Here are relevant reports on : consumer-electronics-market
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High Performance Sensors Market by Type (Optical, Image, Radar, Pressure, Temperature, Proximity, Accelerometer, Humidity), Technology (MEMS, NEMS, CMOS), Industry (Military & Defense, Automotive, Consumer Electronics, Manufacturing, Telecommunication, Medical), Region- Global Forecast to 2030
The high-performance sensors market is dominated by a few globally established players such as Analog Devices Inc. (US), Baker Hughes (US), Infineon Technologies (Germany), NXP Semiconductor (Netherlands), Panasonic Corporation (Japan), STMicroelectronics N.V. (Switzerland), TE Connectivity (US), Texas Instruments (US), Northrop Grumman (US), Thales Group (US), and Telco Sensors Inc. (US) among others.
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography - Global Forecast to 2027
The molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027, at a compound annual growth rate (CAGR) of 22.9% during the forecast period.The key players device (MID) market and analyzes their market shares. Players profiled in this report are Molex (US), TE Connectivity (Switzerland), Amphenol Corporation (US), LPKF Laser & Electronics (Germany), and Taoglas (Dublin), Harting (Germany), Arlington Plating Company (US), MID Solutions (Germany), 2E Mechatronic (Germany), KYOCERA AVX (US) and Johnan (Japan), Teprosa(Germany), Sunway Communication(China), Axon Cable(France), S2P (France), Suzhou Cicor Technology (China), TactoTek (Finland), DuraTech (US), Tekra (US), Yomura Technologies (Taiwan), MacDermid Alpha Electronics (US), Galtronics (US), Yazaki Corporation (Japan), Chogori Technology (Japan), Suzhou Zeeteq Electronics (Japan), Toyo Connectors (Japan) and SINOPLAST (China).
- Published: August 2022
- Price: $ 4950
- TOC Available:
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Haptic Technology IC Market - By Components (Actuators, Sensors, Kinesthetic & Tactile sensing), Applications (Consumer Electronics, Medical, Automotive & Defense), Devices (Touch Screen, Input Devices) & Geography- Analysis And Forecast- (2014-2020)
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Electronic Waste Recycling Market by Source (Household Appliances, Consumer Electronics, IT & Telecommunication, Mobile Computing Devices), Materials (Glass, Metal, Plastics), Technology, and Region - Global Forecast to 2029
The electronic waste recycling market is expected to grow from USD 48.41 billion in 2024 to USD 66.33 billion in 2029, at a CAGR of 6.5% during the forecast period. Prominent companies include Dell Inc. (US), Umicore SA (Belgium), Quantum Lifecycle Partners (Canada), Enviro-Hub Holdings Ltd. (Singapore), Kuusakoski Oy (Finland), Stena Metall AB (Sweden), Call2Recycle Inc., (US), Aurubis AG (Germany), E-Parisara Pvt. Ltd. (India), ERI (US), Boliden Group (Sweden), Attero Recycling Pvt. Ltd. (India), Veolia (France), SIMS Ltd. (Australia) and among others.
- Published: November 2024
- Price: $ 4950
- TOC Available:
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Cyanoacrylate Adhesives Market by Chemistry (Ethyl cyanoacrylate, Methyl cyanoacrylate), End-use Industry (Industrial, Woodworking, Transportation (Automotive, Aerospace, Medical, Electronics, Consumer) - Global Forecast to 2029
The cyanoacrylate adhesives market is expected to grow from USD 2.22 billion in 2024 to USD 2.56 billion by 2029, at a CAGR of 2.9% during the forecast period. Henkel AG & Co. KGaA (Germany), H.B. Fuller Company (US), 3M (US), Sika AG (Switzerland), Huntsman International LLC (US), Arkema (France), Toagosei Co., Ltd (Japan), Illinois Tool Works Inc. (US), and Pidilite Industries Limited (India) are the key players in the global cyanoacrylate adhesives market.
- Published: September 2024
- Price: $ 4950
- TOC Available:
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Functional Composites Market by Type (Metal Matrix Composites, Polymer Matrix Composites), Function (Thermally Conductive, Electrically Conductive); End-User (Consumer Goods & Electronics, Transportation), Region - Global Forecast to 2021
The functional composites market is expected to grow from USD 28.62 Billion in 2016 to USD 43.35 Billion by 2021, at a CAGR of 8.7% from 2016 to 2021. Increase in the use of functional composites in various end-use industries is expected to drive the growth of functional composites market.
- Published: June 2016
- Price: $ 4950
- TOC Available:
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Heterogeneous Multiprocessing Market - By Type (Dual, Tri, Quad, Hexa, Octa), Technology (Integration, Architecture), Component (Hardware, Software), Application (Consumer Electronics, Automotive, IT & Telecom) & By Geography - Forecast & Analysis to 2014-2020
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Resistive Temperature Detector (RTD) Temperature Sensor Market by Material (Platinum, Nickel, Copper), Output (Digital, Analog), End User (Chemicals, Oil & Gas, Consumer Electronics, Automotive, and Others), Region - Global Forecast to 2030
The resistive temperature detector (RTD) temperature sensor market is projected to grow from USD 1.64 billion in 2025 to USD 1.96 billion by 2030, at a CAGR of 3.7%. The Key Players include Honeywell International Inc. (US), Texas Instruments Incorporated (US), Emerson Electric Co. (US), Endress+Hauser Group Services AG (Switzerland), Amphenol Corporation (US), and Siemens (Germany).
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Lithium-ion Battery Dispersant Market by Dispersant Type (Block Copolymers, Naphthalene Sulfonates, Lignosulfonates), End-Use (Consumer Electronics, Electric Vehicles, Military, Industrial), Formulation Type, and Region - Global Forecast to 2029
The lithium-ion battery dispersant market is expected to grow from USD 0.91 billion in 2024 to USD 1.70 billion by 2029, at a CAGR of 13.2% during the forecast period. Some of the leading players in this market include LG Chem (South Korea), Evonik Industries AG (Germany), Kao Corporation (Japan), Huntsman International LLC (US), and Ashland (US), and among others.
- Published: December 2024
- Price: $ 4950
- TOC Available:
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Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024
The Die Bonder Equipment Market is expected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% during the forecast period. BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France) are the key players in the die bonder equipment market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to increase their market share.
- Published: November 2019
- Price: $ 4950
- TOC Available:
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