Here are relevant reports on : inp-wafer-market
-
CMOS Image Sensor Market by Technology (CMOS and Others), Specification, Wafer & Sensor Size, Application (Automotive, Consumer Electronics, Industrial, Entertainment, & Security & Surveillance), and Region - Global Trends and Forecast to 2020
The CMOS image sensor market was valued at USD 8.8 Billion in 2014 and is expected to grow at a CAGR of 11.8% between 2015 and 2020. The base year used for study is 2014 and the forecast period is between 2015 and 2020. This report provides a detailed analysis of the CMOS image sensor market segmented on the basis of technology, specification, wafer & sensor size, application, and region. The consumer electronics market for CMOS image sensor was valued at USD 6.5 Billion in 2014; it is expected to hold a large share of the CMOS image sensor market. The market for the automotive sector is expected to grow at a high CAGR of 19.4% between 2015 and 2020.
- Published: November 2015
- Price: $ 4950
- TOC Available:
-
Wafer Cleaning Equipment Market Size, Share, Statistics and Industry Growth Analysis Report by Equipment Type (Single-wafer Spray System, Batch Spray Cleaning System, and Scrubbers), Application, Technology, Operation Mode, Wafer Size (Less than Equals 150 mm, 200 mm, 300 mm) and Region - Global Forecast to 2028
The wafer cleaning equipment market is expected to grow from USD 10.1 billion in 2023 to USD 16.5 billion by 2028, at a compound annual growth rate (CAGR) of 10.4% during the forecast period.The Key Players SCREEN Holdings Co., Ltd. (Japan), Tokyo Electron Limited (Japan), Applied Materials (US), LAM Research Corporation (US), Shibaura Mechatronics Corporation (Japan), PVA TePLA AG (Germany), Entregris Inc., (US), SEMES (US), Modutek.com (Japan), Veeco Instruments Inc. (US), Toho Technology (US), ULTRON SYSTEMS, INC. (US), Akrion Technologies (US), Axus Technology (US), SHIBAURA MECHATRONICS CORPORATION (Japan).
- Published: August 2023
- Price: $ 4950
- TOC Available:
-
Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027
The thin wafer market is expected to grow from USD 11.4 billion in 2022 to USD 20.6 billion by 2027, at a compound annual growth rate (CAGR) of 12.5% during the forecast period.The Key Players Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), and Applied Materials (US). Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US).
- Published: September 2022
- Price: $ 4950
- TOC Available:
-
Monolithic Microwave IC Market by Component (Power Amplifiers, Low Noise Amplifiers, Switches), Material Type (GaAs, InP, GaN), Frequency Band (L, S, C, X, Ku, K, Ka, V, W), Technology (MESFET, HEMT, pHEMT, mHEMT, E- pHEMT) - Global Forecast to 2030
The global monolithic microwave IC market is expected to grow from USD 14.53 billion in 2025 to USD 23.91 billion by 2030, at a compound annual growth rate (CAGR) of 10.5% during the forecast period. The key players Qorvo, Inc. (US), MACOM (US), Skyworks Solutions, Inc. (US), NXP Semiconductors (Netherlands), Analog Devices, Inc. (US), Infineon Technologies AG (Germany), WIN Semiconductors (China), United Monolithic Semiconductors (France), Mini-Circuits (US), Keysight Technologies (US), VECTRAWAVE (France), BeRex (South Korea), Reliasat (UK), Semiconductor Components Industries, LLC (US), and MicroWave Technology, Inc. (US).
- Published: January 2025
- Price: $ 4950
- TOC Available:
-
3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).
- Published: May 2023
- Price: $ 4950
- TOC Available:
-
5G Materials Market Size, Share & Industry Analysis, By Material (Organic, Inorganic), By Product (Polytetrafluoroethylene, Polymide, Polyether ether ketone, Liquid Crystel Polyment and other product types), By Application (PCB/Component, Package Level, Wafer Level) & Region - Global Forecast to 2029
The 5G Materials market is projected to reach USD 2.0 billion by 2029, at a CAGR of 20.3% from USD 0.2 billion in 2024 during the forecast period.
