Here are relevant reports on : atomic-layer-deposition-market
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Thin-Film Encapsulation (TFE) Market by Application (OLED Display, OLED Lighting, and Thin-Film Photovoltaic), Deposition Type (Inorganic Layers (PECVD, ALD) and Organic Layers (Inkjet Printing and VTE), Vertical and Region - Global Forecast to 2027
The thin-film encapsulation (TFE) market size is expected to grow from USD 92 million in 2022 to USD 223 million by 2027, at a compound annual growth rate (CAGR) of 19.4% during the forecast period.The Key players Samsung SDI Co., Ltd. (South Korea); LG Chem (South Korea); 3M (US); Toppan Inc. (Japan); Ergis Group (Poland); Veeco Instruments Inc. (US); Universal Display Corporation (US); Applied Materials, Inc. (US); Kateeva (US); Toray Industries, Inc. (Japan); tesa (Germany); Ajinomoto Fine-Techno Co., Inc. (Japan); Coat-X (Switzerland); and Borealis AG (Austria).
- Published: November 2022
- Price: $ 4950
- TOC Available:
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Super Junction MOSFET Market by FAB Technology (Multiple-Epitaxy, Deep-Trench), Packaging Technology Material (Substrate, Transition Layer, Electrode), Application (Power Supply, Display, Lighting, EV/HEV, Industrial) & by Geography- Global Trends & Forecasts to 2013 - 2020
The Global Super Junction MOSFET Market of power electronics devices is flourishing, currently, and is expected to grow further, with the advancements in the power devices technologies, especially in super junction technology. Super junction devices fill today the market place; this is the perfect time to review, analyze and forecast the future of super junction technology and devices. Fast switching, low power consumption and high ON resistance are the major factors that are driving the growth of SJ-MOSFET in the market. With the innovations in fabrication and packaging technology, SJ-MOSFET devices are getting popular amongst the manufacturers and end user application manufacturers.
- Published: March 2014
- Price: $ 4950
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Multiwall Bags Market by Product Type (Paper Bags and Plastic Bags), Layer (2-Ply, 3-PLy, and Others), Application (Food & Grains, Agriculture, Building & Construction, Chemicals, Retail, Pharmaceuticals, and Others), and Region - Global Forecast to 2025
The global multiwall bags market size is projected to reach USD 14.4 billion by 2025, at a CAGR of 3.5% during the forecasting period. Mondi Group (Austria), Berry Global Inc. (US), Sonoco Products Company (US), Hood Packaging Corporation (US), El Dorado Packaging, Inc. (US), Lincon Polymers Pvt. Ltd. (India), ProAmpac Holdings Inc. (US), Global-Pak, Inc. (US), LC Packaging (Netherlands), NNZ Group (Netherlands), Manyan Inc (Canada), United Bags, Inc. (US), Langston Companies, Inc. (US), Material Motion, Inc. (US), Commercial Packaging (US), MIDCO Global (US), Trombini (Brazil), San Miguel Yamamura Woven Products sdn bdh (Philippines), Oji Fibre Solutions (NZ) Ltd. (New Zealand), Nebig Verpakkingen BV (Netherlands), Sanghavi Global (India), Premier Polymer (India), Napco National (Saudi Arabia), Corman Bag (US), and Bag Supply Company, Inc. (US), among others are the key players operating in the multiwall bags market. Expansions & investments, acquisitions, partnerships, and new product developments are some of the significant strategies adopted by these key players to enhance their positions in the multiwall bags market.
- Published: November 2020
- Price: $ 4950
- TOC Available:
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Aerospace PCB Market by Platform (Aircraft, Helicopters, Satellite, Space Launch vehicle, UAVs, Rovers and Probes), PCB Type (Double-Sided PCB, Multi-Layer, Single-Sided), Function (Rigid PCB, Flexible PCB, Rigid-flex PCB, Others), Application (Radio Communication, Radars, Health Monitoring Sensors, Power Converters, Power Supplies, Engine Control Systems Others), Point of Sale, and Region - Global Forecast to 2025
Exhaustive secondary research was undertaken to obtain information on the aerospace PCB market, the peer market, and the parent market. The next step was to validate these findings, assumptions, and sizing by industry experts across the value chain through primary research. Both, top-down and bottom-up approaches were employed to estimate the complete market size. Thereafter, market breakdown and data triangulation were used to estimate the size of segments and subsegments.
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Hard Coatings Market by Material Type (Nitrides, Oxides, Carbides, Carbon, Borides, Multi-Component), Deposition Techniques (PVD, CVD), Application, End-use industry, and Region (North America, Europe, APAC, South America, MEA) - Global Forecast to 2028
The hard coatings market is expected to grow from USD 1.2 billion in 2023 to USD 1.7 billion by 2028, at a CAGR of 7.0% during the forecast period. OC Oerlikon Management AG (Switzerland), Momentive (US), Cemecon AG (US), Carl Zeiss Meditec AG (Germany), and SDC Technologies, Inc. (US) are the key players in the global hard coatings market.
