Here are relevant reports on : automotive-power-management-ics-market
-
Power Over Ethernet Solutions Market by Type (PSE Controllers & ICs, PD Controllers & ICs), Device Type (Power Sourcing Equipment, Powered Devices), Application (Connectivity, LED Lighting Control), Vertical, and Geography - Global Forecast to 2022
The power over Ethernet solutions market was valued at USD 451.1 Million in 2015 and is expected to reach USD 1,048.3 Million by 2022, at a CAGR of 12.56% during the forecast period. The growth of this market is being propelled by the growing demand for PoE-based products, especially in the commercial vertical; continuous rise in the adoption of PoE-compatible VoIP phones and wireless access points; and increasing use of PoE power sourcing equipment for powering such devices.
- Published: October 2016
- Price: $ 4950
- TOC Available:
-
Electric Vehicle Component Market: A Comprehensive Analysis of Processors, Analog ICs, Power Devices, and Sensors, 2030
Countries around the world have set targets to reduce vehicle emissions by 2035. They have started promoting the development and sales of EVs and related charging infrastructure. For instance, according to the Natural Resources Defense Council, automotive companies in the US have announced US 210 billion in investments in the EV industry to promote EV infrastructure such as charging stations.
- Published: March 2026
- Price: $ 4950
- TOC Available:
-
Radiation Hardened Electronics Market by Component (Mixed Signal ICs, Processors & Controllers, Memory, Power Management), Manufacturing Technique (RHBD, RHBP), Product Type (COTS, Custom), Application and Region - Global Forecast to 2030
The global radiation hardened electronics market is expected to grow from USD 1.77 billion in 2025 to USD 2.30 billion by 2030, at a compound annual growth rate (CAGR) of 5.4% during the forecast period. The Key Players Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), AMD (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US).
- Published: September 2025
- Price: $ 4950
- TOC Available:
-
Semiconductor Market for Robots Size, Share by Component (Compute, Sensors, Memory, Power Management ICs), Robot Type (Industrial Robots, Professional Service Robots, Personal & Household Service Robots, Drones), Vertical - Global Forecast to 2030
The semiconductor market for robots is expected to grow from USD 11.23 billion in 2025 to USD 41.24 billion by 2030, at a compound annual growth rate (CAGR) of 29.7% during the forecast period. The Key Players Texas Instruments Incorporated (US), Infineon Technologies AG (Germany), NXP Semiconductors (Netherlands), STMicroelectronics (Switzerland), Sony Group Corporation (Japan), NVIDIA Corporation (US), Intel Corporation (US), Advanced Micro Devices, Inc. (US), Hesai Group (China), and Bosch Sensortec GmbH (Germany).
- Published: August 2025
- Price: $ 4950
- TOC Available:
-
Industrial Control Systems (ICS) Security Market in Energy & Power by Solution (Encryption, SIEM, Firewall, IAM, DDoS Mitigation, Antivirus), Security Type (Network, Endpoint, Database), Vertical, and Region - Global Forecast to 2030
Dragos (US), Nozomi Networks (US), Claroty (US), Honeywell (US), Siemens (Germany), Schneider Electric (France), ABB (Switzerland), Rockwell Automation (US), GE Vernova (US), Mitsubishi Electric (Japan), Palo Alto Networks (US), Cisco Systems (US), Fortinet (US), Check Point Software (Israel), Tenable (US), Mandiant (US), IBM Security (US), Kaspersky (Russia), BAE Systems (United Kingdom), and Darktrace (UK)
- Published: January 2026
- Price: $ 4950
- TOC Available:
-
Blockchain in Manufacturing Market by Application (Business Process Optimization, Logistics and Supply Chain Management, Counterfeit Management), End Use (Automotive, Energy & Power, Industrial, Pharmaceuticals), and Region - Global Forecast to 2025-2035
A large number of blockchain solution providers including Storj Labs Inc. (US); Cloud Technology Partners, Inc. (US); NVIDIA Corporation (US); Chronicled (US); LO3 Energy (US); Filament (US); Shipchain (US); Microsoft Corporation (US); Advanced Micro Devices, Inc. (US); International Business Machines Corporation (US); Intel Corporation (US); Oracle Corporation (US); Factom (US); Amazon.com, Inc. (US); and Blockchain Foundry Inc. (Canada)—are based in North America. This region is one of the largest contributors to the growth of the global blockchain in manufacturing market.
