Here are relevant reports on : neuromorphic-chip-market
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Chip Antenna Market by Product Type (Dielectric Chip and LTCC Chip), Application Type (WLAN/WiFi, Bluetooth/BLE, Dual Band/Multi-Band, and GPS/GNSS), End-User Industry (Automotive, Healthcare, and Industrial & Retail) - Global Forecast to 2022
The chip antenna market is expected to be worth USD 2.99 Billion by 2022, growing at a CAGR of 13.1% between 2016 and 2022. A key factor driving the growth of this market is the increasing demand for chip antennas for IoT applications such as smart homes, smart grids, industrial internet, and connected cars. The dielectric chip antenna segment is estimated to hold the largest share in the chip antenna market, by product type.
- Published: September 2016
- Price: $ 4950
- TOC Available:
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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).
- Published: September 2023
- Price: $ 4950
- TOC Available:
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Micro Battery Market Size, Share & Industry Trends Growth Analysis Report by Type (Thin Film, Printed, Solid-state Chip, Button), Capacity (Below 10 mAh, 10 to 100 mAh, Above 100 mAh), Battery Type (Primary, Secondary), Application (Smart cards, Wireless Sensors) and Region - Global Forecast to 2028
The global micro battery market is expected to grow from USD 0.5 billion in 2023 to USD 1.3 billion by 2028, at a compound annual growth rate (CAGR) of 22.4% during the forecast period.The key players Cymbet Corporation (US), Enfucell (Finland), Ultralife Corporation (US), Molex, LLC (US), Panasonic Holdings Corporation (Japan), Murata Manufacturing Co., Ltd. (Japan), TDK Corporation (Japan), Maxell, Ltd. (Japan), VARTA AG (Germany), Renata SA (Switzerland), and Duracell Inc. (US) among others.
- Published: July 2023
- Price: $ 4950
- TOC Available:
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Digital Signage Market Size, Share, Trends & Industry Growth Analysis Report ,by Product (Video Walls, Kiosks, Billboards, System-on-chip), Displays, Resolution (4K, 8K, FHD, HD), Software, Display Size, Application and Region - Global Forecast to 2029
The global digital signage market is expected to grow from USD 20.1 Billion in 2024 to USD 27.3 billion by 2029, at a compound annual growth rate (CAGR) of 6.3% during the forecast period.The key players Samsung Electronics Co., Ltd. (South Korea), LG Electronics (South Korea), Sharp NEC Display Solutions (Japan), LEYARD (China), Sony Group Corporation (Japan), Barco (Belgium), Panasonic Corporation (Japan), AUO Corporation (Taiwan), Shanghai Xianshi Electronic Technology Co., Ltd (China) and BrightSign LLC (US).
- Published: July 2024
- Price: $ 4950
- TOC Available:
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3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).
- Published: May 2023
- Price: $ 4950
- TOC Available:
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DLP Projector Market by Light Source (Lamp, LED, and Laser), Chip Model, by Brightness, Throw Distance (Normal Throw, Short Throw, and Ultra-short Throw), Application, and by Geography (The Americas, Europe, APAC, and RoW) - Global Forecast to 2020
The DLP projector market is estimated to reach USD 5.52 Billion by 2020, at a CAGR of 6.3% between 2015 and 2020. This report estimates the market size and future growth potential of the DLP projector market across different segments such as light source, chip model, brightness, throw distance, application, and geography. The base year considered for the study is 2014 and the market size is forecasted for the period between 2015 and 2020. The increase in the number of digital screens in the film industry, growing digitalization in the education sector, and increasing adoption of 3D projection in emerging applications are the factors that are expected to drive the market during the forecast period.
- Published: December 2015
- Price: $ 4950
- TOC Available:
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Chip Scale Package (CSP) LED Market by Application (Backlighting Unit (BLU), Flash Lighting, General Lighting, Automotive, Others), Power Range (Low- & Mid-Power, and High-Power), and Geography (APAC, North America, Europe, RoW) - Global Forecast to 2025-2036
Chip-scale package (CSP) LEDs are the latest trend in the LED package market. According to IPC's standard J-STD-012 (implementation of flip chip and chip scale technology), to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die, and it must be a single-die and direct surface mountable package. Major players in the market are Lumileds (The Netherlands), Samsung (South Korea), Seoul Semiconductor (South Korea), LG Innotek (South Korea), OSRAM (Germany), Nichia (Japan), EPISTAR (Taiwan), Cree (US), Genesis Photonics (Taiwan), and Lumens (South Korea).
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Advanced Process Nodes Market by Node Size (= 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, = 10 nm), Packaging Technology (SiP, Flip-Chip, 2.5D/3D, WLCSP, FO), Processor Type (CPU, GPU, FPGA, ASIC, SoC), Architecture, Application, Region - Global Forecast to 2032
The major players in the global Advanced Process Nodes Market
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Advanced Tires Market by Type (Pneumatic, Run-Flat, Airless), Technology (Self-Inflating, Chip-Embedded, Multi-chamber, All-in-one, Self-Sealing), Vehicle (ICE, Electric, Hybrid, Off-highway), Niche Technology, Material & Region - Global Forecast to 2030
The advanced tires market is projected to reach USD 3.2 billion by 2030, at a CAGR of 14.4% during the forecast period. The advanced tire market is dominated by several global and regional players. Some of the manufacturers in the advanced tires market are Bridgestone Corporation (Japan), Michelin (France), Continental AG (Germany), Pirelli & C. S.p.A (Italy), The Goodyear Tyre and Rubber Company (US), Sumitomo Rubber Industries Ltd (Japan), Yokohama Tire Corporation (Japan), Hankook Tire & Technology Co., Ltd., (South Korea), and Nokian Tyres plc (Finland).
- Published: May 2023
- Price: $ 4950
- TOC Available:
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System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
- Published: November 2017
- Price: $ 4950
- TOC Available:
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