Radiation-Hardened Electronics Market by Component (Power Management, ASIC, Logic, Memory & FPGA), Manufacturing Technique (RHBD & RHBP), Application, and Geography - Global Forecast to 2022

The radiation-hardened electronics market was valued at USD 935.9 Million in 2015 and is estimated to reach USD 1,277.4 Million by 2022, at a CAGR of 4.46% during the forecast period. The base year used for this study is 2015, and the forecast period considered is between 2016 and 2022.

The objectives of the study are as follows:

• To define, describe, and forecast the radiation-hardened electronics market segmented on the basis of component, manufacturing technique, and application
• To provide the market size, in terms of volume, for the components of radiation-hardened electronics
• To describe the material selection and packaging types used in the radiation-hardened electronics market
• To provide market size estimations with respect to four main regions (along with their respective  countries), namely, North America, Europe, Asia-Pacific, and Rest of the World
• To identify and analyze the major factors influencing the growth of the market (drivers, restraints, opportunities, and challenges)
• To analyze key trends related to components, manufacturing techniques, and applications that shape and influence the market
• To analyze the market with the help of the Porter’s five forces framework and provide a detailed Porter's analysis, along with the technology and market roadmap
• To strategically analyze micromarkets with respect to individual growth trends, future prospects, and contribution to the total market
• To analyze the opportunities in the market for stakeholders and detail the competitive landscape of key players
• To analyze strategic developments such as joint ventures, mergers and acquisitions, new product developments, and research & development in the radiation-hardened electronics & semiconductors  market
• To strategically profile key players and comprehensively analyze their market shares and core competencies

The research methodology used to estimate and forecast the radiation-hardened electronics market begins with obtaining data on key vendor revenues through secondary research. Some of the secondary sources used in this research include information from various journals and databases such as IEEE journals, Factiva, Hoover’s, and OneSource. The vendor offerings have also been taken into consideration to determine the market segmentation. The bottom-up procedure has been employed to arrive at the overall size of the global radiation-hardened electronics market from the revenues of the key players in the market. After arriving at the overall market size, the total market has been split into several segments and subsegments, which have then been verified through primary research by conducting extensive interviews of people holding key positions in the industry such as CEOs, VPs, directors, and executives. The market breakdown and data triangulation procedures have been employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments. The breakdown of the profiles of primaries has been depicted in the figure below:

To know about the assumptions considered for the study, download the pdf brochure

The radiation-hardened electronics ecosystem comprises rad-hard components & IC vendors such as BAE Systems (U.K.), Honeywell Aerospace (U.S.), Microsemi Corporation (U.S.), Microchip Technology Inc., Xilinx, Inc. (U.S.), Intersil Corporation (U.S.), Texas Instruments, Inc. (U.S.), STMicroelectronics NV (Switzerland), Maxwell Technologies, Inc. (U.S.) and Linear Technology Corporation (U.S.). The end users of these rad-hard products are from a wide range of applications such as space, aerospace & defense and nuclear power plants.

The Target Audience:

• Original equipment manufacturers
• Semiconductor component suppliers
• Radiation-hardened equipment distributors, sales firms
• Software solution providers
• Service providers for radiation-hardened electronic components
• End users
• Research institutes and organizations

“The study answers several questions for the target audiences, primarily which market segments to focus on in next two to five years for prioritizing the efforts and investments.”

Seport Scope:

In this report, the radiation-hardened electronics market has been segmented into the following categories, which have been detailed below:

Radiation-Hardened Electronics Market, by Component:

• Power Management
• ASIC
• Logic
• Memory
• FPGA

Radiation-Hardened Electronics Market, by Manufacturing Technique:

• Radiation Hardening by Design (RHBD)
• Radiation Hardening by Process (RHBP)

Radiation-Hardened Electronics Market, by Application:

• Space (Satellite)
• Aerospace & Defense
• Nuclear Power Plant

Radiation-Hardened Electronics Market, by Geography:

• North America (U.S., Canada, and Mexico)
• Europe (U.K., Germany, France, Russia, and Rest of Europe)
• Asia-Pacific (China, Japan, India, South Korea and Rest of APAC)
• Rest of the World

Competitive Landscape: Market share analysis

Company Profiles: Detailed analysis of the major companies present in the radiation-hardened electronics market

