Here are relevant reports on : hdi-pcb-market
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Aviation Connectors Market by Application (Landing Gear, Engine Control System, Avionics, Cabin Equipment, Others), Type (PCB, High Power, High Speed, RF Connectors, Fiber Optics), Shape (Circular, Rectangular), & Region - Global Forecast to 2035
The Aviation Connectors Market plays a vital role in modern aerospace systems by ensuring reliable electrical and signal connectivity across aircraft subsystems, including avionics, power distribution, communication, and control units. As of 2025, the market is estimated to be valued at USD 6–8 billion, supported by increasing aircraft production, fleet modernization, and the growing integration of advanced avionics systems. The market is projected to reach USD 12–16 billion by 2035, expanding at a CAGR of 6%–8% during the forecast period.
- Published: September 2026
- Price: $ 4950
- TOC Available:
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PCB Encapsulation Market by Resin Type (Epoxy, Acrylic), Curing Type (UV-Cure, Heat Cure, Room Temperature Cure), Application (Consumer Electronics, Automotive Electronics, Medical Devices), Product Type - Global Forecast to 2029
PCB encapsulation market is expected to grow from USD 5.59 billion by 2029 to USD 5.59 billion by 2029, at a CAGR of 8.8% during the forecast period. The key players in this market Henkel AG & Co. KGaA (Germany), H.B. Fuller Company (US), Parker-Hannifin Corporation (US), Dow (US), DuPont (US), Nagase ChemteX Corporation (Japan), Huntsman International LLC (US), Wacker Chemie AG (Germany), Shin-Etsu Chemical Co. Ltd., (Japan) Panacol-Elosol GmbH (Germany).
- Published: October 2024
- Price: $ 4950
- TOC Available:
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Conductive Inks Market by Type ( Silver, Copper, Carbon/Graphene, Carbon Nanotube, Conductive Polymer), Application (Photovoltaics, RFID, PCB, Membrane Switches, Displays, Thermal Heating), Region - Global Forecast to 2025
The global Conductive inks market size is expected to be worth USD 3.7 billion by 2025. at a CAGR of 4.1% during the forecast period. Some of the key players operating in the conductive inks market are DowDuPont (US), Henkel AG & Co. KGaA (Germany), Heraeus Holding GmbH (Germany), Johnson Matthey (UK), Poly-Ink (France), Sun Chemical Corporation (US), NovaCentrix (US), Creative Materials Inc. (US), Applied Ink Solutions (US), and Vorbeck Materials (US). Competition among these players is high, and they mostly compete with each other on prices and quality of their products and product customization. The growth of the end-use segments of the conductive inks market is likely to encourage the manufactures to provide better products and technologies to their customers and explore the untapped markets.
- Published: July 2020
- Price: $ 4950
- TOC Available:
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Electronic Gases Market by Type (Nitrogen, Argon, Hydrogen, Helium, Silane, Ammonia, Phosphine, Arsine), Process (Etching, Purging, Doping, Sputtering), End-Use Industry (Semiconductors, PCB’s, Display, Solar) - Global trends & forecasts to 2020
The global electronic gases market is expected to experience a good growth for the period 2015 to 2020. Electronic gases are high-purity gases used in the manufacture of semiconductors, ICs, PCBs, LCDs, and LEDs, which are in turn used in a range of electronic devices. .
- Published: September 2026
- Price: $ 4950
- TOC Available:
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Electronic Chemicals and Materials Market by Type (Specialty Gases, CMP Slurries, Conductive Polymers, Photoresist Chemicals, Low K Dielectrics, Wet Chemicals, Silicon Wafers, PCB Laminates), Application, and Region - Global Forecast to 2028
The electronic chemicals and materials market is expected to grow from USD 59.1 billion in 2023 to USD 77.8 Billion by 2028, at a CAGR of 5.6% during the forecast period. Shin-Etsu Chemical Co., Ltd. (Japan), Linde Plc (England), Fujifilm Corporation (Japan), Resonac Holding Corporation (Japan), Air Liquide (Paris), Solvay (Belgium), BASF SE(Germany), Mitsui Chemicals America, Inc. (US), Merck KGaA (Germany), Covestro AG (Germany), SUMCO Corp. (Japan), Air Products & Chemicals, Inc. (US), and Songwon (South Korea) among are the major players in the electronic chemicals and materials market.