- Published: May 2026
- Price: $ 4950
- TOC Available:
-
Next-Generation Memory Market Size, Share & Industry Growth Analysis Report by Technology (Non-Volatile Memory (MRAM (STT-MRAM, SOT-MRAM, Toggle Mode MRAM), FRAM, RERAM/CBRAM, 3D XPoint, NRAM), and Volatile Memory (HBM, and HMC)), Wafer Size (200 mm, and 300 mm) - Global Forecast to 2028
The next-generation memory market size is expected to grow from USD 6.2 billion in 2023 to USD 17.7 billion by 2028, at a compound annual growth rate (CAGR) of 23.2% during the forecast period.The key players SAMSUNG (South Korea), KIOXIA Holdings Corporation (Japan), Micron Technology, Inc. (US), Fujitsu (Japan), SK Hynix Inc (South Korea), Honeywell International, Inc. (US), Winbond (Taiwan), Microchip Technology Inc. (US), Nanya Technology (Taiwan), and Everspin Technologies (US).
- Published: August 2023
- Price: $ 4950
- TOC Available:
-
Sapphire Technology Market by Growth Technologies (KY, CZ, HEM, and EFG), Substrate Wafer (Si-on-Sapphire, SiC-on-Sapphire, GaN-on-Sapphire, and Others), Devices, Applications, and Geography - Analysis & Forecast to 2013 - 2020
The Sapphire Technology Market is in its pre-maturity stage. There is a high potential for the sapphire market across the industry verticals like power electronics devices, information and communication technology, aerospace and defense, and so on. The exceptional properties of sapphire have made it one of the most successful materials in semiconductors as compared to its peers. With the use of sapphire in Power Electronics and RF applications, the communication and the consumer electronics industry have seen a major drift in its performance. The Global Sapphire Market in Semiconductors for substrates is expected to reach $3.01 Billion by 2020 at a CAGR of 12.31%, where as the Global Sapphire Market in Semiconductors for devices is expected to reach $6.17 Billion by 2020 at a CAGR of 12.24%.
- Published: March 2014
- Price: $ 4950
- TOC Available:
-
Non-Volatile Memory Market by Type (Flash, EPROM, nvSRAM, EEPROM, 3D NAND, MRAM, FRAM, NRAM, ReRAM, PMC), Wafer Size (200 mm, 300mm), End-user (Consumer Electronics, Enterprise Storage, Healthcare, Automotive) and Region - Global Forecast to 2027
The non-volatile memory market is expected to grow from USD 74.6 billion in 2022 to USD 124.1 billion by 2027, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The key players SAMSUNG (South Korea), Western Digital Technologies, Inc. (US), KIOXIA Holdings Corporation (Japan), Micron Technology, Inc. (US), and SK HYNIX INC. (South Korea) among others. The other companies profiled in the report are Microchip Technology Inc. (US), ROHM CO., LTD. (Japan), Renesas Electronics Corporation (Japan), STMicroelectronics (US), Infineon Technologies AG (Germany), Nantero, Inc. (US), Crossbar Inc. (US), Everspin Technologies Inc. (US), Winbond (Taiwan), and Pure Storage, Inc. (US).
- Published: December 2022
- Price: $ 4950
- TOC Available:
-
Mass Flow Controller Market Size by Metal & Elastomer Seal, Flow Rate (<25, 25 – 1k, >1k SLM), Gas & Liquid, Thermal, Differential Pressure & Coriolis, Stainless Steel, Wafer Cleaning, Plasma Etching, Catalyst Research, Aeration - Global Forecast to 2029
The global mass flow controller market is expected to grow from USD 1.63 billion in 2024 to USD 2.32 billion by 2029, at a compound annual growth rate (CAGR) of 7.2% during the forecast period.The key players HORIBA, Ltd. (Japan), Sensirion AG (Switzerland), MKS Instruments (US) Teledyne Technologies Incorporated (US), and Bronkhorst (Netherlands).
- Published: February 2025
- Price: $ 4950
- TOC Available:
Records 11 to 20 of 50