Here are relevant reports on : power-management-ic-market
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Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Wafer Cleaning, Deposition, Assembly & Packaging, Dicing, Metrology, Bonding, Wafer Testing/IC Testing, Memory, Logic, Discrete, Analog - Global Forecast to 2032
The global semiconductor manufacturing equipment market is expected to grow from USD 166.35 billion in 2025 to USD 344.36 billion by 2032, at a compound annual growth rate (CAGR) of 11.0%. during the forecast period. The Key Players Applied Materials, Inc. (US), ASML (Netherlands), LAM RESEARCH CORPORATION (US), Tokyo Electron Limited (Japan), and KLA Corporation (US).
- Published: November 2025
- Price: $ 4950
- TOC Available:
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Mammography Detector Market by type (analog and digital detectors) by technology (DC and IC detectors) by end-user (hospitals, diagnostic imaging centers, and others) and by Region - Global Forecast to 2030
The major players in the global Mammography Detector Market
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Smart Card IC Market by Type (Microprocessor, Memory), Architecture (16-bit, 32-bit), Interface, Application (USIMs/eSIMs, ID Cards, Financial Cards), End-user Industry (Telecommunications, BFSI) and Region - Global Forecast to 2027
The global smart card IC market is expected to grow from USD 2.9 billion in 2022 to USD 3.9 billion by 2027, at a compound annual growth rate (CAGR) of 6.3% during the forecast period.The Key Players Infineon Technologies AG (Germany), NXP Semiconductors N.V. (Netherland), Samsung Electronics Co., Ltd. (South Korea), STMicroelectronics N.V. (Switzerland), Microchip Technology Incorporated (US), CEC Huada Electronic Design Co., Ltd. (China), Analog Devices, Inc. (US), Sony Group Corporation (Japan), Toshiba Corporation (Japan), and ON Semiconductor Corporation (US)
- Published: October 2022
- Price: $ 4950
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029
The semiconductor & ic packaging materials market is expected to grow from USD 43.9 billion in 2024 to USD 70.9 billion by 2029, at a CAGR of 10.1% during the forecast period. The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc.
- Published: March 2024
- Price: $ 4950
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Photonic Integrated Circuit (IC) & Quantum Computing Market (2012 – 2022): By Application (Optical Fiber Communication, Optical Fiber Sensors, Biomedical); Components (Lasers, Attenuators); Raw Materials (Silica on Silicon, Silicon on Insulator)
Photonic Integrated Circuits are electronic ICs which are put to use in integrating multiple optical components such as lasers, modulators, detectors, attenuators, multiplexers/de-multiplexers and optical amplifiers. Technically, it is an apparatus on a plane substrate where light is guided to the plane of the substrate from one optical component to the other. Photonic ICs increase the functionality of an electronic IC which is meant to integrate transistors, capacitors and transistors.
- Published: December 2012
- Price: $ 4950
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Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)
The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.
- Published: April 2012
- Price: $ 4950
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Camera Technology Market by Component (Microcontroller & Microprocessor, Sensor, and IC), Technology (3D Depth Sensing, IR Thermal, 4K Pixel & UHD, Panoramic, SCMOS Image Sensor), Application and Geography - Analysis & Forecast to 2014 - 2020
The report majorly profiles the companies and research institutes active in this field. This report provides the competitive landscape of the key players that includes the main growth strategies of these players. This report focuses on giving a detail view of the complete ACT industry with regards to the different applications as well as the geography market. The market for the ACT application is rapidly penetrating the media and entertainment sector. The global ACT market size is estimated to grow from $2,186.92 million in 2013 to $6,080.03 million by 2020, at a CAGR of 15.69% from 2014 to 2020
- Published: January 2015
- Price: $ 4950
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Thermal Conductive Adhesives Market by Type (Silicones, Epoxies, Polyurethanes, and Acrylics), Application (Battery Thermal, Heat Sink, IC Packaging Heat Conduction, LED Lighting Thermal, Thermal Material Potting) - Global Forecast to 2022
Thermal adhesive is a type of thermally conductive glue used for electronic components and heatsinks. Thermal adhesive is similar to thermal paste in that it is used for transferring heat from one surface to another. It is commonly used to bond heatsinks to motherboard chipsets and video card processors where there are no mounting holes to clamp a heatsink down. Thermally conductive adhesives offer superior heat dissipation for a wide range of electronic applications. Both one and two component systems are used. They include epoxies, silicones and elastomeric products. Thermally conductive adhesive are also used for managing heat in next-generation automotive applications, including power electronics for electric and hybrid electric vehicles.
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Automotive Temperature Sensor Market by Application (Engine, Exhaust, Seats), Product (Thermocouple, MEMS, IC Sensor), Usage, Technology, EV Application (Battery, Motor), EV Charging Tech (Wired, Wireless), Vehicle, and Region - Global Forecast to 2025
The automotive temperature sensor market is valued at USD 7.21 Billion in 2016 and is projected to grow at a CAGR of 5.58% during the forecast period, to reach USD 11.89 Billion by 2025. The report profiles the major players in the temperature sensor market. The key players in this market are Robert Bosch (Germany), Continental (Germany), Panasonic (Japan), Delphi (UK), TDK Corporation (Japan), Sensata (US), Texas Instruments (US), NXP (Netherlands), Analog Devices (US), and Microchip (US) among others.
- Published: February 2018
- Price: $ 4950
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Flexible Graphite Market by Type (Sheets, Foils, Tapes), Application (Gaskets & Seals, Thermal Management, Emi Shielding), End-Use Industry (Automotive, Aerospace, Electronics, Oil & Gas, Power & Energy), and Region - Global Forecast to 2030
The flexible graphite market is expected to grow from USD 0.35 billion in 2025 to USD 0.45 billion by 2030, at a CAGR of 5.5% during the forecast period. Major players in this market include SGL Carbon (Germany), Neograf (US), Mersen Property (France), Toyo Tanso Co., Ltd. (Japan), SEPCO, Inc. (US), East Carbon (China), Rex Sealing & Packing Industries Ltd. (India), HPMS Graphite (US), Sunpass Sealing Technology (Zhejiang) Co., Ltd. (US), Jinsun New Material Technology (China), Nippon Carbon Co., Ltd. (Japan), Uni Klinger Limited (India), Specialty Gaskets Inc (Canada), Jiangxi Dasen Technology Co., Ltd. (China), and EGC Enterprises Inc. (US).
- Published: May 2025
- Price: $ 4950
- TOC Available:
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