Here are relevant reports on : optical-interconnect-market
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Optical Interconnect Market by Product Category (Cable Assemblies, Connectors, Optical Transceivers), Interconnect Level, Fiber Mode, Data Rate, Distance, Application (Data Communication, Telecommunication), Region - Global Forecast to 2025
The Optical Interconnect Market is expected to reach USD 17.1 billion by 2025, growing at a CAGR of 13.7% during the forecast period. Key players in the optical interconnect market include companies operating at different stages of the value chain. II-VI Incorporated (US); Lumentum Operations LLC (US); Molex, LLC (US); InnoLight Technology (Suzhou) Ltd. (China); NVIDIA Corporation (US); Fujitsu Ltd. (Japan); Sumitomo Electric Industries, Ltd. (Japan); Broadcom Inc. (US); TE Connectivity (Switzerland); Amphenol Corporation (US); Accelink Technology Co. Ltd. (China); Juniper Networks, Inc. (US); Infinera Corporation (US); Acacia Communications, Inc. (US); NeoPhotonics Corporation (US); Optoscribe Ltd. (UK); Smiths Interconnect (UK); Cailabs (France); Fiberplex Technologies, LLC (US); and Cleerline Technology Group (US) are the leading players operating in this market. These companies focus on adopting both organic and inorganic growth strategies, such as new product launches and developments, acquisitions, collaborations, contracts, and expansions, for strengthening their position in the market.
- Published: May 2020
- Price: $ 4950
- TOC Available:
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Data Center Interconnect Market by Type [Products (Packet Switching Network, Optical DCI), Software, Services (Professional, Managed)], Application (Real-time Disaster Recovery & Business Continuity, Workload & Data Mobility) - Global Forecast to 2030
The global data center interconnect market is expected to grow from USD 15.38 billion in 2025 to USD 25.89 billion by 2030, at a compound annual growth rate (CAGR) of 11.0% during the forecast period. The Key Players Ciena Corporation (US), Huawei Technologies Co., Ltd. (China), Cisco Systems, Inc. (US), Nokia (Finland), and Juniper Networks, Inc. (US).
- Published: August 2025
- Price: $ 4950
- TOC Available:
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Silicon Photonics Market by Product (Transceivers, Variable Optical Attenuators, Switches, Sensors and Cables), Components (Lasers, Modulators, Optical Waveguides, Optical Interconnects, Photodetectors) - Global Forecast to 2030
The global silicon photonics market is expected to grow from USD 2.65 billion in 2025 to USD 9.65 billion by 2030, at a compound annual growth rate (CAGR) of 29.5% during the forecast period. The Key Players Cisco Systems, Inc.(US), Intel Corporation (US), MACOM (US), GlobalFoundries Inc. (US), Lumentum Operations LLC (US), Marvell (US), Coherent Corporation (US), IBM (US), and STMicroelectronics (Switzerland).
- Published: April 2025
- Price: $ 4950
- TOC Available:
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North America Silicon Photonics Market by Product (Transceivers, Variable Optical Attenuators, Switches, Sensors, and Cables), Component (Lasers, Modulators, Optical Waveguides, Optical Interconnects, Other Components) - Forecast to 2030
The silicon photonics market in North America is estimated at USD 1.16 billion in 2025 and is projected to reach USD 4.35 billion by 2030, growing at a CAGR of 30.2% from 2025 to 2030.The report highlights key players such as Cisco Systems, Inc. (US), Intel Corporation (US), MACOM (US), GlobalFoundries Inc. (US), Lumentum Operations LLC (US), Marvell (US), Coherent Corporation (US), IBM (US), and STMicroelectronics (Switzerland).
- Published: February 2026
- Price: $ 4950
- TOC Available:
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AI Infrastructure Market by Offerings (Compute (GPU, CPU, FPGA), Memory (DDR, HBM), Network (NIC/Network Adapters, Interconnect), Storage, Software), Function (Training, Inference), Deployment (On-premises, Cloud, Hybrid) – Global Forecast to 2030
The AI Infrastructure market is expected to grow from USD 135.81 billion in 2024 to USD 394.46 billion by 2030, at a compound annual growth rate (CAGR) of 19.4% during the forecast period.The key players NVIDIA Corporation (US), Advanced Micro Devices, Inc. (US), SK HYNIX INC. (South Korea), SAMSUNG (South Korea), Micron Technology, Inc. (US), Intel Corporation (US), Google (US), Amazon Web Services, Inc. (US), Tesla (US), Microsoft (US), Meta (US), Graphcore (UK), Groq, Inc. (US), Shanghai BiRen Technology Co., Ltd. (China), Cerebras (US).
