Here are relevant reports on : rf-semiconductors-market
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Arthroscopy Instruments Market by Type (Implants, Arthroscope, Visualization System, Surgical Shaver, RF Ablation, Fluid Management), Application (Knee, Hip, Shoulder), End User (Hospitals, Ambulatory Surgery Centers & Clinics) - Global Forecast to 2022
The global arthroscopy instruments market is projected to reach USD 5.61 Billion by 2022 from USD 4.17 Billion in 2017, at a CAGR of 6.1% during the forecast period. The high incidence of sport-related injuries; technological advancements in arthroscopy products; and efficient reimbursement systems in developed countries are some of the factors driving the growth of the market. The major players of the arthroscopy instruments market are Arthrex (US), Smith & Nephew (UK), DePuy Synthes (US), Stryker (US), Zimmer Biomet (US), CONMED (US), Medtronic (Ireland), Karl Storz (Germany), B. Braun (Germany), Olympus (Japan), Richard Wolf (Germany), MEDICON (Germany), Sklar (US), Millennium (US), and GPC Medical (India).
- Published: February 2018
- Price: $ 4950
- TOC Available:
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Military Transmit and Receive Module Market by Type (Gallium Nitride, Gallium Arsenide), Application, Frequency (Single-Band and Multi-Band), Communication Medium (Optical, RF, Hybrid), Platform, and Region - Global Forecast to 2028
The Military transmit and receive module market is expected to grow from USD 5.8 billion in 2023 to USD 7.7 billion by 2028, at a compound annual growth rate (CAGR) of 5.8% during the forecast period.The key players Northrop Grumman Corporation (US), Thales Group (France), L3Harris Technologies, Inc. (US), RTX Corporation (US), and CAES System LLC (US).
- Published: December 2023
- Price: $ 4950
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RF Gallium Nitride Market Size, Share, Statistics and Industry Growth Analysis Report by Device (Discrete RF Device, Integrated RF Device), wafer size, end user (Telecom Infrastructure, Satellite Communications, Military & Defense) and Region - Global Forecast to 2028
The global RF gallium nitride market is expected to grow from USD 1.3 billion in 2022 to USD 2.8 billion by 2028, at a compound annual growth rate (CAGR) of 12.9% during the forecast period.The key players Sumitomo Electric Device Innovations, Inc. (Japan), Qorvo, Inc. (US), WOLFSPEED, INC. (US), NXP Semiconductors (Netherlands), MACOM (US).
- Published: July 2023
- Price: $ 4950
- TOC Available:
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Wide Bandgap Semiconductors Market By Material ( Silicon Carbide (SiC),Gallium Nitride (GaN),Aluminum Nitride (AlN)), Device Type(Power Devices, Radio Frequency (RF) Devices), Vertical(Automotive, Consumer Electronics, Aerospace, IT & Telecommunications) Region (North America, Europe, Asia Pacific, ROW ) – Global Forecast To 2030
The major players in the global Wide Bandgap Semiconductors Market
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Silicon on Insulator Market by Smart Cut SOI, Bonding SOI, Layer Transfer SOI, RF-SOI, Power -SOI, FD-SOI, RF FEM, MEMS Devices, Optical Communication, Image Sensing Devices, Automotive and Military & Defense - Global Forecast to 2029
The global silicon on insulator market is expected to grow from USD 1.29 billion in 2024 to USD 2.55 billion by 2029, at a compound annual growth rate (CAGR) of 14.7% during the forecast period.The key players SOITEC (France), Shin-Etsu Chemical Co., Ltd. (Japan), GlobalWafers (Taiwan), SUMCO Corporation (Japan), Shanghai Simgui Technology Co., Ltd. (China).
- Published: September 2024
- Price: $ 4950
- TOC Available:
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System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
- Published: November 2017
- Price: $ 4950
- TOC Available:
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RF Duplexer Market by Material (Silicon, Gallium Arsenide and Silicon-Germanium ), by Component (RF Filter (RX/TX Filters), Surface Acoustic Wave (SAW) Filters, Bulk Acoustic Wave (BAW), Duplexers, Power Amplifiers, Antenna Switches and Demodulators and Others), by Application (Tablets , E-Readers, GPS Devices , Notebooks, Smart TV’s, Cellular Phones), and by Geography - Global Trends & Forecasts 2015 - 2020
According to the Report, One of the Major Drivers of the Market Is the Deployment of Lte Networks. The Evolution of Wireless Standards has Compelled Wireless Communication Device Manufacturers to Develop and Design Multi-Mode and Multi-Band Devices, Which, in Turn, Increase the Demand for Rf Duplexers in Wireless Communication Devices Such As Cellphones, and Tablets.
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Rotary and RF Rotary Joints Market Size, Share, Trends by Rotary Joints Type (Hydraulic, Pneumatic, Slip Rings, Fiber Optic), Channel (Single Passage, Multi Passage), RF Rotary Joints Type (Coaxial, Waveguide), Application, Industry and Region - Global Forecast to 2029
The global rotary and RF rotary joints market is expected to grow from USD 1.5 billion in 2024 to USD 1.9 billion in 2029, at a compound annual growth rate (CAGR) of 5.4% during the forecast period.The key players Moog Inc. (US), Kadant Inc. (US), Columbus McKinnon Corporation (US), Deublin Company (US), Dynamic Sealing Technologies Inc (US), Macartney Underwater Technology (Denmark), Cobham France SAS (France), Pasternack Enterprises Inc (US), Spinner GmbH (Germany), Spectrum Control (US).
- Published: August 2024
- Price: $ 4950
- TOC Available:
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RF Signal Chain Component Market Size, Share & Industry Trends Growth Analysis Report by Product (Filters, RF Amplifiers, Mixers, Power Dividers, Switches, Couplers, Phase Shifters), Frequency Band (Ku, Ka, L, S,C), Material (Gallium Arsenide, Gallium Nitride, Silicon, Silicon Germanium), Application and Region - Global Forecast to 2028
The global RF signal chain components market is expected to grow from USD 38.9 billion in 2022 to USD 80.0 billion by 2028, at a compound annual growth rate (CAGR) of 12.3% during the forecast period.The key players Qorvo, Inc. (US), Murata Manufacturing Co., Ltd. (Japan), Skyworks Solutions, Inc. (US), Broadcom (US), Analog Devices, Inc. (US), NXP Semiconductors (Netherlands), STMicroelectronics (Switzerland), CPI International (US), National Instruments Corp. (US), MACOM (US), Infineon Technologies AG (Germany), Mitsubishi Electric (Japan), Texas Instruments (TI) (US), Cobham Limited (UK), Astra Microwave Products Limited (India), Microchip Technology Inc. (US), MicroWave Technology, Inc. (US), Panasonic Holdings Corporation (Japan), Raytheon Technologies (US), Wolfspeed (US), APITech (US), Sumitomo Electric Industries, Ltd. (Japan), RFHIC Corporation (South Korea), Thales (France), VectraWave (France).
- Published: October 2023
- Price: $ 4950
- TOC Available:
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UV Tapes Market By Product Type (Polyolifin UV Tapes, Polyvinylchloride UV Tapes , Polyethylene Terephthalate, Other Product Types), Application (Wafer Dicing, Back grinding, Electronics Assembly, Other Applications), End-use Industry (Consumer Electronics, Semiconductors, Automotive, Other End-use Industries), and Region - Global Forecasts To 2030
The UV Tapes market is projected to grow from USD 400 million in 2024 to USD 690 million by 2030, at a CAGR of 9.5% between 2025 and 2030.
- Published: March 2026
- Price: $ 4950
- TOC Available:
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