Here are relevant reports on : fiber-optic-components-market
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Fibre-Optic Components Market, By Type(syndicated), Technology, Application & Geography – 2018
- Published: February 2026
- Price: $ 4950
- TOC Available:
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Fibre-Optic Components Market, By Type(syndicated), Technology, Application & Geography – 2018
- Published: February 2026
- Price: $ 4950
- TOC Available:
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Hybrid Fiber Coaxial Market by Technology (DOCSIS 3.0 & Below and DOCSIS 3.1), Component (CMTS/CCAP, Fiber Optic Cable, Amplifier, Optical Node, Optical Transceiver, Splitter, and CPE), and Geography - Global Forecast to 2023
The hybrid fiber coaxial (HFC) market is expected to reach USD 13.6 billion by 2023 from USD 9.6 billion in 2018, at a CAGR of 8.02% during 2018–2023. Major factors driving the market’s growth include high bandwidth and cost efficiency compared to other technologies. In line with this, the use of HFC has gained remarkable consideration for data transfer in IoT applications. However, factors such as troubleshooting and maintenance issues after deployment are restraining the market’s growth. The key HFC players in the market are Arris (US), Huawei (China), Nokia (Finland), Technicolor (France), Cisco (US), Corning, (US), Ciena (US), Comcast (US), CommScope (US), Teleste Corp. (Finland), Telstra Corp. (Australia), PCT International (US), ZTE (China), Comba (China), Skyworks (US), Vodafone (England), Vecima Networks (Canada), Technetix (UK), Infinera (US), Finisar (US), Bentley Systems (US), Bktel (Germany), C-COR Broadband (Australia), Verizon (US), Charter Communications (US), Cox Communications (US), Singtel Optus (China), Com Hem (Sweden), TDC (Denmark), Telecom Italia (Italy), and Telefonica (Spain).
- Published: January 2019
- Price: $ 4950
- TOC Available:
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Distributed Fiber Optic Sensor Market by Fiber Type (Single-Mode, Multimode), Operating Principle (OTDR, OFDR), Scattering Process (Rayleigh, Brillouin, and Raman Scattering Effects), Application (Temperature, Acoustic, Strain) - Global Forecast to 2030
The distributed fiber optic sensor market is expected to grow from USD 1,411.7 million in 2024 to USD 2,630.7 million by 2030, at a compound annual growth rate (CAGR) of 10.9% during the forecast period.The key players SLB (US), Halliburton (US), Yokogawa Electric Corporation (Japan), Weatherford (US), Luna Innovations Incorporated (US), OFS Fitel, LLC (US), Bandweaver (UK), Omnisens (Switzerland), AP Sensing (Germany), and DarkPulse Inc (US).
- Published: November 2024
- Price: $ 4950
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3D Weaving Market by Glass Fiber, Composite Textile, Spacer, Carbon Fiber, Customized 3D Weaving, Structural Components, Protective Materials, Reinforcements, Insulation, Thermal Protective Applications - Global Forecast to 2030
The global 3D weaving market is expected to grow from USD 32.8 million in 2025 to USD 59.7 million by 2030, at a compound annual growth rate (CAGR) of 12.7% during the forecast period. The key Players Lindauer DORNIER GmbH (Germany), Staubli International AG (Switzerland), Unspun (US), Hefei Fanyuan Instrument Co., Ltd (China), and VÚTS a.s. (Czech Republic).
- Published: July 2025
- Price: $ 4950
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Photonic Integrated Circuit (IC) & Quantum Computing Market (2012 – 2022): By Application (Optical Fiber Communication, Optical Fiber Sensors, Biomedical); Components (Lasers, Attenuators); Raw Materials (Silica on Silicon, Silicon on Insulator)
Photonic Integrated Circuits are electronic ICs which are put to use in integrating multiple optical components such as lasers, modulators, detectors, attenuators, multiplexers/de-multiplexers and optical amplifiers. Technically, it is an apparatus on a plane substrate where light is guided to the plane of the substrate from one optical component to the other. Photonic ICs increase the functionality of an electronic IC which is meant to integrate transistors, capacitors and transistors.
- Published: December 2012
- Price: $ 4950
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Photonic Sensor Market (2011 - 2016): Global Forecast - By Type (Laser, Biophotonic, Fiber Optic) & Application (Oil & Gas, Military & Aerospace, Energy & Infrastructure, Industrial Automation, Medical and Others)
The global photonic sensors market was worth $3.42 billion in 2010 and is expected to reach $8.17 billion by 2016 at a CAGR of 15.95% from 2011 to 2016. The European region holds the maximum share in photonic sensors market as of 2011; but APAC region is expected to contribute the major share in future on account of low manufacturing cost, cheap labor, and technological competence.
- Published: December 2011
- Price: $ 4950
- TOC Available:
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Temperature Sensor Market by Connectivity (Wired, Wireless), Contact Type (Thermocouple, Thermistor), Non-Contact Type (Infrared Temperature, Fiber Optic), Output (Digital, Analog), End Use Industry and Region - Global Forecast to 2030
The global temperature sensor market is expected to grow from USD 7.43 billion in 2025 to USD 8.94 billion by 2030, at a compound annual growth rate (CAGR) of 3.8% during the forecast period. The Key Players Honeywell International Inc. (US), TE Connectivity (Switzerland), Texas Instruments Incorporated (US), Endress+Hauser Group Services AG (Switzerland), Siemens (Germany), Emerson Electric Co. (US), Analog Devices, Inc. (US), Amphenol Corporation (US), WIKA Alexander Wiegand SE & Co. KG (Germany), and Microchip Technology Inc. (US).
- Published: June 2025
- Price: $ 4950
- TOC Available:
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Digital Substation Market by Transformers, Busbars, Circuit Breakers, Protection Relays, Switchgears, Interfacing Units, Fiber-optic Communication Networks, SCADA Systems, Transmission Substation and Distribution Substation - Global Forecast to 2030
The digital substation market is expected to grow from USD 14.41 billion in 2025 to USD 19.78 billion by 2030, at a compound annual growth rate (CAGR) of 6.5% during the forecast period. The Key Playres Hitachi Energy (Switzerland), Siemens Energy (Germany), GE Vernova (US), ABB Ltd. (Switzerland), Schneider Electric (France), Eaton Corporation (Ireland), Mitsubishi Electric Corporation (Japan), Toshiba Energy Systems & Solutions Corporation (Japan), Cisco Systems Inc. (US), and Honeywell International Inc. (US).
- Published: November 2025
- Price: $ 4950
- TOC Available:
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Asia Pacific Temperature Sensor Market by Connectivity (Wired, Wireless), Contact Type (Thermocouple, Thermistors, Resistive Temperature Detectors), Non-contact Type (Infrared Temperature, Fiber Optic), & Output (Digital, Analog) - Forecast to 2030
The Asia Pacific temperature sensor market is projected to grow from USD 3.58 billion in 2025 to USD 4.51 billion by 2030, at a CAGR of 4.7%. Key companies operating in the Asia Pacific temperature sensor market include Honeywell International Inc. (US), Texas Instruments Incorporated (US), TE Connectivity (Switzerland), Emerson Electric Co. (US), Analog Devices, Inc. (US), Amphenol Corporation (US), and Microchip Technology Inc. (US).
- Published: December 2025
- Price: $ 4950
- TOC Available:
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