Here are relevant reports on : flip-chip-market
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IC Packaging Technology Market - By Type(3D IC Packaging, Multi-Chip Packaging & System-in-Package), Technology, Application & Geography – 2018
- Published: February 2026
- Price: $ 4950
- TOC Available:
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Advanced Process Nodes Market by Node Size (= 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, = 10 nm), Packaging Technology (SiP, Flip-Chip, 2.5D/3D, WLCSP, FO), Processor Type (CPU, GPU, FPGA, ASIC, SoC), Architecture, Application, Region - Global Forecast to 2032
The major players in the global Advanced Process Nodes Market
- Published: February 2026
- Price: $ 4950
- TOC Available:
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System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
- Published: November 2017
- Price: $ 4950
- TOC Available:
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Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022
The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The report aims at estimating the size and future growth potential of the flip chip technology market across different segments on the basis of bumping process, packaging technology, packaging type, product, application, and region.
- Published: April 2016
- Price: $ 4950
- TOC Available:
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Semiconductor Bonding Market Size, Share & Industry Growth Analysis Report by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type, Technology and Region - Global Growth Driver and Industry Forecast to 2026
The global semiconductor bonding market size is projected to reach USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% during the forecasting period. The semiconductor bonding market is dominated by a few globally established players such as Intel Corporation (US), Google. Inc (US), NVIDIA Corporation (US), Xilinx Inc. (US), IBM Corporation (US), Advanced Micro Devices, Inc (US), Marvell Technology (Hamilton), and Qualcomm Technology (US).
- Published: September 2021
- Price: $ 4950
- TOC Available:
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High Power LED Market by Packaging Type (Flip Chip, Mesa, and Vertical), Application (General Lighting, Automotive, Flash Lighting, Backlighting,) and Geography (APAC, North America, Europe, Rest of the World) - Global Forecast 2025-2036
The global high power LED market was valued at USD 4.23 billion in 2025 and is estimated to reach USD 6.08 billion by 2036, at a CAGR of 3.4% between 2025 and 2036.. The major high power LED vendors include Cree (US), Nichia (Japan), OSRAM (Germany), Samsung (South Korea), Everlight (Taiwan), Lumileds (Netherlands), Epistar (Taiwan), LG Innotek (South Korea), Broadcom (US), MLS (China), and Seoul Semiconductor (South Korea). The other companies include Luckylight Electronics (China), Plessey Semiconductors (UK), Betlux Electronics (China), Effilux (France), Lite-On Technology (Taiwan), Crescent LED (UK), Vollong Electronics (China), and Stanley Electric (Switzerland).
- Published: February 2026
- Price: $ 4950
- TOC Available:
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Chip Antenna Market by Product Type (Dielectric Chip and LTCC Chip), Application Type (WLAN/WiFi, Bluetooth/BLE, Dual Band/Multi-Band, and GPS/GNSS), End-User Industry (Automotive, Healthcare, and Industrial & Retail) - Global Forecast to 2022
The chip antenna market is expected to be worth USD 2.99 Billion by 2022, growing at a CAGR of 13.1% between 2016 and 2022. A key factor driving the growth of this market is the increasing demand for chip antennas for IoT applications such as smart homes, smart grids, industrial internet, and connected cars. The dielectric chip antenna segment is estimated to hold the largest share in the chip antenna market, by product type.
- Published: September 2016
- Price: $ 4950
- TOC Available:
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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).
- Published: September 2023
- Price: $ 4950
- TOC Available:
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Wi-Fi 7 Market by Hardware (Access Point, Router, System on Chip), by Location Type (Indoor, Outdoor), by Applications (Immersive Technologies, HD Video Streaming, Smart Devices, Industry 4.0, Telemedicine, Public Wi-Fi & Dense Environments), by Solution (Access Point, Router, System on Chip) - Global Forecast to 2030
The Wi-Fi 7 market is projected to reach USD 24.2 billion by 2030, at a CAGR of 57.2% during the forecast period. The major vendors covered in the Wi-Fi 7 market Qualcomm (US), Broadcom (US), TP-Link (China), ZTE (China), Mediatek (Taiwan), Keysight Technologies (US), MaxLinear (US), Huawei (China), Commscope (US), Vantiva (France), LitePoint (US), Rohde & Schwarz (Germany), Intel (US), HFCL (India), Netgear (US), SDMC Technology (China), Senscomm Semiconductor (China), H3C (China), VVDN Technologies (India), Actiontec Electronics (US), ADB Global (Switzerland), Ruijie Networks (China), and Edgewater Wireless Systems (Canada).
- Published: June 2023
- Price: $ 4950
- TOC Available:
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High Throughput Screening Market / HTS Market by Offering (Instruments, Consumables (Reagents, Kits), Software, Services), Technology (Cell-based Assays, Lab-on-Chip, Label-free), Application (Drug Discovery, Life Sciences Research) - Global Forecast to 2029
The global high throughput screening market, valued at US$25.7 billion in 2023, stood at US$28.8 billion in 2024 and is projected to advance at a resilient CAGR of 11.8% from 2024 to 2029, culminating in a forecasted valuation of US$50.2 billion by the end of the period.Growth in this market is primarily driven by the growing adoption of open innovative models in pharmaceutical & biotechnology companies, & the growing availability of funds for research
- Published: July 2024
- Price: $ 4950
- TOC Available:
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