Here are relevant reports on : inp-wafer-market
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LED Materials Market by Material Type (Substrate, Wafer, Epitaxy, Phosphor), Application (General Lighting (Residential, Industrial, Outdoor), Automotive Lighting (Interior, Exterior), Backlighting), and Region - Global Forecast to 2021
The LED materials market is projected to reach USD 12.55 Billion by 2021, at a CAGR of 9.9%, in terms of value from 2016 to 2021. The base year considered for the study is 2015, while the forecast period is from 2016 to 2021. The LED materials market is driven by the increasing usage of LEDs in general and automotive lighting. The report includes analysis of the LED materials market by region, namely, North America, Europe, Asia-Pacific, Middle East & Africa, and South America.
- Published: April 2017
- Price: $ 4950
- TOC Available:
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Wafer Cleaning Equipment Market Size, Share, Statistics and Industry Growth Analysis Report by Equipment Type (Single-wafer Spray System, Batch Spray Cleaning System, and Scrubbers), Application, Technology, Operation Mode, Wafer Size (Less than Equals 150 mm, 200 mm, 300 mm) and Region - Global Forecast to 2028
The wafer cleaning equipment market is expected to grow from USD 10.1 billion in 2023 to USD 16.5 billion by 2028, at a compound annual growth rate (CAGR) of 10.4% during the forecast period.The Key Players SCREEN Holdings Co., Ltd. (Japan), Tokyo Electron Limited (Japan), Applied Materials (US), LAM Research Corporation (US), Shibaura Mechatronics Corporation (Japan), PVA TePLA AG (Germany), Entregris Inc., (US), SEMES (US), Modutek.com (Japan), Veeco Instruments Inc. (US), Toho Technology (US), ULTRON SYSTEMS, INC. (US), Akrion Technologies (US), Axus Technology (US), SHIBAURA MECHATRONICS CORPORATION (Japan).
- Published: August 2023
- Price: $ 4950
- TOC Available:
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Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027
The thin wafer market is expected to grow from USD 11.4 billion in 2022 to USD 20.6 billion by 2027, at a compound annual growth rate (CAGR) of 12.5% during the forecast period.The Key Players Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), and Applied Materials (US). Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US).
- Published: September 2022
- Price: $ 4950
- TOC Available:
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Monolithic Microwave IC Market by Component (Power Amplifiers, Low Noise Amplifiers, Switches), Material Type (GaAs, InP, GaN), Frequency Band (L, S, C, X, Ku, K, Ka, V, W), Technology (MESFET, HEMT, pHEMT, mHEMT, E- pHEMT) - Global Forecast to 2030
The global monolithic microwave IC market is expected to grow from USD 14.53 billion in 2025 to USD 23.91 billion by 2030, at a compound annual growth rate (CAGR) of 10.5% during the forecast period. The key players Qorvo, Inc. (US), MACOM (US), Skyworks Solutions, Inc. (US), NXP Semiconductors (Netherlands), Analog Devices, Inc. (US), Infineon Technologies AG (Germany), WIN Semiconductors (China), United Monolithic Semiconductors (France), Mini-Circuits (US), Keysight Technologies (US), VECTRAWAVE (France), BeRex (South Korea), Reliasat (UK), Semiconductor Components Industries, LLC (US), and MicroWave Technology, Inc. (US).
- Published: January 2025
- Price: $ 4950
- TOC Available:
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RF Gallium Nitride Market Size, Share, Statistics and Industry Growth Analysis Report by Device (Discrete RF Device, Integrated RF Device), wafer size, end user (Telecom Infrastructure, Satellite Communications, Military & Defense) and Region - Global Forecast to 2028
The global RF gallium nitride market is expected to grow from USD 1.3 billion in 2022 to USD 2.8 billion by 2028, at a compound annual growth rate (CAGR) of 12.9% during the forecast period.The key players Sumitomo Electric Device Innovations, Inc. (Japan), Qorvo, Inc. (US), WOLFSPEED, INC. (US), NXP Semiconductors (Netherlands), MACOM (US).
- Published: July 2023
- Price: $ 4950
- TOC Available:
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3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).
- Published: May 2023
- Price: $ 4950
- TOC Available:
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Probe Pin Market by Pogo Type, Stamping Type, Spring Contact, Non-Spring Contact, Semiconductor Testing (Wafer-level Testing, and Package-level Testing), Frequency Range (<1 GHz, 1-10 GHz, 10-40 GHz, >40 GHz) - Global Forecast to 2032
The global probe pin market is expected to grow from USD 0.68 billion in 2025 to USD 1.08 billion by 2032, at a compound annual growth rate (CAGR) of 6.9%.during the forecast period. The Key Players FEINMETALL (Germany, INGUN (Germany), CCP Contact Probes Co., Ltd. (Taiwan), Seiken Co., Ltd. (Japan), LEENO INDUSTRIAL INC. (South Korea), Incavo Otax Inc. (Japan), ISC Co., Ltd. (Japan), Smiths Interconnect (UK), Everette Charles Technologies – Cohu Subsidiary (US), PTR HARTMANN GmbH (Germany), KITA Manufacturing Co., Ltd. (Japan), Harwin (UK), QA Technologies Company (US), Shanghai Jianyang Electronics Technology Co., Ltd. (China), Suzhou Shengyifurui Electronic Technology Co., Ltd. (China)
- Published: December 2025
- Price: $ 4950
- TOC Available:
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SiC-on-Insulator (SiCOI) Film Market Size, Share & Trends by Substrate Material (Si, Polycrystalline SiC, Others), Wafer Size (100 mm, 150 mm, 200 mm), Technology Route (Smart Cut Technology, Grinding/ Polishing / Bonding Technology) and Region - Global Forecast to 2029
The SiC-on-insulator (SiCOI) film market is expected to grow from USD 37 million in 2024 to USD 1,134 million by 2029, at a compound annual growth rate (CAGR) of 98.1% during the forecast period.The key players SOITEC (France), SICOXS CORPORATION (Japan), NGK INSULATORS, LTD. (Japan), iSABers Materials (China), MTI Corporation (US).
- Published: April 2024
- Price: $ 4950
- TOC Available:
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Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022
The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The report aims at estimating the size and future growth potential of the flip chip technology market across different segments on the basis of bumping process, packaging technology, packaging type, product, application, and region.
- Published: April 2016
- Price: $ 4950
- TOC Available:
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SiC-On-Insulator and Other Substrates Market by Substrate Type (Semi-insulating SiC Substrates, Conductive SiC Substrates), Wafer Size (100mm, 150mm and 200mm), Application (Power Devices, RF Devices) and Region - Global Forecast to 2029
The SiC-On-Insulator and Other Substrates Market size is expected to grow from USD 99 million in 2024 to USD 149 million by 2029, at a compound annual growth rate (CAGR) of 8.5% during the forecast period.The key players Wolfspeed, Inc. (US), SICC Co., Ltd. (China), SOITEC (France), Coherent Corp. (US), GlobalWafers Co., Ltd. (Taiwan), Ceramicforum Co., Ltd. (Tokyo), Xiamen Powerway Advanced Material Co., Ltd. (China), Homray Material Technology (China), Shanghai Zhongyingrong innovative Material Technology Co., Ltd (China), Precision Micro-optics Inc. (US), Tankeblue Semiconductor Co., Ltd. (China), and Hebei Synlight Crystal Co., Ltd. (China).
- Published: January 2024
- Price: $ 4950
- TOC Available:
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