Here are relevant reports on : thermal-interface-material-market
-
Thermal Interface Pads & Material Market by Type (Phase Change Material, Thermal Grease, Thermal Pads), Products (MOSFET, Thyristor, IGBT), Application (Consumer Electronics, Telecom Equipment, Power Supply Units) - Forecast to 2020
The thermal interface pads & material market comprises products used for transferring heat from electronic components to heat sinks in a wide range of electronic applications in different industries. Thermal interface pads & materials are widely used in consumer electronics, telecom equipment, power supply unit, aerospace, and other industries. The thermal interface pads & materials market was value at $850.06 Million in 2014 and is expected to grow at a rate of 8.47% in the near future.
- Published: April 2015
- Price: $ 4950
- TOC Available:
-
Thermal Interface Materials Market by Material (Silicone, Epoxy,Polymide), Type (Greases & Adhesives, Tapes & Films, Gap Fillers, Phase Change Materials), Application (Computers, Telecom, Consumer Durables) & Region - Global Forecast to 2029
The thermal interface materials market is expected to grow from USD 3.56 billion in 2024 to USD 5.64 billion by 2029, at a CAGR of 9.7% during the forecast period. The report profiles key players such as Honeywell International Inc. (US), 3M (US), Henkel AG & Co. KGaA (Germany), Parker Hannifin Corporation (US), DOW (US), Laird Technologies Inc. (US), Momentive (US), Wakefield Thermal Inc. (US), Indium Corporation (US), and Zalma Tech Co. Ltd. (South Korea).
- Published: January 2025
- Price: $ 4950
- TOC Available:
-
Thermal Conductive Adhesives Market by Type (Silicones, Epoxies, Polyurethanes, and Acrylics), Application (Battery Thermal, Heat Sink, IC Packaging Heat Conduction, LED Lighting Thermal, Thermal Material Potting) - Global Forecast to 2022
Thermal adhesive is a type of thermally conductive glue used for electronic components and heatsinks. Thermal adhesive is similar to thermal paste in that it is used for transferring heat from one surface to another. It is commonly used to bond heatsinks to motherboard chipsets and video card processors where there are no mounting holes to clamp a heatsink down. Thermally conductive adhesives offer superior heat dissipation for a wide range of electronic applications. Both one and two component systems are used. They include epoxies, silicones and elastomeric products. Thermally conductive adhesive are also used for managing heat in next-generation automotive applications, including power electronics for electric and hybrid electric vehicles.
- Published: February 2026
- Price: $ 4950
- TOC Available:
-
Conductive Silicone Market by Type (Elastomers, Resins, Gels and Others), Application (Adhesives & Sealants, Thermal Interface Materials, Encapsulants & Potting Compounds, Conformal Coatings and Others), and by Region - Global Trends & Forecast to 2021
The global conductive silicone market is projected to reach USD 4.46 Billion by 2021, registering a CAGR of 7.2% between 2016 and 2021. This growth is fueled by the high potential from the power generation & distribution, photovoltaic, and LED industry in Asia-Pacific, Latin America and Middle-East & Africa region.
- Published: May 2016
- Price: $ 4950
- TOC Available:
-
Thin Insulation Market by Type (Sheets & Films, Vacuum Insulation Panels, Coatings), Material (Metals, Aersgels, Silica), Application (Building Thermal Insulation, Pipe Coating Insulation, Thermal Packaging), and by Region - Global Trends & Forecasts to 2021
The global thin insulation market size, in terms of value, is projected to reach USD 2.12 Billion by 2021, at a CAGR of 5.8% between 2016 and 2021. The increasing infrastructure development activities in Asia-Pacific and North America and continuous new product launches and joint ventures & collaborations undertaken by different companies are the key factors for the growth of the global thin insulation market.
