Here are relevant reports on : silicon-photonics-market
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Silicon Photonics Market Size, Share and Trends by Product (Transceivers, Variable Optical Attenuators, Switches, Sensors and Cables), Components (Lasers, Modulators, Optical Waveguides, Optical Interconnects, Photodetectors) - Global Forecast to 2030
The global silicon photonics market is expected to grow from USD 2.65 billion in 2025 to USD 9.65 billion by 2030, at a compound annual growth rate (CAGR) of 29.5% during the forecast period. The Key Players Cisco Systems, Inc.(US), Intel Corporation (US), MACOM (US), GlobalFoundries Inc. (US), Lumentum Operations LLC (US), Marvell (US), Coherent Corporation (US), IBM (US), and STMicroelectronics (Switzerland).
- Published: April 2025
- Price: $ 4950
- TOC Available:
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North America Silicon Photonics Market by Product (Transceivers, Variable Optical Attenuators, Switches, Sensors, and Cables), Component (Lasers, Modulators, Optical Waveguides, Optical Interconnects, Other Components) - Forecast to 2030
The silicon photonics market in North America is estimated at USD 1.16 billion in 2025 and is projected to reach USD 4.35 billion by 2030, growing at a CAGR of 30.2% from 2025 to 2030.The report highlights key players such as Cisco Systems, Inc. (US), Intel Corporation (US), MACOM (US), GlobalFoundries Inc. (US), Lumentum Operations LLC (US), Marvell (US), Coherent Corporation (US), IBM (US), and STMicroelectronics (Switzerland).
- Published: June 2026
- Price: $ 4950
- TOC Available:
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Photonics Market by Product Type (LED), Wavelength (Infrared, Visible), Material (Silicon, Glass), Application (Information & Communication Technology), End-use Industry (Industrial, Media & Telecommunication), & Region - Global Forecast to 2030
The photonics market is expected to grow from USD 1,093.96 billion in 2025 to USD 1,481.80 billion by 2030, at a CAGR of 6.3% during the forecast period. To enable an in-depth understanding of the competitive landscape, the report includes the profiles of some of the top players in the photonics market, such as Thorlabs, Inc. (US), IPG Photonics Corporation (US), Lumentum Operations LLC (US) ams-OSRAM AG (Austria), Hamamatsu Photonics K.K. (Japan), Corning Incorporated (US), Coherent Corp (US), OFS Fitel, LLC (US), ON SEMICONDUCTOR CORPORATION (US), and Signify Holding (Netherlands).
- Published: September 2025
- Price: $ 4950
- TOC Available:
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Photonics Technologies For Aerospace, Security & Defense Market (Light, Amplifiers, Detection, Modulation, Transmission) - 2019 By Geography
- Published: July 2026
- Price: $ 4950
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Silicon Nitride Market by Type (Reaction Bonded Silicon Nitride, Hot Pressed Silicon Nitride, Sintered Silicon Nitride), End-use Industry (Photovoltaic, Automotive, General Industrial, Aerospace, Medical), and Region - Global Forecast to 2023
The market size of silicon nitride is projected to grow from USD 90 million in 2018 to USD 127 million by 2023, at a CAGR of 7.2% during the forecast period. Silicon nitride (Si3N4) is an inorganic, non-metallic compound of silicon and nitrogen. It is used as a ceramic material. It offers excellent resistance against abrasion, corrosion, and most chemicals. Among the advanced ceramics, silicon nitride has the highest fracture resistance than other advanced ceramic. Hence, these desirable properties make silicon nitride a suitable material for use in end-use industries such as solar photovoltaic, automotive, general industrial, aerospace, and medical among.UBE (Japan), Denka (Japan), AlzChem (Germany), H.C. Starck (Germany), Yantai Tomley Hi-Tech Advanced Materials Co. Ltd (China), and Vesta Si (Sweden). The leading players for the fabrication of silicon nitride are 3M (US), CeramTec (Germany), Kyocera Fine Ceramics (Japan), Morgan Advanced Ceramics (UK), Toshiba (Japan), Rogers Corporation (US), and CoorsTek (US).