- Published: November 2024
- Price: $ 4950
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Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography - Global Forecast to 2027
The molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027, at a compound annual growth rate (CAGR) of 22.9% during the forecast period.The key players device (MID) market and analyzes their market shares. Players profiled in this report are Molex (US), TE Connectivity (Switzerland), Amphenol Corporation (US), LPKF Laser & Electronics (Germany), and Taoglas (Dublin), Harting (Germany), Arlington Plating Company (US), MID Solutions (Germany), 2E Mechatronic (Germany), KYOCERA AVX (US) and Johnan (Japan), Teprosa(Germany), Sunway Communication(China), Axon Cable(France), S2P (France), Suzhou Cicor Technology (China), TactoTek (Finland), DuraTech (US), Tekra (US), Yomura Technologies (Taiwan), MacDermid Alpha Electronics (US), Galtronics (US), Yazaki Corporation (Japan), Chogori Technology (Japan), Suzhou Zeeteq Electronics (Japan), Toyo Connectors (Japan) and SINOPLAST (China).
- Published: August 2022
- Price: $ 4950
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Telecom Cloud Billing Market by Type of Billing (Convergent, Prepaid, Postpaid, Interconnect), Cloud Platform, Deployment, End User, Service, Rate of Charging Mode, and Region - Global Forecast to 2021
The telecom cloud billing market size is expected to grow from USD 2.49 Billion in 2016 to USD 8.22 Billion by 2021, at a Compound Annual Growth Rate (CAGR) of 27.0% from 2016 to 2021. The telecom billing solutions include a wide array of activities ranging from the process of usage tracking for voice and data, aggregating, levying charges upon respective tariffs, generating invoices to the customers, enabling the customer relationship management through the various cloud based solutions on public, private, or hybrid cloud by the vendor (Operations Support Systems/Business Support System (OSS/BSS) provider) for various Mobile Network Operators (MNOs) all enabled by multi-tenancy.
- Published: January 2017
- Price: $ 4950
- TOC Available:
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Interconnects and Passive Components Market by Passive Components (Resistor, Capacitor, Inductor, Transformer, and Diode), Interconnect Type (PCB, Connector, Switch, Relay, Adapter, Terminal, Splice, and Socket), Application, and Region - Global Forecast to 2022
According to the MarketsandMarkets forecast, the interconnects and passive components market is expected to be valued at USD 187.55 Billion by 2022, growing at a CAGR of 4.41% between 2017 and 2022. The growth of the interconnects and passive components market is attributed to advancements in the industrial M2M communication technology and rising industrial automations, increasing demand for miniaturized and high-performance electronic devices, proliferation of automotive infotainment and consumer electronics, and high demand for passive component and interconnects in computing, communication and consumer electronics (3C) applications.
- Published: March 2017
- Price: $ 4950
- TOC Available:
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Hybrid Fiber Coaxial Market by Technology (DOCSIS 3.0 & Below and DOCSIS 3.1), Component (CMTS/CCAP, Fiber Optic Cable, Amplifier, Optical Node, Optical Transceiver, Splitter, and CPE), and Geography - Global Forecast to 2023
The hybrid fiber coaxial (HFC) market is expected to reach USD 13.6 billion by 2023 from USD 9.6 billion in 2018, at a CAGR of 8.02% during 2018–2023. Major factors driving the market’s growth include high bandwidth and cost efficiency compared to other technologies. In line with this, the use of HFC has gained remarkable consideration for data transfer in IoT applications. However, factors such as troubleshooting and maintenance issues after deployment are restraining the market’s growth. The key HFC players in the market are Arris (US), Huawei (China), Nokia (Finland), Technicolor (France), Cisco (US), Corning, (US), Ciena (US), Comcast (US), CommScope (US), Teleste Corp. (Finland), Telstra Corp. (Australia), PCT International (US), ZTE (China), Comba (China), Skyworks (US), Vodafone (England), Vecima Networks (Canada), Technetix (UK), Infinera (US), Finisar (US), Bentley Systems (US), Bktel (Germany), C-COR Broadband (Australia), Verizon (US), Charter Communications (US), Cox Communications (US), Singtel Optus (China), Com Hem (Sweden), TDC (Denmark), Telecom Italia (Italy), and Telefonica (Spain).
- Published: January 2019
- Price: $ 4950
- TOC Available:
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Metamaterial Market by Antenna, Reconfigurable Intelligent Surfaces (RIS), lenses and optical modules, sensors and beam steering, anti-reflective films, electromagnetic, terahertz, radio frequency (RF), optical and region - Global Forecast to 2029
The Metamaterial market is expected to grow from USD 0.22 billion in 2024 to USD 1.38 billion by 2029, at a compound annual growth rate (CAGR) of 44.8% during the forecast period.The key players Kymeta Corporation (US), Psivotal Commware (US), Echodyne Corp. (US), ALCAN Systems GmbH i.L. (Germany), Metalenz, Inc. (US), Greenerwave (France), Edgehog (Canada), Metamagnetics (US), Fractal Antenna Systems, Inc. (US), Lumotive (US), and TeraView Limited (UK).
- Published: February 2025
- Price: $ 4950
- TOC Available:
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