Here are relevant reports on : neuromorphic-chip-market
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GNSS Chip Market by Devices (Smartphones, In-Vehicle Systems, Tablets, Personal Navigation), Application (Location-Based Services, Navigation, Telematics, Surveying, Mapping, Timing & Synchronization), Vertical and Geography - Global Forecast to 2022
The GNSS chip market is expected to be valued at USD 5.22 Billion by 2022, growing at a CAGR of 7.9% between 2016 and 2022. Some of the factors driving the growth of the GNSS chip market include the high penetration of electronic, wearable, and connecting devices; increasing demand for accurate and real-time data; rising demand for high-speed Internet and network coverage such as 4G/5G; and growing popularity of IoT.
- Published: February 2017
- Price: $ 4950
- TOC Available:
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Chip Antenna Market by Product Type (Dielectric Chip and LTCC Chip), Application Type (WLAN/WiFi, Bluetooth/BLE, Dual Band/Multi-Band, and GPS/GNSS), End-User Industry (Automotive, Healthcare, and Industrial & Retail) - Global Forecast to 2022
The chip antenna market is expected to be worth USD 2.99 Billion by 2022, growing at a CAGR of 13.1% between 2016 and 2022. A key factor driving the growth of this market is the increasing demand for chip antennas for IoT applications such as smart homes, smart grids, industrial internet, and connected cars. The dielectric chip antenna segment is estimated to hold the largest share in the chip antenna market, by product type.
- Published: September 2016
- Price: $ 4950
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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).
- Published: September 2023
- Price: $ 4950
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Wi-Fi 7 Market by Hardware (Access Point, Router, System on Chip), by Location Type (Indoor, Outdoor), by Applications (Immersive Technologies, HD Video Streaming, Smart Devices, Industry 4.0, Telemedicine, Public Wi-Fi & Dense Environments), by Solution (Access Point, Router, System on Chip) - Global Forecast to 2030
The Wi-Fi 7 market is projected to reach USD 24.2 billion by 2030, at a CAGR of 57.2% during the forecast period. The major vendors covered in the Wi-Fi 7 market Qualcomm (US), Broadcom (US), TP-Link (China), ZTE (China), Mediatek (Taiwan), Keysight Technologies (US), MaxLinear (US), Huawei (China), Commscope (US), Vantiva (France), LitePoint (US), Rohde & Schwarz (Germany), Intel (US), HFCL (India), Netgear (US), SDMC Technology (China), Senscomm Semiconductor (China), H3C (China), VVDN Technologies (India), Actiontec Electronics (US), ADB Global (Switzerland), Ruijie Networks (China), and Edgewater Wireless Systems (Canada).
- Published: June 2023
- Price: $ 4950
- TOC Available:
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Digital Signage Market Size, Share & Trends by Product (Video Walls, Kiosks, Billboards, Menu Boards, System-on-chip Displays), Resolution (4K, 8K, FHD, HD), Installation Location (Indoor, Outdoor), Software, Display Size, Application, and Region - Global Forecast to 2030
The digital signage market is expected to grow from USD 21.45 billion in 2025 to USD 28.88 billion by 2030, registering a CAGR of 6.1%. The key players SAMSUNG (South Korea), LG Electronics (South Korea), Sharp NEC Display Solutions (Japan), LEYARD (China), Sony Group Corporation (Japan), Barco (Belgium), Panasonic Corporation (Japan), AUO Corporation (Taiwan), Shanghai Xianshi Electronic Technology Co., Ltd. (China), and BrightSign LLC (US).
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Advanced Process Nodes Market by Node Size (= 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, = 10 nm), Packaging Technology (SiP, Flip-Chip, 2.5D/3D, WLCSP, FO), Processor Type (CPU, GPU, FPGA, ASIC, SoC), Architecture, Application, Region - Global Forecast to 2032
The major players in the global Advanced Process Nodes Market
- Published: March 2026
- Price: $ 4950
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3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).
- Published: May 2023
- Price: $ 4950
- TOC Available:
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Chip Scale Package (CSP) LED Market by Application (Backlighting Unit (BLU), Flash Lighting, General Lighting, Automotive, Others), Power Range (Low- & Mid-Power, and High-Power), and Geography (APAC, North America, Europe, RoW) - Global Forecast to 2025-2036
Chip-scale package (CSP) LEDs are the latest trend in the LED package market. According to IPC's standard J-STD-012 (implementation of flip chip and chip scale technology), to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die, and it must be a single-die and direct surface mountable package. Major players in the market are Lumileds (The Netherlands), Samsung (South Korea), Seoul Semiconductor (South Korea), LG Innotek (South Korea), OSRAM (Germany), Nichia (Japan), EPISTAR (Taiwan), Cree (US), Genesis Photonics (Taiwan), and Lumens (South Korea).
- Published: March 2026
- Price: $ 4950
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Micro Battery Market Size, Share & Industry Trends Growth Analysis Report by Type (Thin Film, Printed, Solid-state Chip, Button), Capacity (Below 10 mAh, 10 to 100 mAh, Above 100 mAh), Battery Type (Primary, Secondary), Application (Smart cards, Wireless Sensors) and Region - Global Forecast to 2028
The global micro battery market is expected to grow from USD 0.5 billion in 2023 to USD 1.3 billion by 2028, at a compound annual growth rate (CAGR) of 22.4% during the forecast period.The key players Cymbet Corporation (US), Enfucell (Finland), Ultralife Corporation (US), Molex, LLC (US), Panasonic Holdings Corporation (Japan), Murata Manufacturing Co., Ltd. (Japan), TDK Corporation (Japan), Maxell, Ltd. (Japan), VARTA AG (Germany), Renata SA (Switzerland), and Duracell Inc. (US) among others.
- Published: July 2023
- Price: $ 4950
- TOC Available:
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Advanced Tires Market by Type (Pneumatic, Run-Flat, Airless), Technology (Self-Inflating, Chip-Embedded, Multi-chamber, All-in-one, Self-Sealing), Vehicle (ICE, Electric, Hybrid, Off-highway), Niche Technology, Material & Region - Global Forecast to 2030
The advanced tires market is projected to reach USD 3.2 billion by 2030, at a CAGR of 14.4% during the forecast period. The advanced tire market is dominated by several global and regional players. Some of the manufacturers in the advanced tires market are Bridgestone Corporation (Japan), Michelin (France), Continental AG (Germany), Pirelli & C. S.p.A (Italy), The Goodyear Tyre and Rubber Company (US), Sumitomo Rubber Industries Ltd (Japan), Yokohama Tire Corporation (Japan), Hankook Tire & Technology Co., Ltd., (South Korea), and Nokian Tyres plc (Finland).
- Published: May 2023
- Price: $ 4950
- TOC Available:
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