Here are relevant reports on : welding-materials-market
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Welding Materials Market by Type (Electrodes & Filler Materials, Fluxes & Wires, Gases), Technology (Arc, Resistance, Oxy-Fuel Welding), End-use Industry (Transportation, Building & Construction, Heavy Industries), and Region - Global Forecast to 2030
The welding materials market is expected to grow from USD 18.86 billion in 2025 to USD 22.53 billion by 2030, at a CAGR of 3.62% during the forecast period. The report profiles key companies including Air Liquide (France), Air Products Inc. (US), ESAB (US), Illinois Tool Works Inc. (US), Linde plc (Germany), Lincoln Electric Holdings, Inc. (US), Ador Welding (India), Tianjin Bridge Welding Materials Group Co., Ltd. (China), Kobe Steel, Ltd. (Japan), and voestalpine AG (Austria). These players have adopted various growth strategies to expand their global presence and increase their market share.
- Published: September 2025
- Price: $ 4950
- TOC Available:
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Robotic Welding Market by Type (Spot Welding Robots, Arc Welding Robots), Payload (>150 kilograms, 50-150 kilograms), End user (Automotive and Transportation, Electrical and Electronics), Geography (2025-2030)
The Robotic Welding Market Size is expected to grow from USD 10.38 billion in 2025 to USD 16.87 billion by 2030, at a CAGR of 10.2% during the forecast period. FANUC Corporation (Japan), YASKAWA Electric Corporation (Japan), KUKA AG (Germany), ABB (Switzerland), Kawasaki Heavy Industries, Ltd. (Japan), Panasonic Corporation (Japan), DAIHEN Corporation (Japan), NACHI-FUJIKOSHI CORP. (Japan), Comau S.p.A. (Italy), and Hyundai Robotics (South Korea) are some of the key players in the robotic welding market.
- Published: May 2021
- Price: $ 4950
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Friction Stir Welding Market by Equipment Type (Mobile and Fixed Friction Stir Welding), by Industry (Automotive, Aerospace, Railway, Shipbuilding) and by Region – Global Forecast to 2030
The major players in the global Friction Stir Welding Market
- Published: January 2026
- Price: $ 4950
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Advanced Magnetic Materials Market by Type (Permanent Magnet Materials, Semi-Hard Magnetic Materials, Soft Magnetic Materials), End-Use Industry (Automotive, Electronics, Industrial, Power Generation, Medical), And Region - Global Forecast to 2028
The advanced magnetic materials market is expected to grow from USD 24.2 billion in 2023 to USD 38.2 billion by 2028, at a CAGR of 9.5% during the forecast period. Some of the key players in the global advanced magnetic materials market are such as Hitachi Metals Ltd. (Japan), TDK Corporation (Japan), Daido Steel Ltd. (Japan), Shin-Etsu Chemical Co. Ltd. (Japan), Arnold magnetic Technologies (US), Anhui Sinomag Technology Co. Ltd. (China), Neo (Canada), Ningbo Yunsheng Co. Ltd. (China), Vacuumschmelze GmbH & Co. KG (Germany).
- Published: January 2024
- Price: $ 4950
- TOC Available:
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Welding Equipment, Accessories, and Consumables Market by Equipment (Electrode & Filler Metal Equipment, Oxy-Fuel Gas Equipment), Accessory (Fume Extraction Equipment, Gas Flow Meter, Protective Gear), Consumable (Electrodes & Filler Materials, Fluxes & Wires Gases), Technology (Arc Welding, Oxy-Fuel Welding), End-use Industry (General Fabrication, Automotive, Construction), Region - Global Forecast to 2030
The welding equipment, accessories, and consumables market is expected to grow from USD 35.84 billion in 2025 to USD 42.14 billion by 2030, at a CAGR of 3.29% during the forecast period. The report profiles key companies, including Lincoln Electric Holdings, Inc. (US), ESAB (US), Air Liquide (France), Illinois Tool Works Inc. (US), Fronius International GmbH (Austria), and Kemppi Oy (Finland). These companies have adopted various growth strategies to expand their global reach and increase their market share.
- Published: September 2025
- Price: $ 4950
- TOC Available:
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Near Infrared Absorbing Materials Market by Material (Organic Materials, Inorganic Materials), Function (High Transparency, Absorption, Heat Resistance), Absorption Range (700-1000nm, 1000nm), End Use Industry, Region - Global Forecast to 2028
The near infrared absorbing materials market is expected to grow from USD 308 million in 2023 to USD 453 million by 2028, at a CAGR of 7.9% during the forecast period. The key players in this market Sumitomo Metal Mining Co., Ltd. (Japan), Nanophase Technologies Corporation (US), Heraeus Holding (Germany), Keeling & Walker (UK), Edmund Optics (US), Merck (US), 3M (US), (Japan), Resonac Holdings Corporation (Japan), Advanced nano products co ltd (South Korea), Nippon Shokubai Co., Ltd.(Japan).
- Published: July 2023
- Price: $ 4950
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Bookbinding Materials Market by Binding Type (Adhesive Bonded, Mechanically Bonded), Material Type (Paper Cover Materials, Leather, Adhesives, Cloth/Fabric/Spine Reinforcing Materials, Cover Boards), Application, & Region - Global Forecast to 2028
The bookbinding materials market is expected to grow from USD 8.5 billion in 2023 to USD 9.5 billion by 2028, at a CAGR of 2.3% during the forecast period. Henkel AG (Germany), H.B. Fuller (US), Arkema (US), The Dow Chemical Company (US), and UPM Global (Finland) are the key players in the global bookbinding materials market.
- Published: October 2023
- Price: $ 4950
- TOC Available:
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Multi-arm Robotic Welding Market by Type (Arc Welding, Spot welding, and laser welding), By End users (Automotive, Electrical & Electronics Industry, Heavy Machinery Industry, Metals Industry and Others) & by Geography- Global Trends and Forecasts to 2019
This report estimates multi-arm robotic welding market, in terms of market size. The market has been segmented by type (Arc Welding, Spot Welding and Laser Welding), by end-users (Automotive, Electrical & Electronics Industry, Heavy Machinery Industry, Metals Industry and Others) and regions (Americas, Europe, Asia-Pacific, and the Middle East & Africa).
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029
The semiconductor & ic packaging materials market is expected to grow from USD 43.9 billion in 2024 to USD 70.9 billion by 2029, at a CAGR of 10.1% during the forecast period. The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc.
- Published: March 2024
- Price: $ 4950
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Thermal Interface Materials Market by Material (Silicone, Epoxy,Polymide), Type (Greases & Adhesives, Tapes & Films, Gap Fillers, Phase Change Materials), Application (Computers, Telecom, Consumer Durables) & Region - Global Forecast to 2029
The thermal interface materials market is expected to grow from USD 3.56 billion in 2024 to USD 5.64 billion by 2029, at a CAGR of 9.7% during the forecast period. The report profiles key players such as Honeywell International Inc. (US), 3M (US), Henkel AG & Co. KGaA (Germany), Parker Hannifin Corporation (US), DOW (US), Laird Technologies Inc. (US), Momentive (US), Wakefield Thermal Inc. (US), Indium Corporation (US), and Zalma Tech Co. Ltd. (South Korea).
- Published: January 2025
- Price: $ 4950
- TOC Available:
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