- Published: March 2024
- Price: $ 4950
- TOC Available:
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Relay Market by Type (Electromechanical, Thermal, Reed, Time, Solid State), Voltage Range (Low, Medium, High), Mounting Type (Panel, PCB, DIN Rail, Plug-In), Application (Protection, Monitor, Control), Verticals and Region - Global Forecast to 2030
The relay market is projected to reach USD 15.20 billion by 2030 at the CAGR of 7.0% during the forecast period. Some of the major players in the relay market are Panasonic Holdings Corporation (Japan), HONGFA (China), TE Connectivity (Switzerland), OMRON Corporation (Japan), and GE Vernova Inc. (US) among others. The major strategies adopted by these players include new product launches, acquisitions, joint ventures, and expansions.
- Published: November 2024
- Price: $ 4950
- TOC Available:
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Automotive PCB Market by Type (Single-sided, Double-sided, and Multi-layer), Application, Fuel Type (BEVs, HEVs, and ICE), Level of Autonomous Driving (Autonomous, Semi-autonomous, and Conventional), End User, and Region – Global Forecast to 2025
The PCB market for automotive is projected to grow at a CAGR of 5.33% from 2017 to 2025. The market for automotive PCBs is estimated to be USD 8.21 Billion in 2017 and is projected to reach to USD 12.43 Billion by 2025.Some of the key market players are CMK (Japan), Chin Poon Industrial (Taiwan), Meiko Electronics (Japan), Nippon Mektron (Japan), and KCE Electronics (Thailand).
- Published: January 2018
- Price: $ 4950
- TOC Available:
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Glass Fiber Yarn Market by Fiber Type (E-glass type, S-glass type), Yarn Type (Single Yarn, Piled yarn), Application (PCB, Façade, Marble & Mosaic Tiles, Structural parts), End-use Industry and Region - Global Forecast to 2027
The Glass Fiber Yarn Market is expected to grow from USD 2.5 billion in 2022 to USD 3.5 billion by 2027, at a CAGR of 6.5% during the forecast period. The key players in the global glass fiber yarn market are Owens Corning (US), Jushi Group Co., Ltd., Chongqing Polycomp International Corporation, Saint-Gobain S.A., Nippon Electric Glass Co. Ltd., AGY Holdings Corp., China Beihai Fiberglass Co., Ltd., Taiwan Glass Industry Corp., Nitto Boseki Co. Ltd. (Japan), PFG Fiber Glass Corp. (Taiwan).
- Published: August 2022
- Price: $ 4950
- TOC Available:
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5G Materials Market Size, Share & Industry Analysis, By Material (Organic, Inorganic), By Product (Polytetrafluoroethylene, Polymide, Polyether ether ketone, Liquid Crystel Polyment and other product types), By Application (PCB/Component, Package Level, Wafer Level) & Region - Global Forecast to 2029
The 5G Materials market is projected to reach USD 2.0 billion by 2029, at a CAGR of 20.3% from USD 0.2 billion in 2024 during the forecast period.
- Published: September 2026
- Price: $ 4950
- TOC Available:
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Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024
The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. The high adoption of SLPs by leading OEMs, surge in demand for smart consumer electronics and wearable devices, and impactful benefits of SLPs are the major factors driving the growth of the substrate-like PCB market. AT&S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck Electronics (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); LG Innotek (South Korea) are major players in the substrate-like PCB market.
- Published: January 2019
- Price: $ 4950
- TOC Available:
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