Here are relevant reports on : silicon-carbide-sic-power-device-market
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GaN Substrate Market Size, Share & Trends by Substrate Type (GaN-on-Sapphire, GaN-on-Silicon, GaN-on-SiC, GaN-on-GaN, GaN-on-Diamond), Wafer Size (2-inch, 4-inch, 6-inch, 8-inch), Device Type (Discrete, ICs), Doping Type, Application, End Use - Global Forecast to 2032
The global GaN substrate market is expected to be valued at USD 0.62 billion in 2026 and USD 1.25 billion by 2032, growing at a CAGR of 12.5% during the forecast period. The key players include Sumitomo Chemical Co., Ltd. (Japan), Mitsubishi Chemical Corporation (Japan), Shin-Etsu Chemical Co., Ltd. (Japan), IQE plc (UK), SOITEC (France), Wolfspeed Inc. (US), Infineon Technologies AG (Germany), Xiamen Powerway Advanced Material Co., Ltd. (China), NGK Corporation (Japan), and Kyma Technologies (US), among others.
- Published: July 2026
- Price: $ 4950
- TOC Available:
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Battery Management System (BMS) Semiconductor Market Size, Share, Growth Report & Trends by Battery Type (Lithium-ion, Lead Acid, Nickel-based, Solid-state Batteries), Technology (Silicon-based Semiconductor, Silicon Carbide, Gallium Nitride), Application & Region – Global Forecast to 2032
The global BMS semiconductor market was valued at USD 7.4 billion in 2025 and is projected to reach USD 18.5 billion by 2032, growing at a CAGR of 14.0% during the forecast period. Market expansion is being driven by accelerating electric vehicle adoption, increasing deployment of battery energy storage systems, growing focus on battery safety, and rising semiconductor content in advanced battery management architectures. The transition toward silicon carbide and AI-enabled battery monitoring platforms is further reshaping competitive dynamics across automotive, industrial, and energy storage ecosystems.
- Published: November 2026
- Price: $ 4950
- TOC Available:
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Semiconductor Ceramic Packaging Materials Market by Material (Alumina, Aluminum Nitride, Silicon Nitride, Silicon Carbide, Beryllium Oxide), Packaging Technology (Through-Hole Packages, Surface Mount Packages – Leaded, Surface Mount Packages – Leadless, Advanced Miniaturized Packages), End-use Industry (Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, Aerospace and Defense), & Region - Global Forecast to 2030
The semiconductor ceramic packaging materials market is expected to grow from USD 1.85 billion in 2025 to USD 2.78 billion by 2030, at a CAGR of 8.5% during the forecast period. To enable an in-depth understanding of the competitive landscape, the report includes the profiles of some of the top players in the semiconductor ceramic packaging materials market, including KYOCERA Corporation (Japan), CeramTec GmbH (Germany), CoorsTek (US), Materion Corporation (US), Resonac Holdings Corporation (Japan), NGK INSULATORS, LTD. (Japan), AGC Inc. (Japan), Morgan Advanced Materials (UK), MARUWA Co., Ltd. (Japan), and Tokuyama Corporation (Japan).
- Published: November 2025
- Price: $ 4950
- TOC Available:
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Industrial Wearables Market by Device Type (AR Glasses, VR Headsets, Smartwatches, Smart Bands), Industry (Automotive, Aerospace, Manufacturing, Oil & Gas, Power & Energy), Component, and Region - Global Forecast to 2025-2036
The global industrial wearables market was valued at USD 8.24 billion in 2025 and is estimated to reach USD 51.50 billion by 2036, at a CAGR of 16.5% between 2025 and 2036. Microsoft Corporation (US), Google (US), Seiko Epson Corporation (Japan), Vuzix (US), Magic Leap, Inc. (US), Apple Inc. (US), Fujitsu Ltd. (Japan), Honeywell International Inc. (US), Oculus VR (US), Samsung Electronics Co., Ltd. (South Korea), AsusTek Computer Inc. (Taiwan), Fitbit, Inc. (US), Fossil Group, Inc. (US), HTC Corporation (Taiwan), Olympus Corporation (Japan), Optinvent (France), RealWear (US), ThirdEye (US), Workerbase (Germany), and Zepcam (Netherlands) are among a few major players in the industrial wearables market.