Available Customizations:

With the given market data, MarketsandMarkets offers customizations according to the company’s specific needs. The following customization options are available for the report:

Company Information

Detailed analysis and profiling of additional market players (up to five)

Table of Contents

1 Introduction (Page No. - 14)
    1.1 Objectives of the Study
    1.2 Market Definition
    1.3 Study Scope
           1.3.1 Markets Covered
           1.3.2 Years Considered for the Study
    1.4 Currency
    1.5 Limitations
    1.6 Stakeholders

2 Research Methodology (Page No. - 17)
    2.1 Research Data
           2.1.1 Secondary Data
                     2.1.1.1 Key Data From Secondary Sources
           2.1.2 Primary Data
                     2.1.2.1 Key Data From Primary Sources
                     2.1.2.2 Key Industry Insights
                     2.1.2.3 Breakdown of Primaries
    2.2 Market Size Estimation
    2.3 Market Breakdown and Data Triangulation
    2.4 Assumptions

3 Executive Summary (Page No. - 25)

4 Premium Insights (Page No. - 31)
    4.1 Significant Market Opportunities in the Radiation-Hardened Electronics Market
    4.2 Radiation-Hardened Electronics Market Analysis, By Component
    4.3 Radiation-Hardened Electronics Market Analysis, By Application, 2015
    4.4 Radiation-Hardened Electronics Market Analysis, By Manufacturing Technique, 2015
    4.5 Radiation-Hardened Electronics Market Share, By Region

5 Market Overview (Page No. - 35)
    5.1 Introduction
    5.2 Evolution: Radiation-Hardened Electronics Market
    5.3 Market Segmentation
           5.3.1 By Component
           5.3.2 By Manufacturing Technique
           5.3.3 By Application
           5.3.4 By Region
    5.4 Market Dynamics
           5.4.1 Drivers
                     5.4.1.1 Increased Global Intelligence, Surveillance, & Reconnaissance (ISR) Operations
                     5.4.1.2 Advancements in FPGA & Multicore Processor Technologies for Defense and Space Applications
                     5.4.1.3 Demand From the Communication Satellite Segment for Rad-Hard Electronics
           5.4.2 Restraints
                     5.4.2.1 Difficulties in Creating Actual Testing Environment
                     5.4.2.2 High Costs of Development and Design
           5.4.3 Opportunities
                     5.4.3.1 Research & Development Opportunities Around the Globe
                     5.4.3.2 Growing Requirements for Reconfigurable Rad-Hard Components
           5.4.4 Challenges
                     5.4.4.1 Highly Customized Requirements of High-End Consumers

6 Industry Trends (Page No. - 42)
    6.1 Introduction
    6.2 Value Chain Analysis
    6.3 Porter’s Five Forces Analysis
           6.3.1 Threat of New Entrants
           6.3.2 Threat of Substitutes
           6.3.3 Bargaining Power of Suppliers
           6.3.4 Bargaining Power of Buyers
           6.3.5 Intensity of Competitive Rivalry

7 Radiation-Hardened (Rad-Hard) Electronics Market, By Component (Page No. - 49)
    7.1 Introduction
           7.1.1 Power Management
                     7.1.1.1 LDO Linear Regulators
                     7.1.1.2 Mosfets & Diodes
           7.1.2 Application-Specific Integrated Circuit (ASIC)
           7.1.3 Memory
                     7.1.3.1 Dynamic Random-Access Memory (DRAM)
                     7.1.3.2 Static Random-Access Memory (SRAM)
                     7.1.3.3 Non-Volatile Memories (NVMS)
                     7.1.3.4 Others
           7.1.4 Logic
           7.1.5 Field-Programmable Gate Array (FPGA)

8 Radiation-Hardened Electronics Market, By Manufacturing Technique (Page No. - 89)
    8.1 Introduction
    8.2 Radiation Hardening By Design (RHBD)
    8.3 Radiation Hardening By Process (RHBP)

9 Radiation-Hardened Electronics Market, By Application (Page No. - 93)
    9.1 Introduction
    9.2 Space (Satellites)
           9.2.1 Commercial
           9.2.2 Military
    9.3 Aerospace & Defense
    9.4 Nuclear Power Plants

