Here are relevant reports on : mems-gyroscope-market

• MEMS Combo Sensors Market Analysis and Forecast (2014-2020) – by Type of Imu’s (6-Axis, 7-Axis, and 9-Axis), by Application (Mobile Headsets, Media & PC Tablets, Fitness & Wearable’s, Gaming etc.) and Geography

  This report is focused on giving a detail quantitative analysis of the complete MEMS combo sensors market with regards to the market by type, application, and geography. It also gives in-depth analysis of market by geography that covers that market such as North America, Europe, APAC, and Rest of the World.

  • Published: January 2026
  • Price: $ 4950
  • TOC Available:

• RF MEMS Switch Market by Type (PIN Diode Switches, GaAs Switches, SOI & SOS Switches), Frequency Range (Upto 3 GHz, Upto 3 GHz, Above 20 GHz), Configuration (SPDT Switches, DPDT Switches), Application (Test and Mesurement, Wireless Communication, Radar Systems), End-use Industry (Consumer Electronics, Telecommunication, Automotive, Industrial), Region – Global Forcast to 2029

  The major players in the global RF MEMS Switch Market

  • Published: January 2026
  • Price: $ 4950
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• Hydrogen Detection Market by Electrochemical, Metal Oxide Semiconductor (MOS), Catalytic, Thermal Conductivity, Micro-Electromechanical Systems (MEMS), Detection Range (0-1000 ppm, 0-5000 ppm, 0-20,000 ppm, >0-20,000 ppm - Global Forecast to 2030

  The hydrogen detection market is expected to grow from USD 0.28 billion in 2025 to USD 0.50 billion by 2030, at a compound annual growth rate (CAGR) of 11.8% during the forecast period. The Key Players Teledyne Technologies Incorporated (US), Honeywell International (US), H2San (US), Figaro Engineering (Japan), Nissha FIS (Japan), MSA Safety (US), H2Sense (China), SGX Sensortech (Switzerland), Drägerwerk AG & Co. KGaA (Germany), and Alphasense (UK).

  • Published: July 2025
  • Price: $ 4950
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• 3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028

  The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).

  • Published: September 2023
  • Price: $ 4950
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• Silicon on Insulator Market by Smart Cut SOI, Bonding SOI, Layer Transfer SOI, RF-SOI, Power -SOI, FD-SOI, RF FEM, MEMS Devices, Optical Communication, Image Sensing Devices, Automotive and Military & Defense - Global Forecast to 2029

  The global silicon on insulator market is expected to grow from USD 1.29 billion in 2024 to USD 2.55 billion by 2029, at a compound annual growth rate (CAGR) of 14.7% during the forecast period.The key players SOITEC (France), Shin-Etsu Chemical Co., Ltd. (Japan), GlobalWafers (Taiwan), SUMCO Corporation (Japan), Shanghai Simgui Technology Co., Ltd. (China).

  • Published: September 2024
  • Price: $ 4950
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• Pressure Sensor Market by Sensing Method (Piezoresistive, Capacitive, Resonant Solid-State, Electromagnetic, Optical, MEMS, Acoustic), Type (Absolute, Gauge, Differential, Sealed, Vacuum), Range PSI (Up to 100, 101-1,000, <1,000) - Global Forecast to 2030

  The pressure sensor market is expected to grow from USD 13.07 billion in 2025 to USD 17.70 billion by 2030, at a compound annual growth rate (CAGR) of 6.2%during the forecast period. The Key Players Honeywell International Inc. (US), ABB (Switzerland), Emerson Electric Co. (US), Amphenol Corporation (US), TE Connectivity (Switzerland), Sensata Technologies, Inc. (US), TT Electronics (UK), Rockwell Automation (US), Schneider Electric (France), Siemens (Germany), STMicroelectronics (Switzerland), Infineon Technologies AG (Germany), NXP Semiconductors (Netherlands).

  • Published: August 2025
  • Price: $ 4950
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• Timing Devices Market by Oscillators- MEMS (SPMO, TCMO, VCMO, FSMO, DCMO, SSMO), Crystal (SPXO, TCXO, VCXO, FCXO, OCXO, SSXO, HiFlex, MCXO), Ceramic; Atomic Clocks; Clock Generators; Clock Buffers and Jitter Attenuators - Global Forecast to 2030

  The timing devices market is expected to grow from USD 5.24 billion in 2024 to USD 7.59 billion by 2030, at a compound annual growth rate (CAGR) of 6.4% during the forecast period.The key players NIHON DEMPA KOGYO CO., LTD., (Japan), Seiko Epson Corporation (Japan), KYOCERA Corporation (Japan), TXC Corporation (Taiwan), Rakon Limited (New Zealand), and Infineon Technologies AG (Germany). Renesas Electronics Corporation (Japan), Microchip Technology Inc. (US), Texas Instruments Incorporated (US), Abracon (US), IQD Frequency Products Ltd. (UK), Vishay Intertechnology, Inc. (US), STMicroelectronics (Switzerland), SiTime Corp. (US), MtronPTI (US), CTS Corporation (US), Diodes Incorporated (US), ON Semiconductor Corporation (US), Crystek Corporation (US), Frequency Electronics, Inc. (US), Greenray Industries, Inc. (US), Oscilloquartz (Switzerland), AccuBeat Ltd. (Israel), Connor-Winfield Corporation (US), and Mercury Inc. (Taiwan).

  • Published: September 2024
  • Price: $ 4950
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• 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028

  The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).

  • Published: May 2023
  • Price: $ 4950
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• Hybrid Printing Market by Technology (UV Inkjet Printing, Water Based Printing, Solvent Printing, LED Curable, Dye Sublimation), Substrate (Textile & Fabric, Paper, Glass, Plastic, Metal), Application, End-use Industry and Region – Global Forecast to 2028

  The Hybrid Printing market is expected to grow from USD 5.5 billion in 2023 to USD 10.2 billion by 2028, at a compound annual growth rate (CAGR) of 13.2% during the forecast period. The key players FUJIFILM Holdings Corporation (Japan), HP Development Company, L.P (US), Ricoh (Japan), Konica Minolta (Japan), Bobst (Switzerland), Electronics For Imaging, Inc. (US), Seiko Epson (Japan), Koenig & Bauer AG (Germany).

  • Published: August 2023
  • Price: $ 4950
  • TOC Available:

• Ophthalmology PACS (Picture Archiving and Communication System) Market by Type (Standalone, Integrated), Delivery (On-premise, Cloud), End User (Hospitals, Specialty Clinic, ASC), Region (North America (US, Canada) Europe, Asia) - Global Forecasts to 2023

  The ophthalmology PACS market is projected to reach USD 160.2 million by 2023, at a CAGR of 8.5% during the forecast period. The growth of the ophthalmology market is driven by the rapid growth in the geriatric population, rising prevalence of eye diseases, limited number of ophthalmologists, government initiatives to encourage the adoption of EHR/EMR, and the increasing adoption of teleophthalmology. While the ophthalmology PACS market represents significant growth opportunities, market growth may be hindered due to the high implementation and maintenance costs of these solutions. The ophthalmology PACS market is marked by the presence of several big and small players. Prominent players in this market include Carl Zeiss Meditec AG (Germany), Topcon Corporation (Japan), Heidelberg Engineering (Germany), Sonomed Escalon (US), Visbion (UK), EyePACS (US), and IBM Corporation (Merge Healthcare) (US).

  • Published: August 2018
  • Price: $ 4950
  • TOC Available:

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