Here are relevant reports on : organ-on-chip-market
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Data Center Liquid Cooling Valves Market by Valve Type (Ball Valves, Control Valves, Butterfly Valves, Check Valves, Pressure-Relief Valves), Cooling Type (Immersion, Direct to Chip), Data Center Type (Hyperscale, Colocation, Enterprise), and Region - Global Forecast to 2032
The data center liquid cooling valves market is projected to grow from USD 0.27 billion in 2025 to USD 1.80 billion by 2032, at a CAGR of 30.8% during the forecast period. Some of the leading players in this market include Belimo (Switzerland), Danfoss (Denmark), Siemens (Germany), Schneider Electric (Germany), and Emerson Electric Co. (US).
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Data Center Heat Exchanger Market Size, Share & Trends by Type, Cooling Technology (Rear-Door Heat Exchangers, Direct-to-Chip Liquid Cooling, In-Row Cooling, Immersion Cooling, Free Cooling/Adiabatic Heat Exchangers), Application (Server & IT Hardware Cooling, Power Electronics Cooling, HVAC System Integration), Data Center Type (Hyperscale, Colocation, Enterprise, Edge & Micro), End User, and Region – Global Forecast to 2032
The global data center heat exchanger market was valued at USD 6.90 billion in 2025 and is projected to reach USD 14.40 billion by 2032, expanding at a compound annual growth rate of 11.1% during the forecast period 2026–2032.
- Published: September 2026
- Price: $ 4950
- TOC Available:
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South Korea AI Chip Market by Offerings (GPU, CPU, FPGA, NPU, TPU, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory {DRAM (HBM, DDR)}, Network {NIC/Network Adapters, Interconnects}), Function (Training, Inference), & Region - Forecast to 2032
The South Korea AI Chip market is projected to grow from USD 4.24 billion in 2025 and to reach USD 14.68 billion by 2032, at a CAGR of 19.4% during the forecast period. The key players include Samsung Electronics Co., Ltd. (South Korea), SK HYNIX INC. (South Korea), Intel Corporation (US), NVIDIA Corporation (US), Qualcomm Technologies, Inc. (US), Advanced Micro Devices, Inc. (US), Google (US), Amazon Web Services, Inc. (US), Microsoft (US), and Rebellions Inc. (South Korea).
- Published: August 2026
- Price: $ 4950
- TOC Available:
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Advanced Process Nodes Market by Node Size (= 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, = 10 nm), Packaging Technology (SiP, Flip-Chip, 2.5D/3D, WLCSP, FO), Processor Type (CPU, GPU, FPGA, ASIC, SoC), Architecture, Application, Region - Global Forecast to 2032
The major players in the global Advanced Process Nodes Market
- Published: September 2026
- Price: $ 4950
- TOC Available:
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Data Center Direct-to-Chip Coolants Market by Coolant Type (Water-Glycol Mixture, Dielectric Fluids, Refrigerants), Cooling Technology (Single-phase, Two-phase), Data Center Type (Hyperscale, Colocation, Enterprises), and Region - Global Forecast to 2032
The global data center direct-to-chip coolants market is projected to grow from USD 0.18 billion in 2026 to USD 1.30 billion by 2032, at a CAGR of 38.6% over the forecast period. Some of the leading players in this market include Shell plc (UK), The Chemours Company (US), Castrol Limited (UK), Inventec Performance Chemicals (France), and Valvoline Global Operations (US).
- Published: May 2026
- Price: $ 4950
- TOC Available:
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Data Center Valve Market Size, Share & Trends by Valve Type (Ball, Butterfly, Globe), Cooling Type (Air Cooling, Direct-to-Chip Liquid Cooling, Immersion Cooling), Data Center Type (Hyperscale, Colocation, Enterprise, Edge), Material, Application - Global Forecast to 2032
The global data center valve market was valued at approximately USD 1.10 billion in 2025 and is projected to reach nearly USD 2.70 billion by 2032, expanding at a CAGR of 13.7% between 2026 and 2032. Growth is being fueled by the rapid expansion of AI-ready data centers, increasing deployment of liquid cooling systems, rising rack power densities, and growing demand for precision thermal management infrastructure.
- Published: September 2026
- Price: $ 4950
- TOC Available:
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Cryogenic Chip Market Size, Share, and Trends by Type (Cryo-CMOS Chips, Superconducting Logic Chips, Cryogenic Amplifier Chips), Technology Node (7 nm–22 nm, Below 7 nm), Operating Temperature, Application, End User, and Region - Global Forecast to 2032
The global cryogenic chip market was valued at USD 1.22 billion in 2025 and is projected to reach USD 2.70 billion by 2032, expanding at a compound annual growth rate (CAGR) of 12.0% during the forecast period 2026–2032. This robust trajectory is anchored by the accelerating commercialization of quantum computing, where superconducting qubit processors require highly specialized chips capable of operating at temperatures close to absolute zero — from 4 Kelvin down to the millikelvin range. As quantum hardware scales from laboratory prototypes toward fault-tolerant systems, demand for cryo-CMOS control chips, superconducting logic chips, and cryogenic amplifier ICs is transitioning from niche research procurement to a structured, investable market.
- Published: September 2026
- Price: $ 4950
- TOC Available:
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Semiconductor Grade Encapsulants Market Size, Share & Growth Report by Material Type (Epoxy-Based Encapsulants, Silicone-Based Encapsulants), Epoxy Resin, Silicone, MEMS & Sensors, Wire Bonding and Flip Chip Packaging, Consumer Electronics, Automotive - Global Forecast to 2032
The global semiconductor grade encapsulants market was valued at approximately USD 3.79 billion in 2025 and is projected to reach USD 5.62 billion by 2032, registering a compound annual growth rate (CAGR) of approximately 5.8% during the forecast period 2026 to 2032. This growth is being driven primarily by the explosive proliferation of advanced semiconductor packaging technologies — including 2.5D and 3D integration, fan-out wafer-level packaging, and system-in-package architectures — that are, in turn, accelerating demand for high-performance encapsulants capable of protecting increasingly complex and thermally stressed die configurations in AI, high-performance computing, automotive, and 5G applications.
- Published: September 2026
- Price: $ 4950
- TOC Available:
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Liquid Cooled Server Market Size, Share & Trends by Server Type (Direct-to-Chip Liquid Cooled, Rear Door Heat Exchanger Enabled, Immersion Ready, Hybrid Cooled Liquid Servers), Cooling Method (Single Phase, Two-phase, Cold Plate-based, Immersion Cooling), End User & Region – Global Forecast to 2032
The global liquid cooled server market was valued at USD 4.44 billion in 2025 and is projected to reach USD 23.56 billion by 2032, growing at a CAGR of 26.9% from 2026 to 2032. The market is being pulled forward by AI cluster density, rising rack power demand, and the shift from air-only thermal designs to direct liquid architectures that can handle modern accelerated computing workloads.
- Published: September 2026
- Price: $ 4950
- TOC Available:
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Photonic Packaging Market Size, Share, Trends & Growth by Packaging Technology (Flip-Chip Bonding, Wire Bonding, Wafer-Level Packaging), Optical Transceivers, Lasers & Light Sources, Data Centers and High-Performance Computing, Hyperscale Cloud Providers- Global Forecast to 2032
Photonic Packaging Market
- Published: September 2026
- Price: $ 4950
- TOC Available:
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