Here are relevant reports on : slot-die-coater-market
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Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024
The Die Bonder Equipment Market is expected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% during the forecast period. BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France) are the key players in the die bonder equipment market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to increase their market share.
- Published: November 2019
- Price: $ 4950
- TOC Available:
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Continuous Manufacturing Market By Product (Integrated system, Semi-continuous (Granulator, Coater, Blender), Control), Application (API, End Product (Solid Dosage)), End User (R&D Department (CRO), Pharmaceutical Companies, CMO)- Global Forecast to 2022
The global continuous manufacturing market is projected to grow at a CAGR of 13.3%. Major players in this market include GEA Group AG (Germany), Thermo Fisher Scientific Inc. (U.S.), Bosch Packaging Technology (Germany), Coperion GmbH (Germany), and Glatt GmbH (Germany). Other players include KORSCH AG (Germany), Munson Machinery Company, Inc. (U.S.), L.B. Bohle Maschinen + Verfahren Gmbh (Germany), Gebrüder Lödige Maschinenbau GmbH (Germany), Baker Perkins Ltd. (U.K.), Scott Equipment Company (U.S.), and Sturtevant, Inc. (U.S.).
- Published: April 2017
- Price: $ 4950
- TOC Available:
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Mold Release Agents Market by Type (Water-based, Solvent-based), Application (Die-casting, Rubber Molding, Plastic Molding, Concrete, PU Molding, Wood Composite & Panel Pressing, Composite Molding), and Region - Global Forecast to 2030
The mold release agents market is projected to grow from USD 2.39 billion in 2025 to USD 3.25 billion by 2030, at a CAGR of 6.32% between 2025 and 2030.The key players include Freudenberg Group (Germany), Daikin Industries, Ltd. (Japan), Henkel AG & Co. KGaA (Germany), LANXESS AG (Germany), Shin-Etsu Chemical Co., Ltd. (Japan), Dow Inc. (US), Michelman, Inc. (US), Marbocote Ltd. (UK), McGee Industries, Inc. (US), and Miller-Stephenson, Inc. (US).
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Aluminum Casting Market by Process (Die Casting, Permanent Mold Casting, Sand Casting), End-use Sector (Transportation, Industrial, Building & Construction), and Region (APAC, Europe, North America, South America, MEA) - Global Forecast to 2026
The aluminum casting market is projected to reach USD 100.5 billion by 2026. It is expected to grow at a CAGR of 7.4% during the forecast period.The key companies profiled in this report on the aluminum casting market include Alcoa Corporation (US), Ryobi Limited (Japan), Aluminum Corporation of China Limited (China), Rio Tinto (UK), United Company RUSAL (Russia) are key players in aluminum casting market.
- Published: October 2021
- Price: $ 4950
- TOC Available:
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CAM Software Market by Application (Machining & Production (CNC Machining, Sheet Metal Fabrication), Product Design & Prototyping (Additive/3D Printing, Tool & Die Manufacturing), Quality Control & Inspection), 2D, and 3D - Global Forecast to 2030
The CAM Software Market size is projected to reach USD 5.69 billion by 2030 at a compounded annual growth rate (CAGR) of 9.0% during the forecast period. Some of the computer-aided manufacturing vendors include Autodesk (US), Siemens (Germany), Hexagon (Sweden), Dassault Systemes (France), Hypertherm (US), PTC (US), SolidCAM (US), TopSolid (France), CAMWorks (US) and MasterCAM (US).
- Published: November 2024
- Price: $ 4950
- TOC Available:
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Steel Casting Market by Type (Carbon Steel, Low-Alloy Steel, High-Alloy Steel), Process (Sand Casting, Investment Casting, Die Casting), Formulation (Solvent Based, Solventless, Emulsion), Application, & Region - Global Forecast to 2029
The steel casting market is expected to grow from USD 33.90 billion in 2025 to USD 42.18 billion by 2029, at a CAGR of 5.6% during the forecast period. The steel casting Market comprises major players such as ArcelorMittal (Luxembourg), Doosan Corporation (South Korea), Kobe Steel, Ltd., (Japan), Nucor Corporation (US), Isgec Heavy Engineering Ltd. (India), and Georg Fischer Ltd. (Switzerland), The Japan Steel Works, Ltd. (Japan), Nelcast Limited (India), Ferralloy, Inc. (US), POSCO (South Korea) and others are covered in the steel casting market. Expansions, acquisitions, joint ventures, and new product developments are some of the major strategies adopted by these key players to enhance their positions in the steel casting Market.
- Published: January 2025
- Price: $ 4950
- TOC Available:
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029
The semiconductor & ic packaging materials market is expected to grow from USD 43.9 billion in 2024 to USD 70.9 billion by 2029, at a CAGR of 10.1% during the forecast period. The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc.
- Published: March 2024
- Price: $ 4950
- TOC Available:
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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).
- Published: September 2023
- Price: $ 4950
- TOC Available:
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Hybrid Bonding Market By Wafer-to-Wafer (W2W), Die-to-Wafer (D2W), Die-to-Die (D2D), Wafer Bonder, Surface Prep Tool, Inspection & Metrology Tool, Cleaning & CMP System, 2.5D Packaging, and 3D Stacked IC - Global Forecast to 2032
The global hybrid bonding market is expected to grow from USD 164.7 million in 2025 to USD 633.9 million by 2032, at a compound annual growth rate (CAGR) of 21.2% during the forecast period. The Key Players EV Group (EVG) (Austria), Applied Materials, Inc. (US), SUSS MicroTec SE (Germany), Besi (Netherlands), Kulicke & Soffa Industries, Inc. (Singapore), Tokyo Electron (TEL) (Japan), and ASMPT (Singapore).
- Published: December 2025
- Price: $ 4950
- TOC Available:
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Sputter Coater Market by Substrate Type (Metal, Glass, Semiconductor), Target Type (Metal, Compound), End-Use Industry (Automotive, Electronics & Semiconductor, Institutes), and Region (North America, EU, APAC, South America, MEA) - Global Forecast to 2022
The sputter coater market is projected to grow from USD 595.8 Million in 2017 to USD 804.2 Million by 2022, at a CAGR of 6.2% between 2017 and 2022. The growth of the sputter coater market can be attributed to the growth of the electronics & semiconductor industry. The rising use of sputter coaters in electronics & semiconductor and medical applications is expected to drive the market during the forecast period. Key companies profiled in the sputter coater market research report are ULVAC (Japan), Quorum Technologies (UK), Bühler (Switzerland), Cressington Scientific Instruments (UK), Hitachi High-Technologies Corporation (Japan), Oxford Instruments (UK), Semicore Equipment (US), PLASSYS Bestek (France), PVD Products (US), and Denton Vacuum (US).
- Published: March 2018
- Price: $ 4950
- TOC Available:
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