Here are relevant reports on : neuromorphic-chip-market
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System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
- Published: November 2017
- Price: $ 4950
- TOC Available:
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DLP Projector Market by Light Source (Lamp, LED, and Laser), Chip Model, by Brightness, Throw Distance (Normal Throw, Short Throw, and Ultra-short Throw), Application, and by Geography (The Americas, Europe, APAC, and RoW) - Global Forecast to 2020
The DLP projector market is estimated to reach USD 5.52 Billion by 2020, at a CAGR of 6.3% between 2015 and 2020. This report estimates the market size and future growth potential of the DLP projector market across different segments such as light source, chip model, brightness, throw distance, application, and geography. The base year considered for the study is 2014 and the market size is forecasted for the period between 2015 and 2020. The increase in the number of digital screens in the film industry, growing digitalization in the education sector, and increasing adoption of 3D projection in emerging applications are the factors that are expected to drive the market during the forecast period.
- Published: December 2015
- Price: $ 4950
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MEMS Oscillator Market by Packaging Type (Surface-Mount Device Package and Chip-Scale Package), Band (MHz and kHz), General Circuitry (SPMO, TCMO, VCMO, FSMO, DCMO, and SSMO), Application, and Geography - Global Forecast to 2022
The overall MEMS oscillator market was valued at USD 79.2 Million in 2016 and is expected to reach USD 802.8 Million by 2022, at a CAGR of 46.08% between 2017 and 2022. This report provides the size and future growth potential of the MEMS oscillator market across different segments such as packaging type, band, general circuitry, application, and geography. The study identifies and analyzes the market dynamics such as drivers, restraints, opportunities, and industry-specific challenges; and detailed value chain and Porter’s five forces analysis.
- Published: February 2017
- Price: $ 4950
- TOC Available:
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High Power LED Market by Packaging Type (Flip Chip, Mesa, and Vertical), Application (General Lighting, Automotive, Flash Lighting, Backlighting,) and Geography (APAC, North America, Europe, Rest of the World) - Global Forecast 2025-2036
The global high power LED market was valued at USD 4.23 billion in 2025 and is estimated to reach USD 6.08 billion by 2036, at a CAGR of 3.4% between 2025 and 2036.. The major high power LED vendors include Cree (US), Nichia (Japan), OSRAM (Germany), Samsung (South Korea), Everlight (Taiwan), Lumileds (Netherlands), Epistar (Taiwan), LG Innotek (South Korea), Broadcom (US), MLS (China), and Seoul Semiconductor (South Korea). The other companies include Luckylight Electronics (China), Plessey Semiconductors (UK), Betlux Electronics (China), Effilux (France), Lite-On Technology (Taiwan), Crescent LED (UK), Vollong Electronics (China), and Stanley Electric (Switzerland).
- Published: March 2026
- Price: $ 4950
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Wi-Fi 6 Market by (Wireless Access Points, Mesh Routers, Home Gateways, Wireless Controllers, System on Chip), Applications (Immersive, HD Video Streaming, Smart Devices, Industry 4.0, Telemedicine, Public Wi-Fi & Dense Environments) – Forecast to 2030
The Wi-Fi 6 market size is projected to reach USD 20.9 billion by 2028, at a Compound Annual Growth Rate (CAGR) of 29.3% during the forecast period. The major vendors covered in the Wi-Fi 6 market include Cisco Systems Inc. (US), Qualcomm Technologies Inc. (US), Broadcom Inc (US), Intel Corporation (US), Huawei technologies (China), NETGEAR Inc (US), Juniper Networks Inc (US), Extreme Networks Inc. (US), Ubiquiti Inc. (US), Fortinet Inc. (US), Aruba Networks (US), NXP Semiconductors (Netherlands), AT&T (US), D–Link Corporation (Taiwan), Alcatel Lucent Enterprise (France), TP–Link Corporation Limited (China), MediaTek Inc. (Taiwan), Telstra (Australia), Murata Manufacturing Co., Ltd. (Japan), Sterlite Technologies Limited (India), Renesas Electronics (Japan), H3C Technologies Co., Ltd. (China), Keysight Technologies (US), LitePoint (US), Rohde & Schwarz (Germany), Cambium Networks, Ltd. (US), Senscomm Semiconductors Co., Ltd. (China), XUNISON (Ireland), Redway Networks Ltd. Company (England), VSORA SAS (France), WILUS Inc. (South Korea), Federated Wireless, Inc. (US), Actiontec Electronics (US), ADB Global (Switzerland), SDMC Technology (China), and Edgewater Wireless (Canada).