- Published: May 2019
- Price: $ 4950
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Photonic Integrated Circuit (IC) & Quantum Computing Market (2012 – 2022): By Application (Optical Fiber Communication, Optical Fiber Sensors, Biomedical); Components (Lasers, Attenuators); Raw Materials (Silica on Silicon, Silicon on Insulator)
Photonic Integrated Circuits are electronic ICs which are put to use in integrating multiple optical components such as lasers, modulators, detectors, attenuators, multiplexers/de-multiplexers and optical amplifiers. Technically, it is an apparatus on a plane substrate where light is guided to the plane of the substrate from one optical component to the other. Photonic ICs increase the functionality of an electronic IC which is meant to integrate transistors, capacitors and transistors.
- Published: December 2012
- Price: $ 4950
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Spin-on Carbon Market by Type (Hot-Temperature, Normal-Temperature), Application (Logic Devices, Memory Devices, Power Devices, MEMS, Photonics, Advanced Packaging), and End User (Foundries, IDMs & OSAT Vendors) - Global Forecast to 2032
The spin-on carbon market is projected to reach USD 0.81 billion by 2032, growing from USD 0.22 billion in 2026, registering a CAGR of 24.1% during the forecast period. The Key Players SAMSUNG SDI (South Korea), Shin-Etsu Chemical Co., Ltd. (Japan), DONGJIN SEMICHEM CO LTD. (South Korea), Merck KGaA (Germany), YCCHEM Co., Ltd. (South Korea), Brewer Science, Inc. (US), JSR Micro, Inc. (US), Irresistible Materials (UK), KOYJ CO., LTD. (South Korea), and Nano-C (US).
- Published: February 2026
- Price: $ 4950
- TOC Available:
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Silicon Wafer Market by Type, End-Use Industry, Application and Region - Global Forecast to 2030
The silicon wafer market plays a crucial role in the semiconductor industry as silicon wafers serve as the fundamental substrate for manufacturing integrated circuits (ICs) and other semiconductor devices. The market outlook for the silicon wafer industry is influenced by various factors, including technological advancements, demand for electronic devices, and industry trends.
- Published: July 2026
- Price: $ 4950
- TOC Available:
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Through-Silicon Vias (TSV) IC Packaging Market, Global Forecast & Analysis (2011-2016)
Advancment in IC packaging allows the end product to be smaller like smart cell phone,Tablets. Through silicon vias (TSV) is an advanced teqnique of pckaging where electronic product occupy less space and provide more connectivity. TSV is used to connect multiple ICs togeher in one package. TSV can be used in a no. of market including DRAMs, MPUs, PLDs, special purpose logic communications chips, CMOS image sensors, and graphics chips.
- Published: July 2026
- Price: $ 4950
- TOC Available:
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Heterogeneous Integration Market Size, Share & Trends by Packaging Architecture (2.5D Packaging, 3D Packaging, Fan-Out Packaging, Silicon Photonics), By Vertical, By Integration Complexity, By Packaging Vendor (OSAT, IDM, Foundries), and region – Global Forecast to 2032
The global Heterogeneous Integration Market was valued at USD 5.0 Billion in 2025 and is projected to reach USD 12.6 Billion by 2032, expanding at a robust Compound Annual Growth Rate (CAGR) of 14.1% from 2026 to 2032. This exceptional growth trajectory is structurally underpinned by the absolute physical limits of planar Moore's Law scaling, which is forcing the entire semiconductor industry to transition from traditional monolithic system-on-chips (SoCs) to highly complex, multi-die architectures. As cloud service providers, enterprise data centers, and automotive giants demand exponentially higher compute densities, massive memory bandwidth, and stringent power efficiency, heterogeneous integration has evolved into the fundamental backbone of modern electronics. Generative artificial intelligence serves as the definitive catalyst for this surge, requiring the intimate co-packaging of advanced logic chips with stacked high-bandwidth memory to process massive neural networks with minimal latency and maximum throughput.
- Published: July 2026
- Price: $ 4950
- TOC Available:
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