Here are relevant reports on : high-density-interconnect-market
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Ethylene Vinyl Acetate Market by Type (Very low-density, Low-density, Medium-density, and High-density EVA), End-use Industry (Photovoltaic Panels, Footwear & Foams, Packaging, Agriculture), Application, and Region - Global Forecast to 2026
The ethylene vinyl acetate market is expected to grow from USD 9.7 Billion in 2021 to USD 13.6 Billion by 2026, at a compound annual growth rate (CAGR) of 6.8% during the forecast period.ExxonMobil Corporation (US), Dow Inc. (US), SIPCHEM (Saudi Arabia), Formosa Plastics Corporation (Taiwan),
- Published: September 2021
- Price: $ 4950
- TOC Available:
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Interconnects and Passive Components Market by Passive Components (Resistor, Capacitor, Inductor, Transformer, and Diode), Interconnect Type (PCB, Connector, Switch, Relay, Adapter, Terminal, Splice, and Socket), Application, and Region - Global Forecast to 2022
According to the MarketsandMarkets forecast, the interconnects and passive components market is expected to be valued at USD 187.55 Billion by 2022, growing at a CAGR of 4.41% between 2017 and 2022. The growth of the interconnects and passive components market is attributed to advancements in the industrial M2M communication technology and rising industrial automations, increasing demand for miniaturized and high-performance electronic devices, proliferation of automotive infotainment and consumer electronics, and high demand for passive component and interconnects in computing, communication and consumer electronics (3C) applications.
- Published: March 2017
- Price: $ 4950
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Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography - Global Forecast to 2027
The molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027, at a compound annual growth rate (CAGR) of 22.9% during the forecast period.The key players device (MID) market and analyzes their market shares. Players profiled in this report are Molex (US), TE Connectivity (Switzerland), Amphenol Corporation (US), LPKF Laser & Electronics (Germany), and Taoglas (Dublin), Harting (Germany), Arlington Plating Company (US), MID Solutions (Germany), 2E Mechatronic (Germany), KYOCERA AVX (US) and Johnan (Japan), Teprosa(Germany), Sunway Communication(China), Axon Cable(France), S2P (France), Suzhou Cicor Technology (China), TactoTek (Finland), DuraTech (US), Tekra (US), Yomura Technologies (Taiwan), MacDermid Alpha Electronics (US), Galtronics (US), Yazaki Corporation (Japan), Chogori Technology (Japan), Suzhou Zeeteq Electronics (Japan), Toyo Connectors (Japan) and SINOPLAST (China).
- Published: August 2022
- Price: $ 4950
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Telecom Cloud Billing Market by Type of Billing (Convergent, Prepaid, Postpaid, Interconnect), Cloud Platform, Deployment, End User, Service, Rate of Charging Mode, and Region - Global Forecast to 2021
The telecom cloud billing market size is expected to grow from USD 2.49 Billion in 2016 to USD 8.22 Billion by 2021, at a Compound Annual Growth Rate (CAGR) of 27.0% from 2016 to 2021. The telecom billing solutions include a wide array of activities ranging from the process of usage tracking for voice and data, aggregating, levying charges upon respective tariffs, generating invoices to the customers, enabling the customer relationship management through the various cloud based solutions on public, private, or hybrid cloud by the vendor (Operations Support Systems/Business Support System (OSS/BSS) provider) for various Mobile Network Operators (MNOs) all enabled by multi-tenancy.
- Published: January 2017
- Price: $ 4950
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Data Center Interconnect Market by Type (Products, Software, Services), Application (Real-Time Disaster Recovery and Business Continuity, Workload (VM) and Data (Storage) Mobility), End User and Region - 2026
According to MarketsandMarkets, the data center interconnect market is projected to reach USD 17.0 billion by 2026, it is expected to grow at a Compound Annual Growth Rate (CAGR) of 14.5 % during the forecast period. Key players in the data center interconnect market include Ciena Corporation (US), Nokia Corporation (Finland), Huawei Technologies (China), Juniper Network Inc. (US), Infinera Corporation (US), ADVA Optical Networking SE (Germany), CISCO Systems (US), Extreme Networks, Inc. (US), and Fujitsu Ltd. (Japan). Apart from these, XKL LLC (US), Ekinops S.A(France), Cologix (US), Pluribus Networks (US), Ranovus (Canada), Innovium (US), ZTE Corporation (China), Megaport (Australia), Flexential (US), Cyxtera Technologies (US), Fiber Mountain (US) are among a few emerging companies in the data center interconnect market.
