Here are relevant reports on : electronics-adhesives-market
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High Temperature Epoxy Resin Market by Application (Coatings, Composites, Adhesives, Construction, Electrical & Electronics Others) & Region - Global Trends & Forecasts to 2020
High temperature epoxy resins are thermosetting plastic materials that provide good strength and chemical resistance at high temperatures. They possess properties such as they have improved resistance to acid bases and solvents, retention of mechanical properties at high temperatures and under wet conditions, minimal shrinkage and improved high temperature adhesive properties. The high temperature epoxy resin market growth is bound with the developing economies due to its high co-relation with industrialization. High temperature epoxy resins: A projected value of $6.5 billion by 2019, signifying firm annualized growth of 7.15% between 2014 and 2019.
- Published: April 2026
- Price: $ 4950
- TOC Available:
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Electrically Conductive Adhesives Market by Type, Chemistry (Epoxy, Silicone, Acrylic, Polyurethane), Application (Automotive, Aerospace, Consumer Electronics, Biosciences), Filler Material - Global Forecast to 2021
The global electrically conductive adhesives market is projected to reach USD 2.53 Billion by 2021 at a CAGR of 8.48%. It is driven by the increase in use of electronic components in various industries such as aerospace, automotive, and consumer electronics, among others.
- Published: November 2016
- Price: $ 4950
- TOC Available:
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MS Polymers Market by Type (SMP, SPUR), Application (Adhesives & Sealant, Coatings), End-Use Industry (Building & Construction, Automotive & Transportation, Industrial Assembly, Electronics), and Region - Global Forecast to 2026
The market size for MS Polymers is projected to reach USD 1.9 billion by 2026, at a CAGR of 6.1% during the projected period. Kaneka (Japan), Wacker (Germany), AGC Chemicals (Japan), Momentive (US) and Evonik Industries AG (Germany). are the major players in the MS Polymers market.
- Published: July 2021
- Price: $ 4950
- TOC Available:
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MDI, TDI, and Polyurethane Market by Application (Flexible Foams, Rigid Foams, Paints & Coatings, Elastomers, Adhesives & Sealants), End-Use (Construction, Furniture & Interiors, Electronics & Appliances, Automotive, Footwear) - Global Forecast to 2026
The MDI, TDI, and Polyurethane Market is expected to grow from USD 77.9 billion in 2021 to USD 105.3 billion by 2026, at a CAGR of 6.2% during the forecast period. The key market players profiled in the report include BASF SE (Germany), The Dow Chemical Company (US), DuPont De Nemours, Inc. (US), Huntsman Corporation (US), Covestro AG (Germany), LANXESS AG (Germany), Mitsui Chemicals Inc. (Japan), Wanhua Chemical Group Co. Ltd. (China), and Woodbridge Foam Corporation (Canada).
- Published: April 2021
- Price: $ 4950
- TOC Available:
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Waterproof Adhesives & Sealants Market by Chemistry (Silicones, PU, Acrylics, Epoxy, Polysulfide), End-use Industry (Building & Construction, Transportation, Electrical & Electronics) and Region - Global Forecasts to 2027
The waterproof adhesives & sealants market is expected to grow from USD 23.4 billion in 2022 to USD 31.3 billion by 2027, at a CAGR of 6.0% during the forecast period. The key players in this market are 3M (US), Henkel AG (Germany), Avery Dennison Corporation (US), H.B. Fuller (US), Dow (US), Huntsman Corporation (US), Sika AG (Switzerland), MAPEI Spa (Italy), RPM International (US), and Bostik SA (France).
