Here are relevant reports on : touch-screen-ic-market
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Automotive Semiconductor Market by Discrete Power Device, Analog IC, Light Commercial Vehicle (LCV), Heavy Commercial Vehicle (HCV), Internal Combustion Engine (ICE), Electric, Powertrain and ADAS & Autonomous Driving - Global Forecast to 2030
The automotive semiconductor market is expected to grow from USD 77.42 billion in 2025 to USD 133.05 billion by 2030, at a compound annual growth rate (CAGR) of 11.4% during the forecast period. The Key Players Infineon Technologies AG (Germany), NXP Semiconductors (Netherlands), STMicroelectronics (Switzerland), Texas Instruments Incorporated (US), Renesas Electronics Corporation (Japan), Semiconductor Components Industries, LLC (US), Robert Bosch GmbH (Germany), Qualcomm Technologies, Inc. (US), Analog Devices, Inc. (US), and Microchip Technology Inc. (US).
- Published: October 2025
- Price: $ 4950
- TOC Available:
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Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)
The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.
- Published: April 2012
- Price: $ 4950
- TOC Available:
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029
The semiconductor & ic packaging materials market is expected to grow from USD 43.9 billion in 2024 to USD 70.9 billion by 2029, at a CAGR of 10.1% during the forecast period. The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc.
- Published: March 2024
- Price: $ 4950
- TOC Available:
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Thermal Conductive Adhesives Market by Type (Silicones, Epoxies, Polyurethanes, and Acrylics), Application (Battery Thermal, Heat Sink, IC Packaging Heat Conduction, LED Lighting Thermal, Thermal Material Potting) - Global Forecast to 2022
Thermal adhesive is a type of thermally conductive glue used for electronic components and heatsinks. Thermal adhesive is similar to thermal paste in that it is used for transferring heat from one surface to another. It is commonly used to bond heatsinks to motherboard chipsets and video card processors where there are no mounting holes to clamp a heatsink down. Thermally conductive adhesives offer superior heat dissipation for a wide range of electronic applications. Both one and two component systems are used. They include epoxies, silicones and elastomeric products. Thermally conductive adhesive are also used for managing heat in next-generation automotive applications, including power electronics for electric and hybrid electric vehicles.
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Automotive Temperature Sensor Market by Application (Engine, Exhaust, Seats), Product (Thermocouple, MEMS, IC Sensor), Usage, Technology, EV Application (Battery, Motor), EV Charging Tech (Wired, Wireless), Vehicle, and Region - Global Forecast to 2025
The automotive temperature sensor market is valued at USD 7.21 Billion in 2016 and is projected to grow at a CAGR of 5.58% during the forecast period, to reach USD 11.89 Billion by 2025. The report profiles the major players in the temperature sensor market. The key players in this market are Robert Bosch (Germany), Continental (Germany), Panasonic (Japan), Delphi (UK), TDK Corporation (Japan), Sensata (US), Texas Instruments (US), NXP (Netherlands), Analog Devices (US), and Microchip (US) among others.
- Published: February 2018
- Price: $ 4950
- TOC Available:
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Mammography Detector Market by type (analog and digital detectors) by technology (DC and IC detectors) by end-user (hospitals, diagnostic imaging centers, and others) and by Region - Global Forecast to 2030
The major players in the global Mammography Detector Market
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Wafer Cleaning, Deposition, Assembly & Packaging, Dicing, Metrology, Bonding, Wafer Testing/IC Testing, Memory, Logic, Discrete, Analog - Global Forecast to 2032
The global semiconductor manufacturing equipment market is expected to grow from USD 166.35 billion in 2025 to USD 344.36 billion by 2032, at a compound annual growth rate (CAGR) of 11.0%. during the forecast period. The Key Players Applied Materials, Inc. (US), ASML (Netherlands), LAM RESEARCH CORPORATION (US), Tokyo Electron Limited (Japan), and KLA Corporation (US).
- Published: November 2025
- Price: $ 4950
- TOC Available:
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Space Power Electronics Market by Device Type (Power Discrete, Power Module, Power IC), Application (Satellites, Spacecraft & Launch Vehicles, Space Stations, Rovers), Platform, Voltage, Current, Material and Region - Global Forecast to 2026
The Space power electronics market is projected to reach USD 435 million by 2026, at a CAGR of 16.2% during the forecast period. The space power electronics market is dominated by a few globally established players such as Infineon Technologies (Germany), Texas Instrument Incorporated US), STMicroelectronics (Switzerland), Onsemi (US), Renesas Electronics Corporation (Japan), among others.
- Published: April 2022
- Price: $ 4950
- TOC Available:
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IoT Technology Market by Node Component (Sensor, Memory Device, Connectivity IC, Processor, Logic Devices), Software Solution (Remote Monitoring, Data Management), Platform, Service, End-use Application, Geography - Global Forecast to 2030
The IoT technology market is expected to grow from USD 959.30 billion in 2025 to USD 1,148.62 billion by 2030, at a compound annual growth rate (CAGR) of 3.7% during the forecast period. The Key Players Intel Corporation (US), Qualcomm (US), Texas Instruments Incorporated (US), Cisco Systems, Inc. (US), Hewlett Packard Enterprise (US), IBM (US), STMicroelectronics (Switzerland), Microsoft, PTC Inc. (US), and Amazon Web Services (US).
- Published: October 2025
- Price: $ 4950
- TOC Available:
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Floating Power Plant Market by Power Source (Non-Renewable (Gas Turbines, IC Engines), Renewable (Solar Panels, Solar Floating Structure, Wind Turbines, Wind Substructure)), Capacity, and Region - Global Forecast to 2022
The global floating power plant market is expected to grow from an estimated USD 889.6 Million in 2017 to USD 1,440.1 Million by 2022, at a CAGR of 10.11%, from 2017 to 2022. To provide an in-depth understanding of the competitive landscape, the report includes the profiles of companies, such as MAN Diesel & Turbo SE (Germany), Mitsubishi Corporation (Japan), Wartsila (Finland), General Electric Company (U.S.), Siemens AG (Germany), Caterpillar, Inc. (U.S.), Ciel & Terre International (France), Floating Power Plant A/S (Denmark), Ideol (France), Kyocera Corporation (Japan), Principle Power, Inc.(U.S.), Upsolar (Hong Kong), Vikram Solar Pvt., Ltd. (India), Yingli Solar (China), and SeaTwirl AB (Sweden), among others. The dominant players are trying to gain a foothold in developing economies and are adopting various methods to grab the market share.
- Published: August 2017
- Price: $ 4950
- TOC Available:
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