- Published: January 2022
- Price: $ 4950
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Polybutadiene Market by Type (Solid Polybutadiene (High Cis, Low Cis, High Trans, High Vinyl), Liquid Polybutadiene), Application (Tires, Polymer modification, Industrial rubber, Chemical), and Region - Global Forecast to 2024
The global polybutadiene market size is expected to be grow USD 13.8 billion by 2024, at a CAGR of 5.1% during the forecast period. ARALNXEO (Netherlands), UBE Industries Ltd (Japan), JSR Corporation (Japan), Kumho Petrochemical Co. Ltd (South Korea), Reliance Industries Ltd. (India), SABIC (Saudi Arabia), LG Chem Ltd (South Korea), Versalis SPA (Italy), PJSC SIBUR Holdings (Russia), Sinopec (China), and Kuraray Co. Ltd (Japan) are some of the major manufacturers of the polybutadiene market. The study includes in-depth competitive analysis of these key players in the polybutadiene market, with their company profiles, recent developments, and key market strategies.
- Published: October 2019
- Price: $ 4950
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Busbar Protection Market by Voltage (Medium Voltage, High Voltage, and Extra High Voltage), Impedance (Low Impedance and High Impedance), End-User (Utilities, Industries, and Transportation), and Region - Global Forecast to 2023
The global busbar protection market is expected to grow at a CAGR of 6.10%, from 2018 to 2023, to reach a market size of USD 4.31 Billion by 2023 from USD 3.20 Billion in 2018. The increasing investment to modernize the transmission & distribution infrastructure is the main driver for the growth of the busbar protection market. The development of digital protection relay (modern relay) is also fuelling the growth of the busbar protection market. Delays in grid expansion projects due to government regulations and environmental clearances is the main restraint for the busbar protection market. To enable an in-depth understanding of the competitive landscape, the report includes the profiles of some of the top players in the busbar protection market. These players include ABB (Switzerland), Schneider Electric (France), GE (US), Siemens (Germany), Mitsubishi Electric (Japan), NR Electric (China), Toshiba (Japan), Eaton (Ireland), and ZIV (Spain).
- Published: April 2018
- Price: $ 4950
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Density Meter Market by Implementation Type (Process, Lab), Type (Vibrating, Nuclear, Ultrasonic, Microwave, Optical), Industry (Chemicals, Food & Beverages, Oil & Gas, Metals & Mining, Water & Wastewater), and Region - Global Forecast to 2023
The density meter market is estimated to be worth USD 855.0 Million in 2018 and is expected to reach USD 1,041.2 Million by 2023, at a CAGR of 4.02% between 2018 and 2023. The growth of this market is propelled by oil & gas downstream segment and stringent regulations with regard to food quality and food safety. Emerson (US), Thermo Fisher (US), Endress+Hauser (Switzerland), Yokogawa (Japan), Mettler Toledo (Switzerland), Toshiba (Japan), AMETEK (US), Valmet (Finland), Anton Paar (Austria), Vega Grieshaber (Germany), Berthold Technologies (Germany), Schmidt + Haensch (Germany), ProMtec Theisen (Germany), A.KRUSS Optronic (Germany), Avenisense (France), Rudolph Research Analytical (US), Bopp & Reuther (Germany), Rototherm Group (UK), Integrated Sensing System (US), Sensotech (Germany), Kyoto Electronics (Japan), Lemis Baltic (Latvia), Horiba (Japan), Meidensha Corporation (Japan), Dandong Dongfang Measurement & Control Technology (China), and Ronan Engineering (US) are some major companies in this market.
- Published: March 2018
- Price: $ 4950
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Polyethylene (PE) Foams Market by Type (Non-XLPE and XLPE), Density (LDPE,HDPE), End-Use Application (Protective Packaging, Automotive, Building & Construction, Footwear, Sports & Recreational, Medical), and Region - Global Forecast to 2026
The polyethylene foams market is expected to grow from USD 3.6 billion in 2021 to USD 4.8 billion by 2026, at a compound annual growth rate (CAGR) of 6.0% during the forecast period.The key players Armacell (Luxembourg), JSP ( Japan), Sealed Air (US), Zotefoams PLC (UK), and Recticel NV (Belgium)
- Published: November 2021
- Price: $ 4950
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Military Battery Market by Type (Rechargeable, Non-rechargeable), Installation (OEM, Aftermarket), Application (Propulsion, Non-propulsion), Platform (Ground, Airborne, Marine), Composition, Voltage, Power Density and Region - Global Forecast to 2027
The military battery market is projected to reach USD 1.6 billion by 2027, at a CAGR of 4.1% during the forecast period. Some of the key players profiled in the military battery market report include EnerSys (US), GS Yuasa International Ltd (Japan), Saft (France), Exide Industries (India), and EaglePicher Technologies (US). The players are mostly engaged in new product launches & developments and having a strong global presence will enhance their position in the military battery market. These players are primarily focusing on entering new markets by launching technologically advanced and cost-effective platforms and infrastructure. Apart from new product launches & developments, these players also adopted the partnerships contracts, & agreements strategy.
- Published: May 2022
- Price: $ 4950
- TOC Available:
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