Here are relevant reports on : steer-by-wire-market
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Electrical and Electronic Adhesive Market by Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curable Adhesives) & by Application (Circuit Boards, Wire Cabling, Potting and Encapsulation, Wire Coatings, Audio Component Assembling, & Others) – Global forecasts to 2020
This study estimates the global electrical & electronics adhesives market for 2013 and projects the expected demand of the same by 2019. This market research study provides a detailed qualitative and quantitative analysis of the global electrical & electronics adhesives market. It also includes a comprehensive review of major market drivers, restraints, opportunities, winning imperatives, challenges, and key issues in the market.
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Aircraft Wire and Cable Market Size, Share & Industry Growth Analysis Report by Type (Wire, Harness, Cable), Application (Power Transfer, Data Transfer, Flight Control System, Avionics, Lighting), Aircraft Type, Conductor Material, Insulation Type, End User, and Geography- Global Growth Driver and Industry Forecast to 2026
The global market for aircraft wire and cable size is projected to reach USD 1.9 billion by 2026, at a CAGR of 5.7% during the forecast period. The aircraft wire and cable market is dominated by a few globally established players such as Amphenol Corporation (US), Carlisle Interconnect Technologies (US), Collins Aerospace (US), TE Connectivity (Switzerland), and Nexans SA. (France).
- Published: January 2022
- Price: $ 4950
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Shipboard Cables and Wires Market by Ship Type (Commercial, Defense) by Voltage (Low Voltage, Medium Voltage, High Voltage) by Type (Cable, Wire), By End Use (Newbuild & Linefit, Retrofit) by Application (Communication, Navigation Systems, Power Distributions, Others). by Material (Copper, Aluminium) and Region - Global Forecast To 2030
Major players in the Shipboard Cables and Wires Market Prysmian Group (Italy), Nexans (France), General Cable (US), Furukawa Electric Co., Ltd. (Japan), LS Cable & System Ltd. (South Korea), Belden Inc. (US), Leoni AG (Germany), NKT A/S (Denmark)
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Wire-to-Board Connector Market by Pitch Size (0.8, 1.0, 1.25, 1.27, 2.0, 2.5, 2.54, 3.0, 3.3, 3.96, 5, 7.92, and 10.16), Style (Accessory, Header, Housing, Plug, Receptacle, and Socket), Application, and Geography - Global Forecast to 2022
The wire-to-board connector market was valued at USD 3.55 Billion in 2015 and is expected to reach USD 4.73 Billion by 2022, at a CAGR of 4.18% between 2016 and 2022. The growth of the wire-to-board connector market is driven by the factors such as the demand for high-speed connectivity and transmission bandwidth and low and stable raw material cost required for the manufacturing.
- Published: November 2016
- Price: $ 4950
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Global Telemetry Market by Application (Healthcare, Telematics, Energy Utilities, Retail, Automation, Logistics, Oil & Gas, Aerospace & Defense, Agriculture, Wildlife, Hydrography, Oceanography), Technology (Wire Link, Wireless, Data Loggers), Sensors, Components, & Geography - Forecasts & Analysis (2014–2020)
The global telemetry market is estimated to be $109.54 Billion in 2014, and is expected to reach $243 Billion by 2020, registering a CAGR of 14.20%. The geographical analysis contains an in-depth study of telemetry systems in the American, European, Asia-Pacific, the Middle Eastern, and the African regions. The detailed analysis of the countries in these regions is covered to give a detailed picture of the supply and demand dynamics over the forecast period. The sections and sub-segments in the report would contain drivers, restraints, opportunities, challenges, and current market trends that are expected to revolutionize the telemetry market.
- Published: January 2015
- Price: $ 4950
- TOC Available:
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Wire and Cable Management Market by Cable Type (Power Cables, Communication Wires & Cables), Material (Metallic, Non-metallic), Installation (Overhead, Underground, Submarine), End User (Industrial End User, Commercial End User, Residential End User), Product, and Region - Global Forecast to 2030
The global wire and cable management market reached a size of USD 26.44 Billion in 2025; it is projected to reach USD 39.55 Billion by 2050, growing at a CAGR of 8.4%, from 2025 to 2030. Increasing investments in infrastructure development activities, high demand from IT facilities and data centers, and growing urbanization in the developing regions of Asia Pacific the Middle East and Africa are driving the market for wire and cable management. To enable an in-depth understanding of the competitive landscape, the report includes the profiles of some of the top players in the wire and cable management market such as ABB (Switzerland), Legrand (France), Atkore (US), Eaton (Ireland), and nVent (UK).
- Published: September 2025
- Price: $ 4950
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Solder Materials Market by Type (With Lead, Lead-Free), Product (Bar, Wire, Paste, Flux), Process (Wave/Reflow, Screen Printing, Robotic, Laser), End-Use Industry (Consumer Electronics, Automotive, Industrial) and Region - Global Forecast to 2027
The sprinkler irrigation systems market is expected to grow from USD 4.1 billion in 2022 to USD 4.9 billion by 2027, at a compound annual growth rate (CAGR) of 3.8% during the forecast period.The key players Element Solutions, Inc. (US), Lucas Milhaupt Inc. (US), Qualitek International Inc. (US), Fusion Inc. (US), Henkel AG & Co. KGaA (Germany), Senju Metal Industries Co. Ltd. (Japan), Koki Company Limited (Japan), Indium Corporation (US).
- Published: July 2022
- Price: $ 4950
- TOC Available:
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Long Steel Market by Process (Basic Oxygen Furnace, Electric Arc Furnace), Product Type (Rebar, Merchant Bar, Wire Rod, Rail) End-Use Industry (Construction, Infrastructure, Others), and Region (NA, EUROPE, APAC, MEA, SA) - Global Forecast to 2025
The long steel market is expected to grow from USD 527.0 billion in 2020 to USD 636.7 billion by 2025 at a compound annual growth rate (CAGR) of 3.9% during the forecast period.Companies such as Arcelor Mittal (Germany), Gerdau S.A. (Brazil), Nippon Steel & Sumitomo Metal Corporation (Japan), POSCO (South Korea), and Nucor Corporation (US) are the major players in the long steel market. These players have been adopting strategies such as contracts, expansion, new product launches, acquisitions, and agreements that have helped them expand their businesses in untapped and potential markets.
- Published: May 2020
- Price: $ 4950
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Polyimide Varnish Market by Type (Normal Heat Resistant, High Heat Resistant), Application (Semiconductor Components, Wire Coatings, Avionics, Batteries, Display and Others), End-use Industry (Consumer Electronics, IT & Telecom, Aerospace & Defense, Automotive, Solar and Others) and Region - Global Forecast to 2030
The global polyimide varnish market is projected to grow from USD 122 million in 2022 to USD 186 million by 2030, at a CAGR of 6.2% during the forecast period. The polyimide varnish market has grown considerably in recent years and is expected to grow at a higher rate in the coming years. The primary reasons for the increasing demand for polyimide varnish is the growth of the consumer electronics along with demand for temperature-resistant electronic components used in aerospace & defense, automotive, and other industries.
- Published: January 2026
- Price: $ 4950
- TOC Available:
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System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
- Published: November 2017
- Price: $ 4950
- TOC Available:
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