Here are relevant reports on : mems-microphone-market
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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).
- Published: September 2023
- Price: $ 4950
- TOC Available:
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MEMS Combo Sensors Market Analysis and Forecast (2014-2020) – by Type of Imu’s (6-Axis, 7-Axis, and 9-Axis), by Application (Mobile Headsets, Media & PC Tablets, Fitness & Wearable’s, Gaming etc.) and Geography
This report is focused on giving a detail quantitative analysis of the complete MEMS combo sensors market with regards to the market by type, application, and geography. It also gives in-depth analysis of market by geography that covers that market such as North America, Europe, APAC, and Rest of the World.
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Solid-state LiDAR Market By Type (MEMS-Based Scanning, Optical Phased Arrays, Flash LiDAR), End-Use Application (Corridor Mapping, Engineering, Environment, ADAS & Driverless Cars, Exploration, Urban Planning), and Region - Global Forecast to 2030
The solid-state LiDAR market is expected to grow from USD 0.50 billion in 2025 to USD 3.20 billion by 2030, at a compound annual growth rate (CAGR) of 45.0% during the forecast period. The key Players Robosense (China), Hesai Group (China), Luminar Technologies Inc. (US), Sick AG (Germany), Innoviz Technologies (Israel), LeddarTech (Canada), Quanergy Systems (US), Ouster (US), Cepton Technologies (US), and Aeva Technologies Inc. (US).
- Published: December 2025
- Price: $ 4950
- TOC Available:
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RF MEMS Switch Market by Type (PIN Diode Switches, GaAs Switches, SOI & SOS Switches), Frequency Range (Upto 3 GHz, Upto 3 GHz, Above 20 GHz), Configuration (SPDT Switches, DPDT Switches), Application (Test and Mesurement, Wireless Communication, Radar Systems), End-use Industry (Consumer Electronics, Telecommunication, Automotive, Industrial), Region – Global Forcast to 2029
The major players in the global RF MEMS Switch Market
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Silicon on Insulator Market by Smart Cut SOI, Bonding SOI, Layer Transfer SOI, RF-SOI, Power -SOI, FD-SOI, RF FEM, MEMS Devices, Optical Communication, Image Sensing Devices, Automotive and Military & Defense - Global Forecast to 2029
The global silicon on insulator market is expected to grow from USD 1.29 billion in 2024 to USD 2.55 billion by 2029, at a compound annual growth rate (CAGR) of 14.7% during the forecast period.The key players SOITEC (France), Shin-Etsu Chemical Co., Ltd. (Japan), GlobalWafers (Taiwan), SUMCO Corporation (Japan), Shanghai Simgui Technology Co., Ltd. (China).
- Published: September 2024
- Price: $ 4950
- TOC Available:
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Pressure Sensor Market by Sensing Method (Piezoresistive, Capacitive, Resonant Solid-State, Electromagnetic, Optical, MEMS, Acoustic), Type (Absolute, Gauge, Differential, Sealed, Vacuum), Range PSI (Up to 100, 101-1,000, <1,000) - Global Forecast to 2030
The pressure sensor market is expected to grow from USD 13.07 billion in 2025 to USD 17.70 billion by 2030, at a compound annual growth rate (CAGR) of 6.2%during the forecast period. The Key Players Honeywell International Inc. (US), ABB (Switzerland), Emerson Electric Co. (US), Amphenol Corporation (US), TE Connectivity (Switzerland), Sensata Technologies, Inc. (US), TT Electronics (UK), Rockwell Automation (US), Schneider Electric (France), Siemens (Germany), STMicroelectronics (Switzerland), Infineon Technologies AG (Germany), NXP Semiconductors (Netherlands).
- Published: August 2025
- Price: $ 4950
- TOC Available:
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Timing Devices Market by Oscillators- MEMS (SPMO, TCMO, VCMO, FSMO, DCMO, SSMO), Crystal (SPXO, TCXO, VCXO, FCXO, OCXO, SSXO, HiFlex, MCXO), Ceramic; Atomic Clocks; Clock Generators; Clock Buffers and Jitter Attenuators - Global Forecast to 2030
The timing devices market is expected to grow from USD 5.24 billion in 2024 to USD 7.59 billion by 2030, at a compound annual growth rate (CAGR) of 6.4% during the forecast period.The key players NIHON DEMPA KOGYO CO., LTD., (Japan), Seiko Epson Corporation (Japan), KYOCERA Corporation (Japan), TXC Corporation (Taiwan), Rakon Limited (New Zealand), and Infineon Technologies AG (Germany). Renesas Electronics Corporation (Japan), Microchip Technology Inc. (US), Texas Instruments Incorporated (US), Abracon (US), IQD Frequency Products Ltd. (UK), Vishay Intertechnology, Inc. (US), STMicroelectronics (Switzerland), SiTime Corp. (US), MtronPTI (US), CTS Corporation (US), Diodes Incorporated (US), ON Semiconductor Corporation (US), Crystek Corporation (US), Frequency Electronics, Inc. (US), Greenray Industries, Inc. (US), Oscilloquartz (Switzerland), AccuBeat Ltd. (Israel), Connor-Winfield Corporation (US), and Mercury Inc. (Taiwan).
- Published: September 2024
- Price: $ 4950
- TOC Available:
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3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).
- Published: May 2023
- Price: $ 4950
- TOC Available:
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Inertial Measurement Unit Market Size, Share, Trends & Growth Analysis by Component (Accelerometer, Gyroscope, Magnetometer, Others), Grade (Marine, Navigation, Tactical, Space, Commercial), Technology (MO, RLG, FOG, MEMS, Others), Platform, End User, and Region - Global Forecast
The inertial measurement unit market is expected to grow from USD 21.3 billion in 2021 to USD 40.7 billion by 2026, at a CAGR of 13.8% during the forecast period. Key players have adopted various organic and inorganic strategies to strengthen their position in the inertial measurement unit market. The major players include General Electric (US), Honeywell (US), Bosch (Germany), Safran (France), and Northrop Grumman (US). These players have adopted various strategies, such as acquisitions, contracts, new product launches, and partnerships & agreements, to expand their presence in the market further.
- Published: February 2022
- Price: $ 4950
- TOC Available:
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Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029
The global interposer and FOWLP market size is expected to grow from USD 35.6 billion in 2024 to USD 63.5 billion by 2029, at a compound annual growth rate (CAGR) of 12.3% during the forecast period.The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea).
- Published: January 2024
- Price: $ 4950
- TOC Available:
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