10 Material Selection and Packaging Types in Radiation-Hardened Electronics Market (Page No. - 100)
     10.1 Introduction
               10.1.1 Material Selection
               10.1.2 Silicon
               10.1.3 Silicon Carbide (SiC)
               10.1.4 Gallium Nitride (GaN)
     10.2 Packaging Types
               10.2.1 Flip-Chip
               10.2.2 Ceramic Packages

11 Geographic Analysis (Page No. - 103)
     11.1 Introduction
     11.2 North America
               11.2.1 U.S.
               11.2.2 Canada
               11.2.3 Mexico
     11.3 Europe
               11.3.1 Russia
               11.3.2 Germany
               11.3.3 U.K.
               11.3.4 France
               11.3.5 Rest of Europe (Scandinavia, Spain, Italy)
     11.4 Asia-Pacific
               11.4.1 China
               11.4.2 India
               11.4.3 Japan
               11.4.4 South Korea
               11.4.5 Rest of APAC (Australia, Srilanka & Singapore)
     11.5 Rest of the World (RoW)
               11.5.1 Middle East & Africa
               11.5.2 Latin America

12 Competitive Landscape (Page No. - 120)
     12.1 Overview
     12.2 Market Ranking Analysis
     12.3 Competitive Situation and Trends
               12.3.1 New Product Launches
               12.3.2 Collaboration ,Agreement, & Expansions, 2014–2016
               12.3.3 Mergers & Acquisitions, 2014–2016

13 Company Profile (Page No. - 126)
     13.1 Introduction
(Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, Ratio Analysis, MnM View)*
     13.2 BAE Systems PLC 
     13.3 Honeywell Aerospace
     13.4 Microsemi Corp.
     13.5 Microchip Technology Inc.
     13.6 Xilinx, Inc.
     13.7 Texas Instruments, Inc.
     13.8 St Microelectronics NV
     13.9 Maxwell Technologies, Inc.
     13.10 Intersil Corporation
     13.11 Linear Technology Corporation
*Details on Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View Might Not Be Captured in Case of Unlisted Companies.
     13.12 Key Innovators in the Radiation-Hardened Electronics Market

14 Appendix (Page No. - 152)
     14.1 Insights of Industry Experts
     14.2 Discussion Guide
     14.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
     14.4 Introducing RT: Real-Time Market Intelligence
     14.5 Available Customizations
     14.6 Related Reports

List of Tables (75 Tables)