- Published: July 2016
- Price: $ 4950
- TOC Available:
-
AS-Interface Market by Component (AS-I Slave, AS-I Gateway, AS-I Power Supply, AS-I Cable), Application (Material Handling, Drive Control, Building Automation), Industry, and Geography - Global Forecast to 2023
AS-Interface market is expected to be valued at USD 1,158.5 Million by 2023, growing at a CAGR of 4.3% between 2017 and 2023. The major players in the AS-Interface market includes Bihl+Wiedemann GmbH (Germany), ifm electronic gmbh (Germany), Siemens AG (Germany), Valmet Corporation (Finland), Pepperl+Fuchs GmbH (Germany), Baumer Electric AG (Switzerland), ABB Ltd. (Switzerland), Emerson Electric Co. (US), Phoenix Contact GmbH & Co. KG (Germany), and Schneider Electric SE (France).
- Published: July 2017
- Price: $ 4950
- TOC Available:
-
Disposable Protective Clothing Market by Material Type (PE, PP, Polyester), Application (Thermal, Chemical, Biological/Radiation, Visibility), End-Use Industry (Manufacturing, Construction, Healthcare/Medical) - Global Forecast to 2024
The disposable protective clothing market is expected to grow from USD 2.6 billion in 2019 to USD 3.6 billion by 2024, at a compound annual growth rate (CAGR) of 6.5% during the forecast period.The key market players profiled in the report include as 3M Company (US), Du Pont de Nemours and Company (US), Kimberly Clark Corp (US), International Enviroguard (US), Derekduck Industries Corp. (Taiwan), and Lakeland Industries, Inc. (US).
- Published: September 2019
- Price: $ 4950
- TOC Available:
-
Aerospace Insulation Market by Material, Insulation Function (Thermal & Acoustic), End-Use Industry (General Aviation, Commercial Aircraft, Defense Aircraft, Space Shuttles & Satellites), and Region - Global Forecast to 2022
The report studies the global aerospace insulation market which is segmented by insulation function (thermal & acoustic), material (mineral wool, fiberglass, & foamed plastics), end-user industry (general aviation, commercial aircraft, defense aircraft, space shuttles & satellites), and by region (North America, Europe, Asia-Pacific, South America, and Middle East & Africa).
- Published: February 2026
- Price: $ 4950
- TOC Available:
-
OEM Insulation Market by Material Type (Mineral Wool, PU Foam, Flexible Elastomeric Foam, & Other Materials), Insulation Type (Thermal & Acoustic), End Use (Industrial & Commercial, Transportation and Consumer), & Region - Global Forecast to 2030
The OEM insulation market is expected to grow from USD 17.99 billion in 2024 to USD 24.80 billion by 2030, at a CAGR of 5.5% during the forecast period. The major players operating in the OEM Insulation market include Covestro AG (Germany), Owens Corning Corp. (US), Rockwool International A/S (Denmark), Saint-Gobain ISOVER (France), Knauf Insulation (US), Huntsman Corporation (US), Armacell International S.A. (Luxembourg), Aspen Aerogels Inc. (US), Johns Manville Corporation (US), Kingspan Group (Ireland), China Jushi Co. Ltd. (China), and Rogers Corporation (US) are the key players in the market.
- Published: February 2025
- Price: $ 4950
- TOC Available:
-
Thermally Conductive Filler Dispersants Market by Dispersant Structure Type (Silicone-Based, Non-Silicone Based), Filler Material (Ceramic, Metal, Carbon-Based), Application (Thermal Insulation Glue), End-Use Industry, & Region - Global Forecast to 2028
The thermally conductive filler dispersants market is expected to grow from USD 278 million in 2023 to USD 397 million by 2028, at a CAGR of 7.4% during the forecast period. New product launches and expansions are the major growth strategies adopted by the key players in the market. The key global players in the thermally conductive filler dispersants market include are BYK (Germany), Shin-Etsu Chemical (Japan), Dow Chemical Company (US), JNC Corporation (Japan), Momentive Performance Materials (US), Kusumoto Chemicals (Japan), Evonik (Germany), Croda International (UK), Lubrizol Corporation (US), and Wacker Chemie (Germany) among others.
- Published: August 2023
- Price: $ 4950
- TOC Available:
Records 1 to 10 of 50