- Published: March 2026
- Price: $ 4950
- TOC Available:
-
Network Synchronization ICs Market by Technology (Precision Time Protocol (PTP), Network Time Protocol (NTP)), Application (5G Networks, Cloud Computing), Vertical (Telecommunications, Automotive, Industrial Automation) & Region - Global Forecast to 2030
The major players in the global Network Synchronization ICs Market
- Published: March 2026
- Price: $ 4950
- TOC Available:
-
Global Security ICs Market – Forecast to 2030
The global Security ICs market growth is driven by the increasing need for strong data protection across the industries is driven by a high adoption rate of IoT devices, smartphones, and wearables that require secured data storage and communication.
- Published: March 2026
- Price: $ 4950
- TOC Available:
-
Flexible Graphite Market by Type (Sheets, Foils, Tapes), Application (Gaskets & Seals, Thermal Management, Emi Shielding), End-Use Industry (Automotive, Aerospace, Electronics, Oil & Gas, Power & Energy), and Region - Global Forecast to 2030
The flexible graphite market is expected to grow from USD 0.35 billion in 2025 to USD 0.45 billion by 2030, at a CAGR of 5.5% during the forecast period. Major players in this market include SGL Carbon (Germany), Neograf (US), Mersen Property (France), Toyo Tanso Co., Ltd. (Japan), SEPCO, Inc. (US), East Carbon (China), Rex Sealing & Packing Industries Ltd. (India), HPMS Graphite (US), Sunpass Sealing Technology (Zhejiang) Co., Ltd. (US), Jinsun New Material Technology (China), Nippon Carbon Co., Ltd. (Japan), Uni Klinger Limited (India), Specialty Gaskets Inc (Canada), Jiangxi Dasen Technology Co., Ltd. (China), and EGC Enterprises Inc. (US).
- Published: May 2025
- Price: $ 4950
- TOC Available:
-
Field Device Management Market by Offering (Hardware and Software), Deployment (Cloud and On-premises), Industry (Oil & Gas, Energy & Power, Chemicals, Pharmaceuticals, Automotive, Manufacturing), Protocol and Geography - Global Forecast to 2024
The field device management market is projected to grow from USD 1.3 billion in 2019 to USD 1.8 billion by 2024; it is expected to grow at a compound annual growth rate (CAGR) of 6.7%. Siemens AG (Siemens, Germany); Emerson Electric Co. (Emerson, US); ABB Group (ABB, Switzerland); Schneider Electric (Schneider Electric, France); Honeywell International Inc. (Honeywell, US); Rockwell Automation, Inc. (Rockwell, US); Yokogawa Electric Corporation (Yokogawa, Japan); OMRON Corporation (OMRON, Japan); Mitsubishi Electric Corporation (Mitsubishi Electric, Japan); Fanuc Corporation (Fanuc, Japan); Metso Corporation (Metso, Finland); Valmet Oyj (Valmet, Finland); Hamilton Company (Hamilton, US); Phoenix Contact GmbH & Co. KG (Phoenix Contact, Germany); Endress+Hauser AG (Endress+Hauser, Switzerland); Festo AG (Festo, Germany); Omega Engineering (Omega, UK); Hach (Hach, US); Azbil Corporation (Azbil Corporation, Japan); and Weidmüller (Weidmüller, Germany) are among a few major players in the field device management market.
- Published: May 2019
- Price: $ 4950
- TOC Available:
Records 1 to 10 of 50