Table 1 Porter’s Five Forces Analysis: Threat of Substitutes Likely to Have the Highest Impact on the Overall Market in 2015
Table 2 Radiation-Hardened Electronics, By Component, 2013–2022 (USD Million)
Table 3 Radiation-Hardened Electronics Market, By Component, 2013–2022 (Thousand Units)
Table 4 Radiation-Hardened Electronics Market for Power Management Components, By Type, 2013–2022 (USD Million)
Table 5 Radiation-Hardened Electronics Market for Power Management Components, By Type, 2013–2022 (Thousand Units)
Table 6 Radiation-Hardened Electronics Market for Power Management Components, By Region, 2013–2022 (USD Million)
Table 7 Radiation-Hardened Electronics Market for Power Management Components, By Region, 2013–2022 (Thousand Units)
Table 8 Radiation-Hardened Electronics Market for Power Management Components in North America, By Country, 2013–2022 (USD Million)
Table 9 Radiation-Hardened Electronics Market for Power Management Components in North America, By Country, 2013–2022 (Thousand Units)
Table 10 Radiation-Hardened Electronics Market for Power Management Components in Europe, By Country, 2013–2022 (USD Million)
Table 11 Radiation-Hardened Electronics Market for Power Management Components in Europe, By Country, 2013–2022 (Thousand Units)
Table 12 Radiation-Hardened Electronics Market for Power Management Components in APAC, By Country, 2013–2022 (USD Million)
Table 13 Radiation-Hardened Electronics Market for Power Management Components in APAC, By Country, 2013–2022 (Thousand Units)
Table 14 Radiation-Hardened Electronics Market for Power Management Components in RoW, By Region, 2013–2022 (USD Million)
Table 15 Radiation-Hardened Electronics Market for Power Management Components, By Region, 2013–2022 (Thousand Units)
Table 16 Radiation-Hardened Electronics Market for ASICs, By Region, 2013–2022 (USD Million)
Table 17 Radiation-Hardened Electronics Market for ASICs, By Region, 2013–2022 (Thousand Units)
Table 18 Radiation-Hardened Electronics Market for ASICs in North America, By Country, 2013–2022 (USD Million)
Table 19 Radiation-Hardened Electronics Market for ASICs in North America, By Country, 2013–2022 (Thousand Units)
Table 20 Radiation-Hardened Electronics Market for ASICs in Europe, By Country, 2013–2022 (USD Million)
Table 21 Radiation-Hardened Electronics Market for ASICs in Europe, By Country, 2013–2022 (Thousand Units)
Table 22 Radiation-Hardened Electronics Market for ASICs in APAC, By Country, 2013–2022 (USD Million)
Table 23 Radiation-Hardened Electronics Market for ASICs in APAC, By Country, 2013–2022 (Thousand Units)
Table 24 Radiation-Hardened Electronics Market for ASICs in RoW, By Region, 2013–2022 (USD Million)
Table 25 Radiation-Hardened Electronics Market for ASICs in RoW, By Region, 2013–2022 (Thousand Units)
Table 26 Radiation-Hardened Electronics Market, By Memory Component, 2013–2022 (USD Million)
Table 27 Radiation-Hardened Electronics Market, By Memory Component, 2013–2022 (Thousand Units)
Table 28 Radiation-Hardened Electronics Market for Memory Components, By Region, 2013–2022 (USD Million)
Table 29 Radiation-Hardened Electronics Market for Memory Components, By Region, 2013–2022 (Thousand Units)
Table 30 Radiation-Hardened Electronics Market for Memory Components in North America, By Country, 2014–2022 (USD Million)
Table 31 Radiation-Hardened Electronics Market for Memory Components in North America, By Country, 2013–2022 (Thousand Units)
Table 32 Radiation-Hardened Electronics Market for Memory Components in Europe, By Country, 2013–2022 (USD Million)
Table 33 Radiation-Hardened Electronics Market for Memory Components in Europe, By Country, 2013–2022 (Thousand Units)
Table 34 Radiation-Hardened Electronics Market for Memory Components in APAC, By Country, 2013–2022 (USD Million)
Table 35 Radiation-Hardened Electronics Market for Memory Components in APAC, By Country, 2013–2022 (Thousand Units)
Table 36 Radiation-Hardened Electronics Market for Memory Components in RoW, By Region, 2013–2022 (USD Million)