- Published: August 2023
- Price: $ 4950
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High Throughput Screening Market / HTS Market by Offering (Instruments, Consumables (Reagents, Kits), Software, Services), Technology (Cell-based Assays, Lab-on-Chip, Label-free), Application (Drug Discovery, Life Sciences Research) - Global Forecast to 2029
The global high throughput screening market, valued at US$25.7 billion in 2023, stood at US$28.8 billion in 2024 and is projected to advance at a resilient CAGR of 11.8% from 2024 to 2029, culminating in a forecasted valuation of US$50.2 billion by the end of the period.Growth in this market is primarily driven by the growing adoption of open innovative models in pharmaceutical & biotechnology companies, & the growing availability of funds for research
- Published: July 2024
- Price: $ 4950
- TOC Available:
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Organ-on-Chip Market by Organ Type (Liver, Kidney, Intestine, Lung, Heart), Products (Instruments, Consumable, Software), Services (Standard, Custom), Model Type, Application (Toxicology, Drug Discovery, Stem Cell), Purpose & Region - Global Forecast to 2029
The global organ-on-chip market, valued at US$89,202 thousand in 2023, stood at US$123,285 thousand in 2024 and is projected to advance at a resilient CAGR of 38.6% from 2024 to 2029, culminating in a forecasted valuation of US$631,073 thousand by the end of the period Growth in this market can mainly be attributed to the increasing government initiatives to reduce drug testing on animal models.
- Published: February 2024
- Price: $ 4950
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System-on-Chip (SoC) Market by Core Count (Single-core, Dual-core, Quad-core, Hexa-core, Octa-core), Core Architecture (ARM, X86, RISC-V), Device (Smartphone, Tablet, Laptop, Smart TV & STB, Infotainment System, Router, Gateway) - Global Forecast to 2029
The System-on-Chip (SoC) market size is expected to grow from USD 138.46 billion in 2024 to USD 205.97 billion by 2029, at a compound annual growth rate (CAGR) of 8.3% during the forecast period.The kay players Qualcomm Technologies, Inc. (US), MediaTek Inc. (Taiwan), Samsung (South Korea), Apple Inc. (US), Broadcom (US), Intel Corporation (US), Advanced Micro Devices, Inc. (US), NVIDIA Corporation (US), HiSilicon (China), Microchip Technology Inc. (US).
- Published: January 2025
- Price: $ 4950
- TOC Available:
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Al Chip Market By Offerings (GPU, CPU, FPGA, NPU, TPU, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory {DRAM (HBM, DDR)}, Network {NIC/Network Adapters, Interconnects}), Function (Training, Inference), & Region - Global Forecast to 2032
The AI chip market is expected to grow from USD 203.24 billion in 2025 to USD 564.87 billion by 2032, at a compound annual growth rate (CAGR) of 15.7% during the forecast period. The Key Players NVIDIA Corporation (US), Advanced Micro Devices, Inc. (AMD) (US), Intel Corporation (US), Micron Technology, Inc. (US), Google (US), Qualcomm Technologies, Inc. (US), Apple Inc. (US), Huawei Technologies Co., Ltd. (China), SK Hynix Inc. (South Korea), Samsung (South Korea), Imagination Technologies (UK), Graphcore (UK), and Cerebras (US).
- Published: December 2025
- Price: $ 4950
- TOC Available:
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Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022
The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The report aims at estimating the size and future growth potential of the flip chip technology market across different segments on the basis of bumping process, packaging technology, packaging type, product, application, and region.
- Published: April 2016
- Price: $ 4950
- TOC Available:
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