The China Data Center Interconnect Market was valued at $1984.8 Million in 2025 and projected to reach to $3722.3 Million by 2030, representing a compound annual growth rate of 13.4%. China's data center interconnect market is positioned for exceptional growth as the nation continues its digital transformation journey.
| Market Size in | USD 26.32 MN |
| Market Forecast in | |
| CAGR | |
| Forecast Period | |
| Units Considered | Value (USD MN) |
China's data center interconnect market is valued at USD 1,984.8 million in 2025, with a projected CAGR of 13.4% through 2030, significantly outpacing the global growth rate of 11%.
Rapid deployment of artificial intelligence and cloud computing infrastructure across China is driving unprecedented demand for high-speed interconnect solutions to support data center operations.
China's aggressive digital transformation initiatives, including 5G rollout and smart city projects, are creating substantial requirements for advanced data center interconnect technologies.
The market is forecasted to reach USD 3,722.3 million by 2030, representing an 87.6% increase from 2025 valuations, reflecting strong regional investment and infrastructure expansion.
| Report Metric | Details |
|---|---|
| Base Year | 2025 |
| Fastest Growing Segment | UTILITY & POWER (Enterprises) |
| Forecast Period | 2025-2030 |
| Growth Rate | CAGR of 11% from 2025 to 2030 |
| Largest Segment | PRODUCTS (Type) |
| Market Size Base Year (Billions) | ~USD 15.36 (2025) |
| Revenue Forecast (Billions) | ~USD 25.89 (2030) |
| Segments Covered | Type, Products, Services, Professional Services, Application, End User, Enterprises, Product |
8 segment dimensions are covered across the global market.
China's data center interconnect market is projected to reach USD 3,722.3 million by 2030, growing from USD 1,984.8 million in 2025.
China's data center interconnect market is expected to grow at a compound annual growth rate of 13.4% between 2025 and 2030.
China's market growth is driven by rapid AI adoption, cloud computing expansion, increasing data traffic, edge computing proliferation, and government support for semiconductor self-sufficiency.
China's 13.4% CAGR outpaces the global average of 11%, reflecting China's accelerated digital transformation and strategic technology investments.
China's hyperscale technology companies, cloud service providers, financial institutions, and government data centers are the primary demand drivers for interconnect solutions.
The study involved four main activities to estimate the current size of the data center interconnect market. Comprehensive secondary research gathered information on the market, peer markets, and parent markets. The next step was to validate these findings, assumptions, and sizing with industry experts across the value chain through primary research. Both top-down and bottom-up approaches were used to estimate the overall market size. Subsequently, market segmentation and data triangulation techniques were employed to estimate the sizes of segments and subsegments.
The secondary research process involved consulting various secondary sources to gather essential information for this study. These sources include annual reports, press releases, investor presentations from companies, white papers, journals and certified publications, and articles from recognized authors, websites, directories, and databases. This research was conducted to obtain critical details about the industry’s supply chain, the market’s value chain, the total pool of key players, market segmentation based on industry trends (down to the most detailed level), regional markets, and significant developments from both market and technology perspectives. The secondary data collected was analyzed to estimate the overall market size, which was further validated through primary research.
Extensive primary research was conducted after understanding the current state of the data center interconnect market through secondary research. Several primary interviews were carried out with experts from both demand and supply sides across four major regions: North America, Europe, Asia Pacific, and RoW. This primary data was gathered through questionnaires, emails, and telephone interviews.
Note: Other designations include technology heads, media analysts, sales managers, marketing managers, and product managers.
The three tiers of the companies are based on their total revenues as of 2024 ? Tier 1: >USD 1 billion, Tier 2: USD 500 million–1 billion, and Tier 3: USD 500 million.
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In the full market engineering process, top-down and bottom-up methods and various data triangulation techniques were used to estimate and forecast the overall market segments and subsegments listed in this report. Key market players were identified through secondary research, and their market shares in respective regions were determined via primary and secondary research. This process included analyzing annual and financial reports of leading companies and conducting extensive interviews with industry experts — including CEOs, VPs, directors, and marketing executives — to gather key insights (both quantitative and qualitative).
All percentage shares, splits, and breakdowns were derived from secondary sources and confirmed through primary sources. Every factor influencing the markets studied was carefully examined, verified, and analyzed through primary research to produce accurate final quantitative and qualitative data. This information was consolidated and enhanced with detailed inputs and analysis from MarketsandMarkets before being presented in this report.

After arriving at the overall market size, the market was split into several segments and subsegments using the market size estimation processes explained above. Data triangulation and market breakdown procedures were employed to complete the entire market engineering process and determine the exact statistics of each market segment and subsegment. The data was triangulated by studying various factors and trends from the demand and supply sides in the data center interconnect market.
Data center interconnect (DCI) refers to the technology and infrastructure used to connect two or more data centers over short, medium, or long distances. It enables the smooth transfer of data, workloads, and applications between geographically separated data center facilities. DCI solutions are designed to offer high-speed, low-latency, and highly secure connectivity to support functions such as disaster recovery, workload mobility, data replication, and business continuity. DCI plays a vital role in modern cloud computing, enterprise IT strategies, and multi-location data center architecture by facilitating efficient resource sharing and scalability across multiple sites.
With the given market data, MarketsandMarkets offers customizations according to the specific requirements of companies. The following customization options are available for the report:
Full forecast, segment splits, and company analysis for all Data Center Interconnect Market.
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