Here are relevant reports on : temporary-bonding-and-debonding-market
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Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027
The thin wafer market is expected to grow from USD 11.4 billion in 2022 to USD 20.6 billion by 2027, at a compound annual growth rate (CAGR) of 12.5% during the forecast period.The Key Players Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), and Applied Materials (US). Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US).
- Published: September 2022
- Price: $ 4950
- TOC Available:
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Glass Bonding Adhesives Market by Type (UV Curable Cyanoacrylate, Silicone, UV Curable Epoxy, Polyurethane), End-Use Industry (Furniture, Electronics, Medical, Transportation, Industrial Assembly), and Region - Global Forecast to 2021
The global glass bonding adhesives market is projected to reach USD 1.76 billion by 2021 at a CAGR of 7.4%. The glass bonding adhesives market has witnessed significant growth in the recent years, and this growth is projected to persist in the coming years. Glass bonding adhesives, due to their characteristic properties such as low temperature resistance, high bond strength, excellent adhesion property, and low thermal expansion, are used in a wide range of end-use industries such as furniture, medical, electronics, industrial assembly, transportation, and others.
- Published: November 2016
- Price: $ 4950
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Friction Bonding Adhesive Market by Type (Epoxy Based Adhesive, Polyurethane Adhesive, Other Types), End use Industry (Automotive, Aerospace, Industrial, Other End-use Industries), and Region (2025-2030)
The global friction bonding adhesive market size is projected to reach USD 2.5 billion by 2030 from USD 1.8 Billion in 2024 at a CAGR of 5.8% between 2025 and 2030. Henkel Ag & Co. KGAA (Germany), H.B. Fuller Company (US), Bostik (France), 3M Company (US), Sika Ag (Switzerland), Eastman Chemical (US) are the key players in the global friction bonding adhesive market.
- Published: July 2026
- Price: $ 4950
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Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024
The Die Bonder Equipment Market is expected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% during the forecast period. BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France) are the key players in the die bonder equipment market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to increase their market share.
- Published: November 2019
- Price: $ 4950
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Bonding Films Market by Type (Epoxy, Acrylic, Polyurethane), Technology (Thermally Cured, Pressure Cured), End-Use Industry (Electrical & Electronics, Transportation, Packaging), Region - Global Forecast to 2022
The bonding films market was valued at USD 613.5 Million in 2016 and is projected to reach USD 985.5 Million by 2022, at a CAGR of 8.2% between 2017 and 2022. In this report, 2016 has been considered as the base year and the forecast period has been considered from 2017 to 2022. Henkel AG & Co. KGaA (Germany), 3M (US), Cytec Solvay Group (Belgium), Hitachi Chemical Co., Ltd. (Japan), Arkema S.A. (France), H.B. Fuller (US), Hexcel Corporation (US), Gurit (Switzerland), DuPont (US), Rogers Corporation (US), etc. are the key players operating in the bonding films market.
- Published: August 2017
- Price: $ 4950
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Fiber Bonding Adhesives Market by Type (Acrylic, Epoxy, Polyurethane, and Others), by End-Use Industry (Aerospace, Automotive, Industrial, Medical, and Others) - Global Trends & Forecast to 2020
This study estimates the global market of composite bonding adhesives by the end of 2020. This market research study provides detailed qualitative and quantitative analysis of the global composite bonding adhesives market. The report provides a comprehensive review of major market drivers, restraints, opportunities, winning imperatives, challenges, and key issues in the market. The market is further segmented and forecasted for major regions, North America, Western Europe, Asia-Pacific and Rest of the World. Major countries with the market volumes and revenues are covered for each of the regions. Competitive scenario with key growth strategies of various market players in the market has been discussed in detail. The top players of the industry are profiled in detail with their recent developments.
- Published: July 2026
- Price: $ 4950
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Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Wafer Cleaning, Deposition, Assembly & Packaging, Dicing, Metrology, Bonding, Wafer Testing/IC Testing, Memory, Logic, Discrete, Analog - Global Forecast to 2032
The global semiconductor manufacturing equipment market is expected to grow from USD 166.35 billion in 2025 to USD 344.36 billion by 2032, at a compound annual growth rate (CAGR) of 11.0%. during the forecast period. The Key Players Applied Materials, Inc. (US), ASML (Netherlands), LAM RESEARCH CORPORATION (US), Tokyo Electron Limited (Japan), and KLA Corporation (US).
- Published: November 2025
- Price: $ 4950
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Stucco Market by Material (Cement, Aggregates, Admixture, Plasticizers, Bonding Agent), Type (Traditional, Insulated), Base (Concrete, Masonry, Tile), End-use (Residential & Non-residential), and Region- Global forecast to 2024
The stucco market is expected to grow from USD 10.9 billion in 2019 to USD 13.4 billion by 2024, at a compound annual growth rate (CAGR) of 4.2% during the forecast period.Key players such as Sika AG (Switzerland) and The Quikrete Companies (US) adopted acquisitions and new product developments to strengthen their product portfolios, expand their market presence, and enhance their growth prospects in the stucco market.
- Published: February 2020
- Price: $ 4950
- TOC Available:
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Metallic Powder Coatings Market by Process Type (Bonding, Blending, Extrusion),Pigment Type (Aluminum, Mica), Resin Type (Polyester, Hybrid, Epoxy, Polyurethane, Others), End-use Industry, and Region - Global Forecast to 2025
The global metallic powder coatings market is expected to grow from USD 2.3 billion in 2020 to USD 3.3 billion by 2025, at a compound annual growth rate (CAGR) of 7.5% during the forecast period.AkzoNobel N.V. (Netherlands), Axalta Coating Systems, LLC (US), Jotun A/S (Norway), PPG Industries (US), The Sherwin-Williams Company (US), and Tiger Coatings GmbH & Co. KG (Austria).
- Published: February 2021
- Price: $ 4950
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Bonding Sheet Market by Adhesive Material (Polyesters, Polyimides, Acrylics, Modified Epoxies), Application (Electronics/Optoelectronics, Telecommunication/5G Communication, Automotive, Building & Construction and Region - Global Forecast to 2027
The global bonding sheet market is expected to grow from USD 386 million in 2022 to USD 551 million by 2027, at a compound annual growth rate (CAGR) of 7.4% during the forecast period.The Major players Arisawa Manufacturing Co. (Japan), DuPont (US), NIKKAN INDUSTRIES Co., Ltd. (Japan), Dexerials Corporation (Japan), Nitto Denko Corporation (Japan), Showa Denko Materials Co., Ltd. (Japan), Toray Industries, Inc. (Japan), NAMICS Corporation (Japan), and Shin-Etsu Polymer Co., Ltd. (Japan)
- Published: June 2022
- Price: $ 4950
- TOC Available:
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