Here are relevant reports on : high-density-interconnect-market
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Ethylene Vinyl Acetate Market by Type (Very low-density, Low-density, Medium-density, and High-density EVA), End-use Industry (Photovoltaic Panels, Footwear & Foams, Packaging, Agriculture), Application, and Region - Global Forecast to 2026
The ethylene vinyl acetate market is expected to grow from USD 9.7 Billion in 2021 to USD 13.6 Billion by 2026, at a compound annual growth rate (CAGR) of 6.8% during the forecast period.ExxonMobil Corporation (US), Dow Inc. (US), SIPCHEM (Saudi Arabia), Formosa Plastics Corporation (Taiwan),
- Published: September 2021
- Price: $ 4950
- TOC Available:
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Wi-Fi Market (Wi-Fi 5, Wi-Fi 6/6E, Wi-Fi 7), Density (High Density, Medium Density, Low Density), Deployment (indoor, outdoor), Solution (Access Point, Router, Controller, Network Management, Analytics & Monitoring, Security) - Global Forecast to 2029
The Wi-Fi market is projected to reach USD 45.12 billion by 2029 at a Compound Annual Growth Rate (CAGR) of 15.4% during the forecast period. The major vendors covered in the Wi-Fi market are Cisco Systems (US), HPE (US), NETGEAR (US), Extreme Networks (US), Juniper Networks (US), Fortinet (US), CommScope (US), Alcatel-Lucent Enterprise (France), TP-Link (China), Broadcom (US), Comcast Business (US), Vodafone (UK), Telstra (Australia), Fujitsu (Japan), AT&T (US), Huawei (China), Ubiquiti Networks ( US), D-Link (Taiwan), Orange Business Services (France), Keysight Technologies (US), Lever Technology Group (UK), Redway Networks (UK), Cambium Networks (US), ADB Global (Switzerland), Actiontec Electronics (US), SDMC Technology (China), Edgewater Wireless (Canada), Agile Content (Spain). These players have adopted various growth strategies, such as partnerships, agreements and collaborations, new product launches, enhancements, and acquisitions to expand their footprint in the Wi-Fi market.
- Published: January 2025
- Price: $ 4950
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Black Masterbatch Market by Carrier Resin (Polypropylene, Linear Low-Density Polyethylene, Low-Density Polyethylene, High-Density Polyethylene, Polyethylene Terephthalate, Polyvinyl Chloride, Polystyrene, Polyamide), End-use Industry (Automotive, Packaging, Infrastructure, Electrical & Electronics, Consumer Goods, Agriculture, Fibers, and Other End-use Industries), by Type (Standard Black Masterbatch, High Jetness Black Masterbatch, UV-Resistant Black Masterbatch, Conductive Black Masterbatch, and Recycled Polymer Compatible Black Masterbatch), and Region - Global Forecasts to 2030
The black masterbatch market is expected to grow from USD 2,830.3 million in 2025 to USD 3,606.3 million by 2030, at a CAGR of 4.97% during the forecast period. The key players profiled in the report include Avient Corporation (US), LyondellBasell Industries Holdings B.V. (US), Ampacet Corporation (US), Cabot Corporation (US), Plastiblends (India), Hubron International (UK), Tosaf (Israel), Blend Colours Private Limited (India), RTP Company (US), and Plastika Kritis S.A. (Greece).
- Published: November 2025
- Price: $ 4950
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AI Infrastructure Market by Offerings (Compute (GPU, CPU, FPGA), Memory (DDR, HBM), Network (NIC/Network Adapters, Interconnect), Storage, Software), Function (Training, Inference), Deployment (On-premises, Cloud, Hybrid) – Global Forecast to 2030
The AI Infrastructure market is expected to grow from USD 135.81 billion in 2024 to USD 394.46 billion by 2030, at a compound annual growth rate (CAGR) of 19.4% during the forecast period.The key players NVIDIA Corporation (US), Advanced Micro Devices, Inc. (US), SK HYNIX INC. (South Korea), SAMSUNG (South Korea), Micron Technology, Inc. (US), Intel Corporation (US), Google (US), Amazon Web Services, Inc. (US), Tesla (US), Microsoft (US), Meta (US), Graphcore (UK), Groq, Inc. (US), Shanghai BiRen Technology Co., Ltd. (China), Cerebras (US).
- Published: November 2024
- Price: $ 4950
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Data Center Interconnect Market by Type [Products (Packet Switching Network, Optical DCI), Software, Services (Professional, Managed)], Application (Real-time Disaster Recovery & Business Continuity, Workload & Data Mobility) - Global Forecast to 2030
The global data center interconnect market is expected to grow from USD 15.38 billion in 2025 to USD 25.89 billion by 2030, at a compound annual growth rate (CAGR) of 11.0% during the forecast period. The Key Players Ciena Corporation (US), Huawei Technologies Co., Ltd. (China), Cisco Systems, Inc. (US), Nokia (Finland), and Juniper Networks, Inc. (US).
