Here are relevant reports on : lumber-core-market
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System-on-Chip (SoC) Market by Core Count (Single-core, Dual-core, Quad-core, Hexa-core, Octa-core), Core Architecture (ARM, X86, RISC-V), Device (Smartphone, Tablet, Laptop, Smart TV & STB, Infotainment System, Router, Gateway) - Global Forecast to 2029
The System-on-Chip (SoC) market size is expected to grow from USD 138.46 billion in 2024 to USD 205.97 billion by 2029, at a compound annual growth rate (CAGR) of 8.3% during the forecast period.The kay players Qualcomm Technologies, Inc. (US), MediaTek Inc. (Taiwan), Samsung (South Korea), Apple Inc. (US), Broadcom (US), Intel Corporation (US), Advanced Micro Devices, Inc. (US), NVIDIA Corporation (US), HiSilicon (China), Microchip Technology Inc. (US).
- Published: January 2025
- Price: $ 4950
- TOC Available:
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Microencapsulation Market by Shell Material (Polymers, Gums & Resins, Lipids, Carbohydrates, Proteins), Technology, Core Material, Core Material Form, End-Use Industry, Functionality, and Region - Global Forecast to 2029
The microencapsulation market is projected to reach USD 24.07 billion by 2029, at a CAGR of 9.4% during the forecast period. The report profiles key players such as BASF (Germany), FrieslandCampina (Netherlands), dsm-firmenich (Switzerland), Givaudan (Switzerland), International Flavors & Fragrances Inc. (US), Sensient Technologies Corporation (US), Balchem Corp. (New Jersey), Ingredion (US), Kerry Group plc (Ireland), Symrise (Germany), DuPont (US), Cargill Incorporated (US), Syngenta (Switzerland), Lycored (New Jersey), Koehler Group (US).
- Published: January 2025
- Price: $ 4950
- TOC Available:
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Application Processor Market by Device Type (Mobile Phones, PC Tablets, Smart Wearables, and Automotive ADAS & Infotainment Systems), Core Type (Octa-core, Hexa-core, Quad-core, Dual-core, and Single-core), Industry, and Geography - Global Forecast to 2035
The application processor market is expected to be valued at USD 29.0 billion in 2018 and is likely to reach USD 38.2 billion by 2023, at a CAGR of 5.63% during the forecast period. High demand for application processors from the consumer electronics industry is one of the major factors driving the growth of the market. Moreover, these processors are also increasingly being used in the automotive industry in automotive infotainment systems and ADAS systems; this factor is also expected to considerably boost the growth of the said market in the coming years. A few major players operating in the application processor market are Apple (US), Samsung Electronics (South Korea), Qualcomm (US), MediaTek (Taiwan), NXP Semiconductors (Netherlands), Texas Instruments (US), NVIDIA (US), Toshiba (Japan), and HiSilicon Technologies (China).
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Micro-Controllers Market, By Products (DSPs and IP-CORE chips), Technology, Application & Geography – 2018
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Core Materials Market by Type (Foam, Balsa, and Honeycomb), End- use Industry (Wind Energy, Marine, Aerospace & Defense, Automotive & Transportation, Construction & Industrial), and Region - Global Forecast to 2028
The core materials market is expected to grow from USD 1.6 billion in 2023 to USD 3.0 billion by 2028, at a CAGR of 13.5% during the forecast period. Prominent companies in the core material market include Gurit Holdings AG (Switzerland), Hexcel Corporation (US), 3A Composites (Switzerland), Evonik Industries AG (Germany), Armacell (Luxembourg), Diab Group (Sweden), The Gill Corporation (US), Euro Composites (Luxembourg), Changzhou Tiansheng New Materials Co., Ltd. (China), Plascore Inc. (US), and Toray Industries, Inc. (US).