Table 37 Radiation-Hardened Electronics Market for Memory Components in RoW, By Region, 2013–2022 (Thousand Units)
Table 38 Radiation-Hardened Electronics Market, By Logic Component, 2013–2022 (USD Million)
Table 39 Radiation-Hardened Electronics Market for Processors & Controllers, By Type, 2013–2022 (USD Million)
Table 40 Radiation-Hardened Electronics Market, By Logic Component, 2013–2022 (Thousand Units)
Table 41 Radiation-Hardened Electronics Market for Logic Components, By Region, 2013–2022 (USD Million)
Table 42 Radiation-Hardened Electronics Market for Logic Components, By Region, 2013–2022 (Thousand Units)
Table 43 Radiation-Hardened Electronics Market for Logic Components in North America, By Country, 2013–2022 (USD Million)
Table 44 Radiation-Hardened Electronics Market for Logic Components in North America, By Country, 2013–2022 (Thousand Units)
Table 45 Radiation-Hardened Electronics Market for Logic Components in Europe, By Country, 2013–2022 (USD Million)
Table 46 Radiation-Hardened Electronics Market for Logic Components in Europe, By Country, 2013–2022 (Thousand Units)
Table 47 Radiation-Hardened Electronics Market for Logic Components, By Country, 2013–2022 (USD Million)
Table 48 Radiation-Hardened Electronics Market for Logic Components in APAC, By Country, 2013–2022 (Thousand Units)
Table 49 Radiation-Hardened Electronics Market for Logic Components in RoW, By Region, 2013–2022 (USD Million)
Table 50 Radiation-Hardened Electronics Market for Logic Components in RoW, By Region, 2013–2022 (Thousand Units)
Table 51 Radiation-Hardened Electronics Market for FPGA, By Region, 2013–2022 (USD Million)
Table 52 Radiation-Hardened Electronics Market for FPGA, By Region, 2013–2022 (Thousand Units)
Table 53 Radiation-Hardened Electronics Market for FPGA Components in North America, By Country, 2013–2022 (USD Million)
Table 54 Radiation-Hardened Electronics Market for FPGA Components in North America, By Country, 2013–2022 (Thousand Units)
Table 55 Radiation-Hardened Electronics Market for FPGA Components in Europe, By Country, 2013–2022 (USD Million)
Table 56 Radiation-Hardened Electronics Market for FPGA Components in Europe, By Country, 2013–2022 (Thousand Units)
Table 57 Radiation-Hardened Electronics Market for FPGA Component in APAC, By Country, 2013–2022 (USD Million)
Table 58 Radiation-Hardened Electronics Market for FPGA Components in APAC, By Country, 2013–2022 (Thousand Units)
Table 59 Radiation-Hardened Electronics Market for FPGA Components, By Region, 2013–2022 (USD Million)
Table 60 Radiation-Hardened Electronics Market for FPGA Components in RoW, By Region, 2013–2022 (Thousand Units)
Table 61 Radiation-Hardened Electronics Market, By Manufacturing Technique), 2013–2022 (USD Million)
Table 62 Radiation-Hardened Electronics Market, By Application, 2013–2022 (USD Million)
Table 63 Radiation-Hardened Electronics Market for Space Application, By Type, 2013–2022 (USD Million)
Table 64 Radiation-Hardened Electronics Market, By Region, 2013–2022 (USD Million)
Table 65 Radiation-Hardened Electronics Market in North America, By Country, 2013–2022 (USD Million)
Table 66 Radiation-Hardened Electronics Market in North America, By Component, 2013–2022 (USD Million)
Table 67 Radiation-Hardened Electronics Market in Europe, By Country, 2013–2022 (USD Million)
Table 68 Radiation-Hardened Electronics Market in Europe, By Component, 2013–2022 (USD Million)
Table 69 Radiation-Hardened Electronics Market in APAC, By Country, 2013–2022 (USD Million)
Table 70 Radiation-Hardened Electronics Market in APAC, By Component, 2013–2022 (USD Million)
Table 71 Radiation-Hardened Electronics Market in RoW, By Region, 2013–2022 (USD Million)
Table 72 Radiation-Hardened Electronics Market in RoW, By Component, 2013–2022 (USD Million)
Table 73 New Product Launches, 2016
Table 74 Collaborations, Partnerships, & Contracts, 2014–2016
Table 75 Mergers/Acquisitions, 2014–2016
 
