Here are relevant reports on : organ-on-chip-market

• Wi-Fi 6 Market by (Wireless Access Points, Mesh Routers, Home Gateways, Wireless Controllers, System on Chip), Applications (Immersive, HD Video Streaming, Smart Devices, Industry 4.0, Telemedicine, Public Wi-Fi & Dense Environments) – Forecast to 2030

  The Wi-Fi 6 market size is projected to reach USD 20.9 billion by 2028, at a Compound Annual Growth Rate (CAGR) of 29.3% during the forecast period. The major vendors covered in the Wi-Fi 6 market include Cisco Systems Inc. (US), Qualcomm Technologies Inc. (US), Broadcom Inc (US), Intel Corporation (US), Huawei technologies (China), NETGEAR Inc (US), Juniper Networks Inc (US), Extreme Networks Inc. (US), Ubiquiti Inc. (US), Fortinet Inc. (US), Aruba Networks (US), NXP Semiconductors (Netherlands), AT&T (US), D–Link Corporation (Taiwan), Alcatel Lucent Enterprise (France), TP–Link Corporation Limited (China), MediaTek Inc. (Taiwan), Telstra (Australia), Murata Manufacturing Co., Ltd. (Japan), Sterlite Technologies Limited (India), Renesas Electronics (Japan), H3C Technologies Co., Ltd. (China), Keysight Technologies (US), LitePoint (US), Rohde & Schwarz (Germany), Cambium Networks, Ltd. (US), Senscomm Semiconductors Co., Ltd. (China), XUNISON (Ireland), Redway Networks Ltd. Company (England), VSORA SAS (France), WILUS Inc. (South Korea), Federated Wireless, Inc. (US), Actiontec Electronics (US), ADB Global (Switzerland), SDMC Technology (China), and Edgewater Wireless (Canada).

  • Published: August 2023
  • Price: $ 4950
  • TOC Available:

• High Power LED Market by Packaging Type (Flip Chip, Mesa, and Vertical), Application (General Lighting, Automotive, Flash Lighting, Backlighting,) and Geography (APAC, North America, Europe, Rest of the World) - Global Forecast 2025-2036

  The global high power LED market was valued at USD 4.23 billion in 2025 and is estimated to reach USD 6.08 billion by 2036, at a CAGR of 3.4% between 2025 and 2036.. The major high power LED vendors include Cree (US), Nichia (Japan), OSRAM (Germany), Samsung (South Korea), Everlight (Taiwan), Lumileds (Netherlands), Epistar (Taiwan), LG Innotek (South Korea), Broadcom (US), MLS (China), and Seoul Semiconductor (South Korea). The other companies include Luckylight Electronics (China), Plessey Semiconductors (UK), Betlux Electronics (China), Effilux (France), Lite-On Technology (Taiwan), Crescent LED (UK), Vollong Electronics (China), and Stanley Electric (Switzerland).

  • Published: January 2026
  • Price: $ 4950
  • TOC Available:

• Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022

  The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The report aims at estimating the size and future growth potential of the flip chip technology market across different segments on the basis of bumping process, packaging technology, packaging type, product, application, and region.

  • Published: April 2016
  • Price: $ 4950
  • TOC Available:

• Semiconductor Bonding Market Size, Share & Industry Growth Analysis Report by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type, Technology and Region - Global Growth Driver and Industry Forecast to 2026

  The global semiconductor bonding market size is projected to reach USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% during the forecasting period. The semiconductor bonding market is dominated by a few globally established players such as Intel Corporation (US), Google. Inc (US), NVIDIA Corporation (US), Xilinx Inc. (US), IBM Corporation (US), Advanced Micro Devices, Inc (US), Marvell Technology (Hamilton), and Qualcomm Technology (US).

  • Published: September 2021
  • Price: $ 4950
  • TOC Available:

• MEMS Oscillator Market by Packaging Type (Surface-Mount Device Package and Chip-Scale Package), Band (MHz and kHz), General Circuitry (SPMO, TCMO, VCMO, FSMO, DCMO, and SSMO), Application, and Geography - Global Forecast to 2022

  The overall MEMS oscillator market was valued at USD 79.2 Million in 2016 and is expected to reach USD 802.8 Million by 2022, at a CAGR of 46.08% between 2017 and 2022. This report provides the size and future growth potential of the MEMS oscillator market across different segments such as packaging type, band, general circuitry, application, and geography. The study identifies and analyzes the market dynamics such as drivers, restraints, opportunities, and industry-specific challenges; and detailed value chain and Porter’s five forces analysis.