- Published: August 2025
- Price: $ 4950
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Interconnects and Passive Components Market by Passive Components (Resistor, Capacitor, Inductor, Transformer, and Diode), Interconnect Type (PCB, Connector, Switch, Relay, Adapter, Terminal, Splice, and Socket), Application, and Region - Global Forecast to 2022
According to the MarketsandMarkets forecast, the interconnects and passive components market is expected to be valued at USD 187.55 Billion by 2022, growing at a CAGR of 4.41% between 2017 and 2022. The growth of the interconnects and passive components market is attributed to advancements in the industrial M2M communication technology and rising industrial automations, increasing demand for miniaturized and high-performance electronic devices, proliferation of automotive infotainment and consumer electronics, and high demand for passive component and interconnects in computing, communication and consumer electronics (3C) applications.
- Published: March 2017
- Price: $ 4950
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Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography - Global Forecast to 2027
The molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027, at a compound annual growth rate (CAGR) of 22.9% during the forecast period.The key players device (MID) market and analyzes their market shares. Players profiled in this report are Molex (US), TE Connectivity (Switzerland), Amphenol Corporation (US), LPKF Laser & Electronics (Germany), and Taoglas (Dublin), Harting (Germany), Arlington Plating Company (US), MID Solutions (Germany), 2E Mechatronic (Germany), KYOCERA AVX (US) and Johnan (Japan), Teprosa(Germany), Sunway Communication(China), Axon Cable(France), S2P (France), Suzhou Cicor Technology (China), TactoTek (Finland), DuraTech (US), Tekra (US), Yomura Technologies (Taiwan), MacDermid Alpha Electronics (US), Galtronics (US), Yazaki Corporation (Japan), Chogori Technology (Japan), Suzhou Zeeteq Electronics (Japan), Toyo Connectors (Japan) and SINOPLAST (China).
- Published: August 2022
- Price: $ 4950
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Telecom Cloud Billing Market by Type of Billing (Convergent, Prepaid, Postpaid, Interconnect), Cloud Platform, Deployment, End User, Service, Rate of Charging Mode, and Region - Global Forecast to 2021
The telecom cloud billing market size is expected to grow from USD 2.49 Billion in 2016 to USD 8.22 Billion by 2021, at a Compound Annual Growth Rate (CAGR) of 27.0% from 2016 to 2021. The telecom billing solutions include a wide array of activities ranging from the process of usage tracking for voice and data, aggregating, levying charges upon respective tariffs, generating invoices to the customers, enabling the customer relationship management through the various cloud based solutions on public, private, or hybrid cloud by the vendor (Operations Support Systems/Business Support System (OSS/BSS) provider) for various Mobile Network Operators (MNOs) all enabled by multi-tenancy.
- Published: January 2017
- Price: $ 4950
- TOC Available:
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Polyethylene (PE) Foams Market by Type (Non-XLPE and XLPE), Density (LDPE,HDPE), End-Use Application (Protective Packaging, Automotive, Building & Construction, Footwear, Sports & Recreational, Medical), and Region - Global Forecast to 2026
The polyethylene foams market is expected to grow from USD 3.6 billion in 2021 to USD 4.8 billion by 2026, at a compound annual growth rate (CAGR) of 6.0% during the forecast period.The key players Armacell (Luxembourg), JSP ( Japan), Sealed Air (US), Zotefoams PLC (UK), and Recticel NV (Belgium)
- Published: November 2021
- Price: $ 4950
- TOC Available:
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Military Battery Market Size, Share, Trends & Growth Analysis by Type (Rechargeable, Non-rechargeable), Installation (OEM, Aftermarket), Application (Propulsion, Non-propulsion), Platform (Ground, Airborne, Marine), Composition, Voltage, Power Density and Region
The military battery market is projected to reach USD 1.6 billion by 2027, at a CAGR of 4.1% during the forecast period. Some of the key players profiled in the military battery market report include EnerSys (US), GS Yuasa International Ltd (Japan), Saft (France), Exide Industries (India), and EaglePicher Technologies (US). The players are mostly engaged in new product launches & developments and having a strong global presence will enhance their position in the military battery market. These players are primarily focusing on entering new markets by launching technologically advanced and cost-effective platforms and infrastructure. Apart from new product launches & developments, these players also adopted the partnerships contracts, & agreements strategy.
- Published: May 2022
- Price: $ 4950
- TOC Available:
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