 
List of Figures (83 Figures)
 
Figure 1 Research Design
Figure 2 Research Flow
Figure 3 Bottom-Up Approach
Figure 4 Top-Down Approach
Figure 5 Data Triangulation
Figure 6 Radiation-Hardened Electronics Market Size: Value vs Volume, 2013–2022
Figure 7 Market Share of Radiation-Hardened Electronics Components, 2013–2022
Figure 8 Radiation-Hardened Electronics Market, By Manufacturing Technique, 2015
Figure 9 Radiation-Hardened Electronics Market, Industry Ranking Analysis, 2015
Figure 10 North America Held the Largest Share of the Radiation-Hardened Electronics Market in 2015
Figure 11 Radiation-Hardened Electronics Market Expected to Have Attractive Growth Opportunities Between 2016 and 2022
Figure 12 Power Management Component to Hold the Leading Position Between 2016 and 2022
Figure 13 Space Application to Continue to Lead the Radiation-Hardened Electronics Market Between 2016 and 2022
Figure 14 Radiation Hardening By Design Held the Largest Market Share in the Rad-Hard Market, 2015
Figure 15 The U.S. Held the Largest Market Share in 2015
Figure 16 Evolution of Radiation-Hardened Electronics Technology
Figure 17 Communications Satellite Segment to Propel the Demand for the Radiation-Hardened Electronics Market
Figure 18 Value Chain Analysis: Major Value is Added During the Material Selection, Fabrication, &Packaging and Interfacing & Software Development Stages, 2015
Figure 19 Radiation-Hardened Electronics: Porter’s Five Forces Analysis, 2015
Figure 20 Porters Five Force Analysis of the Radiation-Hardened Electronics Market
Figure 21 Low Impact of Threat of New Entrants Due to High Capital Required
Figure 22 High Impact of Threat of New Substitutes Because of the High Consumer Switching Costs
Figure 23 High Impact of Bargaining Power of Suppliers Due to the Brand Equity of Suppliers
Figure 24 Low Impact of Bargaining Power of Buyers Due to Low Buyer to Supplier Ratio in the Market
Figure 25 Intensity of Competitive Rivalry is Medium in the Market Due to A Number of Large Industry Players
Figure 26 Radiation-Hardened Electronics Market, By Component
Figure 27 Power Management Expected to Lead the Radiation-Hardened Electronics Market During the Forecast Period
Figure 28 Radiation-Hardened Electronics Market, in Terms of Volume, By Component, 2015 (Thousand Units)
Figure 29 LDO Regulators Held the Largest Size of the Radiation-Hardened Electronics Market for Power Management Components in 2015
Figure 30 North America Held the Largest Size of the Radiation-Hardened Electronics Market for Power Management Components in 2015
Figure 31 North America Held the Largest Size of the Rad-Hard Market, in Terms of Volume, for Power Management Components During the Forecast Period
Figure 32 North America Held the Largest Size of the Rad-Hard Market for ASICs in 2015
Figure 33 North America Held the Largest Size of the Rad-Hard Market, in Terms of Volume, for ASICs in 2015
Figure 34 U.S. Expected to Lead the North American Market for ASICs During the Forecast Period
Figure 35 Russia Held the Largest Share of the European Rad-Hard Market for ASICs in 2015
Figure 36 Radiation-Hardened Electronics Market for ASICs in APAC, in Terms of Value & Volume, 2015
Figure 37 DRAM Held the Largest Size of the Radiation-Hardened Electronics Market for Memory Components in 2015
Figure 38 North America Expected to Hold the Largest Size of the Radiation-Hardened Electronics Market for Memory Components During the Forecast Period
Figure 39 U.S. Held the Largest Size of the North American Radiation-Hardened Electronics Market for Memory Components in 2015
Figure 40 Latin America to Surpass the Middle East Market in the RoW Region During the Forecast Period
Figure 41 Processors & Controllers Expected to Dominate the Radiation-Hardened Electronics Market for Logic Components During the Forecast Period
Figure 42 North America Expected to Lead the Rad-Hard Market for Logic Components Between 2016 and 2022
Figure 43 The Rad-Hard Market in North America for Logic Components, in Terms of Value and Volume, 2015
Figure 44 Logic Component Market in RoW, Volume vs Value, 2015
Figure 45 North America Expected to Lead the Rad-Hard FPGA Market Between 2016 and 2022
Figure 46 U.S. Led the North American Rad-Hard Market for FPGA Components in 2015
Figure 47 Radiation-Hardened Electronics Market, By Manufacturing Technique
Figure 48 RHBD Manufacturing Technique to Lead the Rad-Hard Market Throughout the Forecast Period
Figure 49 Radiation-Hardened Electronics Market, By Application
Figure 50 Key Players of Rad-Hard Market Serving in Major Application Areas
Figure 51 Space Application to Witness the Highest Growth Rate in the Rad-Hard Market Between 2016 and 2022
Figure 52 Commercial Segment Held the Largest Share of the Rad-Hard Space Application Market in 2015
Figure 53 Radiation-Hardened Electronics: Material Types
Figure 54 Radiation-Hardened Electronics Market, By Geography
Figure 55 Growth Lifecycle of the Radiation-Hardened Electronics Market in Major Geographies, 2015
Figure 56 North America Expected to Lead the Radiation-Hardened Electronics Market During the Forecast Period
Figure 57 North America: Radiation-Hardened Electronics Market Snapshot (2015)
Figure 58 The U.S. Held the Largest Share of the North American Radiation-Hardened Electronics Market in 2015
Figure 59 Europe: Radiation-Hardened Electronics Market Snapshot (2015)
Figure 60 Russia Led the Radiation-Hardened Electronics Market in Europe in 2015
Figure 61 Asia-Pacific: Radiation-Hardened Electronics Market Snapshot (2015)
Figure 62 China to Be the Leading Market for Radiation-Hardened Electronics in Asia-Pacific Till 2022
Figure 63 Power Management Component Held the Largest Share of the RoW Market in 2015
Figure 64 Companies Adopted New Product Launch as the Key Growth Strategy Between 2014 and 2016
Figure 65 Market Ranking Analysis in the Radiation-Hardened Electronics Market, 2015
Figure 66 Market Evolution Framework – New Product Launches Fueled Growth and Innovation in the Radiation-Hardened Electronics Market Between 2014 and 2016
Figure 67 Battle for Market Share: New Product Launches Was the Key Growth Strategy, 2014–2016
Figure 68 Regional Revenue Mix of Major Players
Figure 69 BAE Systems PLC: Company Snapshot
Figure 70 BAE Systems: SWOT Analysis
Figure 71 Honeywell Aerospace: Company Snapshot
Figure 72 Honeywell Aerospace: SWOT Analysis
Figure 73 Microsemi Corp.: Company Snapshot
Figure 74 Microsemi Corp.: SWOT Analysis
Figure 75 Microchip Technology Inc. Company Snapshot
Figure 76 Microchip Technology Inc.SWOT Analysis
Figure 77 Xilinx, Inc.: Company Snapshot
Figure 78 Xilinx Inc.: SWOT Analysis
Figure 79 Texas Instruments, Inc.: Company Snapshot
Figure 80 St Microelectronics NV: Company Snapshot
Figure 81 Maxwell Technologies Inc.: Company Snapshot
Figure 82 Intersil Corporation: Company Snapshot
Figure 83 Linear Technology Corporation: Company Snapshot