- Published: February 2024
- Price: $ 4950
- TOC Available:
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3D Printing High-Performance Plastic Market by Type (Polyamide (PA), Polyetherimide (PEI), Polyetheretherketone & Polyetherketoneketone (PEEK & PEKK), Reinforced HPP, Other Types), Form (Filament & Pellet and Powder), Technology (Fused Deposition Modeling (FDM)/Fused Filament Fabrication (FFF) and Selective Laser Sintering (SLS)), Application (Prototyping, Tooling, and Functional Part Manufacturing), and End-use Industry (Medical & Healthcare, Aerospace & Defense, Transportation, Oil & Gas, and Other End-use Industries), Region - Global Forecast to 2030
The 3D printing high-performance plastic market is expected to grow from USD 0.18 billion in 2025 to USD 0.45 billion by 2030, at a CAGR of 20.4% during the forecast period. Prominent companies in the 3D printing high-performance plastics market include Evonik Industries (Germany), Arkema (France), Lehmann&Voss&Co. (Germany), Nano Dimensions (US), Oxford Performance Materials (US), EOS GmbH (Germany), Solvay (Belgium), SABIC (Saudi Arabia), Forward AM Techbologies GmbH (Germany), Impossible Objects (US), and Apium Additive Technologies GmbH (Germany), Ensigner (Germany), Victrex Plc (UK), Mitsubishi Chemical Corporation (Japan), Toray Industries, Inc. (Japan), Proto Labs (US), 3DXTECH (US), 3D4Makers (Netherlands), Zortrax (Poland), Treed Filaments (Italy), Formlabs (US), Eplus3D (China), Junhua PEEK (China), Sculpteo (France), and PEEK (China).
- Published: June 2025
- Price: $ 4950
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3D Printed Boats Market by Technology (Fused Deposition Modelling (FDM), Stereolithiography, Selective Laser Sintering, Others), By Material (Thermoplastics, Composites, Metals, Others), By Application (Marine Transportation, Leisure, Defense, Research and Exploration), By Sales Channel (OEM, Aftermarket) and Region - Global Forecast to 2030
The major players in the global 3D Printed Boats Market
- Published: March 2026
- Price: $ 4950
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Flexible Circuits Market by Application (Aerospace, Telecommunications, Automotive, Medical Systems, Industrial & Instrumentation, Semiconductors, Consumer Electronics), by Material (Base Material, Conductor Material, Adhesives, Protective Coatings), by Construction (Single Sided Flex Circuits, Double Sided Flex Circuits, Multi-Layer Flex Circuits, Rigid Flex Circuits, Flex Coils, Sculpted Flex Circuits) - Global Forecasts & Analysis to 2021
This report provides a market analysis of Global Flexible Printed Circuits Market, which includes the study of Flexible Printed Circuits by Application, by Construction, by Material and by Geography. The report details the Global Flexible Printed Circuits Market over the next six years (2015-2021). It includes the analysis of the drivers, restraints, and challenges that influence the Global Flexible Printed Circuits Market along with, opportunities for its growth, during the forecast period. It also discusses the industry, market, and technological trends that currently prevail in the market in addition to, the technological advancements expected to impact the global demand for Flexible Printed Circuits.
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Tie Layer Resin Market by Base Resins (LLDPE, LDPE, HDPE, PP, EVA), Type (Reactive, Non-Reactive), Application (Flexible, Rigid), End-use Industry (Food & Beverage, Pharmaceutical & Medical, Automotive), and Region - Global Forecast to 2029
The tie layer resin market is expected to grow from USD 1.6 billion in 2024 to USD 1.8 billion in 2029, at a CAGR of 3.6% during the forecast period. The key players in the tie layer resin market include LyondellBasell Industries Holdings B.V. (UK), Westlake Corporation (US), Mitsui Chemicals, Inc. (Japan), Mitsubishi Corporation (Japan), Exxon Mobil Corporation (US), Dow (US), Polyram Group (Israel), Zeus Company LLC (US), The Compound Company (Netherlands), and Allnex GmBH (Germany).
- Published: June 2024
- Price: $ 4950
- TOC Available:
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3D Printing Metals Market by Metal Type (Titanium, Aluminum, Steel, Nickel & Cobalt, Other Metal Types), Form (Filaments, Powder), Technology (Powder Bed Fusion, Directed Energy Deposition, Binder Jetting, Metal Extrusion, Other Technologies), End-use Industry (Aerospace & Defense, Automotive, Medical & Dental, Other End-Use Industries), and Region - Global Forecast to 2030
The 3D printing metals market is expected to grow from USD 1.19 billion in 2025 to USD 3.62 billion by 2030, at a CAGR of 25.0% during the forecast period. Prominent companies include 3D Systems, Inc. (US), Renishaw plc (UK), Stratasys Ltd. (US), General Electric Company (US), Carpenter Technology Corporation (US), Materialise (Belgium), Sandvik AB (Sweden), EOS GmbH (Germany), Nano Dimension (US), Nikon SLM Solutions AG (Germany), Proto Labs (US), Titomic (Australia), Hoganas AB (Sweden), Forward AM Technologies GmbH (Germany), and Pollen AM Inc. (France).
- Published: May 2025
- Price: $ 4950
- TOC Available:
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