Agents), Application (Coatings, Construction, Adhesives, Composites, Wind Energy, Electrical & Electronics), and Region - Global Forecast to 2022
The epoxy curing agents market is projected to reach USD 5.02 Billion by 2022, at a CAGR of 6.84% from 2017 to 2022. The growth of the market can be attributed to the expansion of the construction industry, increasing urban population, and growth of the composite industry. Based on application, the coatings segment is projected to lead the epoxy curing agents market, while the wind energy segment is projected to witness highest growth during the forecast period.
- Published: March 2017
- Price: $ 4950
- TOC Available:
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Curing Agents Market by Type (Epoxy, Polyurethane, Silicone Rubber, and Others), Application (Coatings, Electrical & Electronics, Composites, Adhesives, Construction, Wind Energy, and Others), and Region - Global Forecast to 2023
The market for curing agents is projected to grow from USD 4.2 billion in 2018 to USD 5.9 billion by 2023, at a compound annual growth rate (CAGR) of 6.80% during the forecast period. The growth of applications such as coatings, wind energy, electrical & electronics, construction, composites, and adhesives is majorly driving the curing agents market.The major players operating in the curing agents market are Evonik Industries (Germany), Hexion Inc. (US), Huntsman Corporation (US), Cardolite Corporation (US), and BASF (Germany).
- Published: January 2019
- Price: $ 4950
- TOC Available:
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Instant Adhesive Market by Chemistry (Cyanoacrylate, Epoxy-based), Curing Process (Conventional, Light Cured), Application (Industrial, Woodworking, Transportation, Consumer, Medical, Electronics), and Region - Global Forecasts to 2022
The instant adhesives market is projected to grow from USD 1.57 Billion in 2017 to USD 2.38 Billion by 2022, at a CAGR of 8.75% during the forecast period. In this study, 2016 has been considered as the base year to estimate the size of the instant adhesives market. The report provides the short-term forecast from 2017 to 2022. It aims at estimating the size and future growth potential of the instant adhesives market across different segments, such as curing process, chemistry, application, and region.
- Published: May 2017
- Price: $ 4950
- TOC Available:
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PCB Encapsulation Market by Resin Type (Epoxy, Acrylic), Curing Type (UV-Cure, Heat Cure, Room Temperature Cure), Application (Consumer Electronics, Automotive Electronics, Medical Devices), Product Type - Global Forecast to 2029
PCB encapsulation market is expected to grow from USD 5.59 billion by 2029 to USD 5.59 billion by 2029, at a CAGR of 8.8% during the forecast period. The key players in this market Henkel AG & Co. KGaA (Germany), H.B. Fuller Company (US), Parker-Hannifin Corporation (US), Dow (US), DuPont (US), Nagase ChemteX Corporation (Japan), Huntsman International LLC (US), Wacker Chemie AG (Germany), Shin-Etsu Chemical Co. Ltd., (Japan) Panacol-Elosol GmbH (Germany).
- Published: October 2024
- Price: $ 4950
- TOC Available:
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Electronics Conformal Coating Market by Material (Acrylic, Silicone, Parylene, Urethane/Polyurethane, Epoxy), Equipment (Curing, Coating), Method (Brush Coating, Dipping), Application and Geography - Global Forecasts to 2020
The global Electronics conformal coating market size is estimated to grow from USD 1.70 Billion in 2014, and is expected to reach USD 2.41 Billion by 2020, at a CAGR of 5.99% between 2015 and 2020. The growth of this market is being propelled by the increasing usage of electronic components in the end products by OEMs, as well as ability of this coating to help manufacturers to provide end products with higher level of reliability.
- Published: January 2016
- Price: $ 4950
- TOC Available:
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Medical Device Adhesive Market by Resin Type (Light Curing, Cyanoacrylates, Acrylic, Epoxy, Silicone, & Polyurethane), Application (Needles, Catheters, Tube Sets, Masks, Polycarbonate Devices, Pacemaker) - Global Forecast to 2021
The global medical device adhesive market is projected to reach USD 3.20 Billion by 2021, at a CAGR of 6.6% from 2016 to 2021. Medical device adhesive are used in various applications such as needles & syringes, catheters, tube sets, masks, polycarbonate devices, and pacemaker & other equipment. Adhesives are used as an integral part for the bonding of various similar & dissimilar components in the medical devices. It has played an important role in the assembly of medical devices of various classes.
- Published: January 2017
- Price: $ 4950
- TOC Available:
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Encapsulants Market by Chemistry (Epoxy, Silicone, Urethane), Curing Type (Room Temperature, Heat Temperature, UV), End-Use Industry (Consumer Electronics, Transportation, Medical, Energy & Power), and Region - Global Forecast to 2022
The encapsulants market is estimated to be USD 1.26 Billion in 2017 and is projected to reach USD 1.64 Billion by 2022, at a CAGR of 5.5% from 2017 to 2022 The increasing complexity & functionality of electronics devices and the trend of miniaturization in devices are among the major reasons for the growing importance of encapsulants in the semiconductor & electronics industry. Key companies profiled in this research report on the encapsulants market include Dow Corning (US), Henkel (Germany), LORD Corporation (US), Shin-Etsu Chemicals (Japan), and H.B. Fuller (US).
- Published: November 2017
- Price: $ 4950
- TOC Available:
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Composite Film Market by Resin Type (Epoxy), Curing Type (Autoclave, Out-of-autoclave), Function (Lightning Strike Protection, Surface Protection), End-use Industry (Aerospace & Defense, Automotive), and Region - Global Forecast to 2025
The composite film market is expected to grow from USD 245 million in 2020 to USD 328 million by 2025, at a compound annual growth rate (CAGR) of 6.0% during the forecast period.The key players in the global composite film market are 3M(US), Henkel AG Co. KGaA(Germany), Hexcel Corporation(US), Gurit (Switzerland), Solvay(Belgium), Toray Industries, Inc. (Japan), Socomore(France), Park Aerospace Corp.(US), and Axiom Materials Inc.(US). These companies are involved in adopting various inorganic and organic strategies to increase their foothold in the composite film industry. The study includes an in-depth competitive analysis of these key players in the composite film market, with their company profiles, recent developments, and key market strategies.
- Published: March 2020
- Price: $ 4950
- TOC Available:
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Heat Curing Adhesive Market by Type (Epoxy Resin, Phenol-formaldehyde Resins, Polyurethane), by Application (Automotive Industry, Metal Fabrication and Aerospace Industry), and by Region - Trends & Forecasts to 2019
Heat curing adhesives require high temperatures for a specified period of time to achieve cure. Because they are heat cured, cured adhesives generally provide the highest strength, heat resistance and chemical resistance. Although adhesion to plastic substrates is generally good, they can only be used to bond plastics that have softening points sufficiently above the cure temperature of the adhesive. These adhesives are supplied as liquid, paste, and film.
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Concrete Bonding Agents Market by Agent (Cementitious Latex Based, and Epoxy Based), Application (Repairing, Flooring, Decorative, and Marine) and Region - Global Forecast to 2026
The global concrete bonding agents market is projected to reach USD 5.87 Billion by 2026, at a CAGR of 8.2%. It is projected to reach 8,038.4 KT, at a CAGR of 6.6% from 2016 to 2026 by volume. Rising incomes of the middle class population in emerging countries such as India, Thailand, Indonesia, and Vietnam and the preference in repairing existing infrastructure rather than constructing new ones are the key factors driving the global concrete bonding agents market.
- Published: November 2016
- Price: $ 4950
- TOC Available:
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