The radiation-hardened electronics market was valued at USD 935.9 Million in 2015 and is expected to reach USD 1,277.4 Million by 2022, at a CAGR of 4.46% during the forecast period. The growth of this market is being propelled by the increased global intelligence, surveillance, & reconnaissance (ISR) operations around the globe, advancements in FPGA & multicore processor technologies for defense and space applications and the demand from the communication satellite segment for rad-hard electronics.

The scope of this report covers the radiation-hardened electronics market on the basis of component, manufacturing technique, application, and geography. Space application accounted for the largest share of the overall radiation-hardened electronics market. The radiation-hardened electronics market for space applications is expected to grow at a high rate between 2016 and 2022. The need for high-performance signal processing payloads that can survive in a variety of high-radiation environ­ments for longer periods of time is driving the demand for rad-hard electronics in space applications. As the technology in such applications is advancing rapidly, the selection of components in such satellites is becoming increasingly rigorous. Maintaining the same or similar performance of rad-hard components in high-radiation environment is the biggest challenge faced by the service providers.

Power management components are expected to hold the largest share of the global radiation-hardened electronics market during the forecast period. High demand for MOSFETs and transistors in the commercial space market is driving the growth of the power management components in the global market place.

The radiation-hardened electronics market for the radiation hardening by design (RHBD) is expected to be the fastest-growing market by 2022. The RHBD technique is expected to have good opportunities in the near future as it can provide immunity from total-dose and single-event effects in commercially produced circuitry. The defense & space industries mostly use RHBD memories, microcontrollers, and ASICs in their applications and it also has a wide scope in military applications.

North America held the largest share of the radiation-hardened electronics market in 2015. The high growth of the market in this region can be attributed to the increasing demand for rad-hard products owing to the presence of a large number of rad-hard component manufacturers as well as top private & government space institutes in North America.

The key restraining factor for the growth of the radiation-hardened electronics market is the high costs of development and design associated with the rad-hard components. This report describes the drivers, restraints, opportunities, and challenges pertaining to the radiation-hardened electronics market. In addition, it analyzes the current scenario and forecasts the market till 2022, including the market segmentation based on component, manufacturing technique, application, and geography.

Some of the key players in the radiation-hardened electronics market include BAE Systems Plc. (U.K.), Honeywell Aerospace & Defense (U.S.), Microsemi Corporation (U.S.), Xilinx, Inc. (U.S.), and Microchip Technology Inc.

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