- Published: November 2026
- Price: $ 4950
- TOC Available:
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Turboexpander Market by Loading Device (Compressor, Generator, and Oil Break), Application (Air Separation, and Hydrocarbon), End-User (Manufacturing, Oil & Gas, and Power Generation), and Region - Global Forecast to 2023
The global turboexpander market is expected to reach USD 390.8 Million by 2023 from ~FUSD 290.6 Million in 2018, at a CAGR of 6.61% during the forecast period. This market growth can be attributed to increasing share of natural gas in primary energy consumption and increasing focus of end users such as the manufacturing and oil & gas industries on energy efficiency. Turboexpanders are mainly used for the liquification of natural gases and in petrochemical applications such as hydrogen, nitrogen and ammonia purification and ethylene production. Increasing production of natural gas is expected to create the demand for turboexpander in hydrocarbon applications. So, rising natural gas production is expected to boost the demand for turboexpanders. To enable an in-depth understanding of the competitive landscape, the report includes the profiles of some of the top players in the turboexpander market including Atlas Copco (Sweden), BHGE (US), Cryostar (France), Air Products and Chemicals (US), and L.A. Turbine (US). These leading players are adopting various strategies to increase their market shares in the turboexpander market.
- Published: June 2018
- Price: $ 4950
- TOC Available:
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Ultra-low-power Microcontroller Market by Peripheral Device (Analog, Digital), Packaging Type (8-bit, 16-bit, 32-bit), End-use Application (Consumer Electronics, Healthcare, Automotive, Telecommunications, Manufacturing), Region - Global Forecast to 2030
The global ultra-low-power microcontroller market is expected to grow from USD 9.78 billion in 2025 to USD 15.27 billion by 2030, at a compound annual growth rate (CAGR) of 9.3% during the forecast period. The Key Players Infineon Technologies AG (Germany), NXP Semiconductors (Netherlands), Renesas Electronics Corporation (Japan), STMicroelectronics (Switzerland), and Microchip Technology Inc. (US).
- Published: September 2025
- Price: $ 4950
- TOC Available:
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Industrial Communication Market Size, Share, Growth & Trends by Fieldbus, Industrial Ethernet, Wireless, IO-Link, Router & WAP, Switch, Gateway, Communication Interface & Converter, Controller & Connector and Power Supply Device - Global Forecast to 2030
The global industrial communication market is expected to grow from USD 20.45 billion in 2025 to USD 26.06 billion by 2030, at a compound annual growth rate (CAGR) of 5.0% during the forecast period. The Key Players Cisco Systems, Inc. (US), Siemens (Germany), OMRON Corporation (Japan), Huawei Technologies Co., Ltd. (China), Rockwell Automation (US), Moxa Inc. (Taiwan), Belden Inc. (US), ABB (Switzerland), and Schneider Electric (France).
- Published: May 2025
- Price: $ 4950
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Hall Effect Device Market – By Type (Quantum, Spin, Quantum Spin& Anomalous), Applications (Industrial, Power, Automotive, Aerospace & Defense), Geography Analysis & Forecast (2014 - 2020)
- Published: November 2026
- Price: $ 4950
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China Semiconductor Market for Automotive by Component (Microcontroller, Power Semiconductor, Sensor & MEMS Device, Memory Chip, Analog & Mixed Signal IC), Global & China Semiconductor Export, Alternate Destination - Trends and Strategic Recommendation
China’s exports of automotive semiconductors reached USD 419.15 billion in 2024, from USD 280.81 billion in 2020, with a CAGR of 8.9%. The major players in the China semiconductor market for automotive include SMIC (SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION), GigaDevice Semiconductor Inc., Novosense Microelectronics, Silan Microelectronics, and HiSilicon.
- Published: June 2025
- Price: $ 4950
- TOC Available:
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Field Device Management Market by Offering (Hardware and Software), Deployment (Cloud and On-premises), Industry (Oil & Gas, Energy & Power, Chemicals, Pharmaceuticals, Automotive, Manufacturing), Protocol and Geography - Global Forecast to 2024
The field device management market is projected to grow from USD 1.3 billion in 2019 to USD 1.8 billion by 2024; it is expected to grow at a compound annual growth rate (CAGR) of 6.7%. Siemens AG (Siemens, Germany); Emerson Electric Co. (Emerson, US); ABB Group (ABB, Switzerland); Schneider Electric (Schneider Electric, France); Honeywell International Inc. (Honeywell, US); Rockwell Automation, Inc. (Rockwell, US); Yokogawa Electric Corporation (Yokogawa, Japan); OMRON Corporation (OMRON, Japan); Mitsubishi Electric Corporation (Mitsubishi Electric, Japan); Fanuc Corporation (Fanuc, Japan); Metso Corporation (Metso, Finland); Valmet Oyj (Valmet, Finland); Hamilton Company (Hamilton, US); Phoenix Contact GmbH & Co. KG (Phoenix Contact, Germany); Endress+Hauser AG (Endress+Hauser, Switzerland); Festo AG (Festo, Germany); Omega Engineering (Omega, UK); Hach (Hach, US); Azbil Corporation (Azbil Corporation, Japan); and Weidmüller (Weidmüller, Germany) are among a few major players in the field device management market.
- Published: May 2019
- Price: $ 4950
- TOC Available:
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