  • Published: February 2017
  • Price: $ 4950
  • TOC Available:

• Embedded Antenna Systems Market Size, Share and Industry Growth Analysis Report by Antenna Type (Chip, Patch, PCB Trace and FPC), Connectivity (Wi-Fi/Bluetooth, GNSS/GPS, Cellular, LPWAN, and UWB), End User, and Geography - Global Growth Driver and Industry Forecast to 2027

  The global embedded antenna systems market size is projected to reach USD 8.4 billion by 2027, it is anticipated to register a CAGR of 14.9% during the forecast period. The global embedded antenna systems market was valued at USD 3.2 billion in 2020 and is expected to reach USD 8.4 billion by 2027; it is anticipated to register a CAGR of 14.9% during the forecast period

  • Published: January 2022
  • Price: $ 4950
  • TOC Available:

• IoT Chip Market Size, Share by Hardware (Processor, Connectivity IC, Sensor, Memory Device and Logic Device), Power Consumption, End-use Application (Wearable Devices, Consumer Electronics, Building Automation and Retail) and Region - Global Forecast to 2025

  The IoT Chip Market is expected to grow from USD 392.0 billion in 2020 to USD 525.4 billion by 2025, at a CAGR of 6.0% during the forecast period. Key players in the IoT chip market are Intel Corporation (US), Texas Instruments Incorporated (US), Qualcomm Incorporated (US), NXP Semiconductors N.V. (Netherlands), MediaTek Inc. (Taiwan), Marvell Technology Group Ltd. (Bermuda), Microchip Technology Inc. (US), Cypress Semiconductor Corporation (US), Renesas Electronics Corporation (Japan), Huawei Technologies Co., Ltd. (China), NVIDIA Corporation (US), Samsung Electronics (South Korea), Advanced Micro Devices (US), STMicroelectronics N.V. (Switzerland), TE Connectivity Ltd (Switzerland), Nordic Semiconductor (Norway), GainSpan (US), Expressif Systems (China), Dialog Semiconductor (UK), and Silicon Labs (US). These players are increasingly undertaking product launches and developments and acquisitions to develop and introduce new technologies and products in the market.

  • Published: June 2020
  • Price: $ 7150
  • TOC Available:

• Al Chip Market By Offerings (GPU, CPU, FPGA, NPU, TPU, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory {DRAM (HBM, DDR)}, Network {NIC/Network Adapters, Interconnects}), Function (Training, Inference), & Region - Global Forecast to 2032

  The AI chip market is expected to grow from USD 203.24 billion in 2025 to USD 564.87 billion by 2032, at a compound annual growth rate (CAGR) of 15.7% during the forecast period. The Key Players NVIDIA Corporation (US), Advanced Micro Devices, Inc. (AMD) (US), Intel Corporation (US), Micron Technology, Inc. (US), Google (US), Qualcomm Technologies, Inc. (US), Apple Inc. (US), Huawei Technologies Co., Ltd. (China), SK Hynix Inc. (South Korea), Samsung (South Korea), Imagination Technologies (UK), Graphcore (UK), and Cerebras (US).

  • Published: December 2025
  • Price: $ 4950
  • TOC Available:

• Data Center Coolant Distribution Units Market by Type (In-Row, In-Rack, FDU), Cooling Type (Direct to Chip Cooling, Immersion Cooling), End User (Colocation Providers, Enterprises, Hyperscale), and Region Global Forecast to 2032

  The data center coolant distribution units market is expected to grow from USD 1.05 billion in 2025 to USD 7.74 billion by 2032, at a CAGR of 33.0% during the forecast period. Leading players in this market include DCX Liquid Cooling Systems (Poland), nVent (US), NIDEC CORPORATION (Japan), Schneider Electric (France), Vertiv Group Corp. (US), KAORI HEAT TREATMENT CO., LTD. (Taiwan), Shenzhen Envicool Technology Co., Ltd. (China), Boyd (US), Delta Electronics, Inc. (Taiwan), Coolcentric (US), Hewlett Packard Enterprise Development LP (US), LiquidStack Holding B.V. (US), Shanghai Venttech Refrigeration Equipment Co.,Ltd. (China), Chilldyne, Inc. (US), COOLIT SYSTEMS (Canada), Trane (Ireland), Munters Group AB (Sweden), Lenovo (China), Super Micro Computer, Inc. (US), STULZ GMBH (Germany), Rittal GmbH & Co. KG (Germany), LITE-ON Technology Corporation (Taiwan), FläktGroup (Germany), and Nautilus Data Technologies (US).

  • Published: September 2025
  • Price: $ 4950
  • TOC Available:

• Medical Laboratory Technology Market by Type, End-Use Industry, Application, and Region – Global Forecast to 2030

  The medical laboratory technology market plays a crucial role in healthcare by providing diagnostic and laboratory testing services that aid in disease detection, monitoring, and treatment decisions.

  • Published: January 2026
  • Price: $ 4950
  • TOC Available:

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