- Published: March 2024
- Price: $ 4950
- TOC Available:
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Microcontrollers, DSP, & IP Core Chip Market by Type, Applications (Automotive & Transportation, Consumer Electronics, Industrial, Communications, Security, and Medical & Healthcare) and Geography (Americas, Europe, APAC & ROW) - Analysis & Forecast to 2014 – 2020
Microcontrollers, which are one of the most widely used component in industries such as automobile and consumer electronics, have seen tremendous improvements in recent years in terms of increased number of applications as well as developments in technology. Microcontrollers, DSPs, & IP-core chips market is expected to reach $41.69 billion by 2020, growing at a CAGR of 6.96% from 2014 to 2020.
- Published: July 2014
- Price: $ 4950
- TOC Available:
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qPCR Reagents Market by Detection (Dye-based, Probe-based), Packaging (qPCR Core Kits, Master Mixes), End User (Hospitals, Diagnostic Centers, Academia, Research Labs, CRO), Application (Diagnostic, Research, Forensic) - Global Forecast to 2020
The global qPCR reagents market size is projected to grow at a CAGR of 7.7%. Market growth can be attributed to factors such as rising patient population base for infectious diseases & genetic disorders, coupled with growing geriatric population, technological advancements in the life sciences sector, increasing public-private investments, funds, and grants for PCR-based research, and the successful completion of the human genome project. However, technical limitations associated with qPCR are restraining the growth of this market.
- Published: January 2016
- Price: $ 4950
- TOC Available:
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Honeycomb Core Materials Market by Type (Paper, Aluminum, Thermoplastic, Nomex), Application (Composites, Non-composites), End-use Industry (Aerospace & Defense, Packaging, Transportation, Construction & Infrastructure), Region - Global Forecast to 2022
The honeycomb core materials market was valued at USD 1.87 Billion in 2016 and is projected to reach USD 3.21 Billion by 2022, at a CAGR of 9.5% between 2017 and 2022. The increasing demand for lightweight, high strength, and environment-friendly packaging solutions is driving the growth of the honeycomb core materials market across the globe. Key players operational in the honeycomb core materials market include Honicel (Netherlands), Euro-Composites (Luxembourg), Argosy International (US), Grigeo (Lithuania), Plascore (US), Tubus Baer GmbH (Germany), Corinth. (Netherlands), Axxion (Netherlands), and Hexcel Corporation (US).
- Published: December 2017
- Price: $ 4950
- TOC Available:
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Asia Pacific Core Material Market by Type (Foam, Balsa, and Honeycomb), End-Use Industry (Wind Energy, Marine, Aerospace & Defense, Automotive & Transportation, Construction & Industrial), and Country - Forecast To 2030
The Asia Pacific core materials market is projected to reach USD 1.69 billion by 2030 from USD 0.84 billion in 2025, at a CAGR of 15.0%. The Key Players Materials Co. Ltd. (China), Toray Industries, Inc (Japan), Showa Aircraft Industry Co., Ltd (Japan), and Tccore Applied Honeycomb Technology Co., Ltd. (China), Dongying Horizon Composite Co., Ltd. (China), Zhejiang Youwei New Materials Co., Ltd. (China), Nagoya Core Co., Ltd. (Japan).
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Data Center Switch Market by Type (Core, Distribution, and Access), Technology (Ethernet, Fiber Channel, and InfiniBand), End User (Enterprise, Telecom, Government, and Cloud), Bandwidth, and Geography - Global Forecast to 2035
Some of the key factors driving the market growth are the need for simplified data center management and automation, high demand for cloud services, and surge in the internet multimedia content and web applications. Cisco (US), Arista Networks (US), Huawei (China), HPE (US), and Juniper Networks (US) are the major players included in the report with market share analysis. The report also covers various major contributors involved in the data center switch market. NEC (Japan), Lenovo (China), Mellanox Technologies (US), Extreme Networks (US), Fortinet (US), ZTE (China), D-Link (Taiwan), Silicom (Israel), QCT (Taiwan), Dell (US) are a few major companies in the data center switch market. Also, Bay Microsystems (US), Cumulus Networks (US), Edgecore Networks (Taiwan), Centec Networks (China), and H3C Technologies (China) are a few key contributors in the market.
- Published: March 2026
- Price: $ 4950
- TOC Available:
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