- Published: July 2022
- Price: $ 4950
- TOC Available:
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HTPB Market by Application (Rocket Fuel, Waterproof Coatings & Membranes, Adhesives, Sealants), by End-Use (Aerospace & Defense, Construction & Civil Engineering, Automotive, Electrical & Electronics), and Region - Global Forecast to 2022
The HTPB market size is estimated to be USD 131.9 Million in 2017 and is projected to reach USD 215.7 Million by 2022, registering a CAGR of 10.3% between 2017 and 2022. The growing demand for missiles and rockets requiring technologically efficient HTPB-based rocket fuel and rising investment in space technologies are major drivers of the global HTPB market during the forecast period.Major players in the HTPB market are TOTAL Cray Valley (France), Evonik Industries (Germany), Idemitsu Kosan (Japan), CRS Chemicals (US), Emerald Performance Materials (US), ISLAND PYROCHEMICAL INDUSTRIES CORP (US), Monomer-Polymer & DAJAC Labs (US), Zibo Qilong Chemical Industry (China), and Aerocon Systems Co. (US). MACH I, (US), Polymer Source (Canada), and RCS Rocket Motor Components (US) are major distributors of HTPB globally.
- Published: June 2018
- Price: $ 4950
- TOC Available:
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Electronic Adhesives Market by Form (Liquid, Paste, Solid), Resin (Epoxy, Silicone, Acrylic), End-Use Industry (Communications, Computers, Consumer Electronics, Industrial, Medical), Product Type and Region - Global Forecast to 2027
The electronic adhesives market is expected to grow from USD 4.5 billion in 2022 to USD 6.1 billion by 2027, at a CAGR of 6.1% during the forecast period. The key players operating in the market are Henkel AG (Germany), The 3M Company (US), Arkema SA (France), and Parker Hannifin Corporation (US).
- Published: July 2022
- Price: $ 4950
- TOC Available:
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Curing Agents Market by Type (Epoxy, Polyurethane, Silicone Rubber, and Others), Application (Coatings, Electrical & Electronics, Composites, Adhesives, Construction, Wind Energy, and Others), and Region - Global Forecast to 2023
The market for curing agents is projected to grow from USD 4.2 billion in 2018 to USD 5.9 billion by 2023, at a compound annual growth rate (CAGR) of 6.80% during the forecast period. The growth of applications such as coatings, wind energy, electrical & electronics, construction, composites, and adhesives is majorly driving the curing agents market.The major players operating in the curing agents market are Evonik Industries (Germany), Hexion Inc. (US), Huntsman Corporation (US), Cardolite Corporation (US), and BASF (Germany).
- Published: January 2019
- Price: $ 4950
- TOC Available:
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Epoxy Curing Agents Market by Type (Amine-Based Curing Agents, Anhydride Curing Agents), Application (Coatings, Construction, Adhesives, Composites, Wind Energy, Electrical & Electronics), and Region - Global Forecast to 2022
The epoxy curing agents market is projected to reach USD 5.02 Billion by 2022, at a CAGR of 6.84% from 2017 to 2022. The growth of the market can be attributed to the expansion of the construction industry, increasing urban population, and growth of the composite industry. Based on application, the coatings segment is projected to lead the epoxy curing agents market, while the wind energy segment is projected to witness highest growth during the forecast period.
- Published: March 2017
- Price: $ 4950
- TOC Available:
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High Performance Adhesives Market by Type (Epoxy, Polyurethane, Acrylic, Silicone), End-use Industry (Transportation, Packaging, Electronics, Construction, Medical), Technology (Solvent-based, Water-based, Hot-melt) and Region - Global Forecast to 2022
The increasing demand for high-performance adhesives across various end-use industries is driving the global high-performance adhesives market. In terms of value, the global market size is estimated at USD 9.77 Billion in 2017 and is projected to reach USD 13.17 Billion by 2022, at a CAGR of 6.15% between 2017 and 2022. Asia-Pacific accounts for a major share of the overall high-performance adhesives market due to the increased technological & infrastructural developments and consumer awareness in the region. Key companies operational in the market include Henkel (Germany), 3M (U.S.), Bostik (France), H.B. Fuller (U.S.), Illinois Tool Works (U.S.), Avery Dennison (U.S.), Sika (Switzerland), and Pidilite Industries (India).
- Published: October 2017
- Price: $ 4950
- TOC Available:
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