Here are relevant reports on : organ-on-chip-market
-
Data Center Coolant Distribution Units Market by Type (In-Row, In-Rack, FDU), Cooling Type (Direct to Chip Cooling, Immersion Cooling), End User (Colocation Providers, Enterprises, Hyperscale), and Region Global Forecast to 2032
The data center coolant distribution units market is expected to grow from USD 1.05 billion in 2025 to USD 7.74 billion by 2032, at a CAGR of 33.0% during the forecast period. Leading players in this market include DCX Liquid Cooling Systems (Poland), nVent (US), NIDEC CORPORATION (Japan), Schneider Electric (France), Vertiv Group Corp. (US), KAORI HEAT TREATMENT CO., LTD. (Taiwan), Shenzhen Envicool Technology Co., Ltd. (China), Boyd (US), Delta Electronics, Inc. (Taiwan), Coolcentric (US), Hewlett Packard Enterprise Development LP (US), LiquidStack Holding B.V. (US), Shanghai Venttech Refrigeration Equipment Co.,Ltd. (China), Chilldyne, Inc. (US), COOLIT SYSTEMS (Canada), Trane (Ireland), Munters Group AB (Sweden), Lenovo (China), Super Micro Computer, Inc. (US), STULZ GMBH (Germany), Rittal GmbH & Co. KG (Germany), LITE-ON Technology Corporation (Taiwan), FläktGroup (Germany), and Nautilus Data Technologies (US).
- Published: September 2025
- Price: $ 4950
- TOC Available:
-
High Throughput Screening Market / HTS Market by Offering (Instruments, Consumables (Reagents, Kits), Software, Services), Technology (Cell-based Assays, Lab-on-Chip, Label-free), Application (Drug Discovery, Life Sciences Research) - Global Forecast to 2029
The global high throughput screening market, valued at US$25.7 billion in 2023, stood at US$28.8 billion in 2024 and is projected to advance at a resilient CAGR of 11.8% from 2024 to 2029, culminating in a forecasted valuation of US$50.2 billion by the end of the period.Growth in this market is primarily driven by the growing adoption of open innovative models in pharmaceutical & biotechnology companies, & the growing availability of funds for research
- Published: July 2024
- Price: $ 4950
- TOC Available:
-
Chip Scale Package (CSP) LED Market by Application (Backlighting Unit (BLU), Flash Lighting, General Lighting, Automotive, Others), Power Range (Low- & Mid-Power, and High-Power), and Geography (APAC, North America, Europe, RoW) - Global Forecast to 2025-2036
Chip-scale package (CSP) LEDs are the latest trend in the LED package market. According to IPC's standard J-STD-012 (implementation of flip chip and chip scale technology), to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die, and it must be a single-die and direct surface mountable package. Major players in the market are Lumileds (The Netherlands), Samsung (South Korea), Seoul Semiconductor (South Korea), LG Innotek (South Korea), OSRAM (Germany), Nichia (Japan), EPISTAR (Taiwan), Cree (US), Genesis Photonics (Taiwan), and Lumens (South Korea).
- Published: March 2026
- Price: $ 4950
- TOC Available:
-
3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).
- Published: May 2023
- Price: $ 4950
- TOC Available:
-
DLP Projector Market by Light Source (Lamp, LED, and Laser), Chip Model, by Brightness, Throw Distance (Normal Throw, Short Throw, and Ultra-short Throw), Application, and by Geography (The Americas, Europe, APAC, and RoW) - Global Forecast to 2020
The DLP projector market is estimated to reach USD 5.52 Billion by 2020, at a CAGR of 6.3% between 2015 and 2020. This report estimates the market size and future growth potential of the DLP projector market across different segments such as light source, chip model, brightness, throw distance, application, and geography. The base year considered for the study is 2014 and the market size is forecasted for the period between 2015 and 2020. The increase in the number of digital screens in the film industry, growing digitalization in the education sector, and increasing adoption of 3D projection in emerging applications are the factors that are expected to drive the market during the forecast period.
- Published: December 2015
- Price: $ 4950
- TOC Available:
-
Wi-Fi 6 Market by (Wireless Access Points, Mesh Routers, Home Gateways, Wireless Controllers, System on Chip), Applications (Immersive, HD Video Streaming, Smart Devices, Industry 4.0, Telemedicine, Public Wi-Fi & Dense Environments) – Forecast to 2030
The Wi-Fi 6 market size is projected to reach USD 20.9 billion by 2028, at a Compound Annual Growth Rate (CAGR) of 29.3% during the forecast period. The major vendors covered in the Wi-Fi 6 market include Cisco Systems Inc. (US), Qualcomm Technologies Inc. (US), Broadcom Inc (US), Intel Corporation (US), Huawei technologies (China), NETGEAR Inc (US), Juniper Networks Inc (US), Extreme Networks Inc. (US), Ubiquiti Inc. (US), Fortinet Inc. (US), Aruba Networks (US), NXP Semiconductors (Netherlands), AT&T (US), D–Link Corporation (Taiwan), Alcatel Lucent Enterprise (France), TP–Link Corporation Limited (China), MediaTek Inc. (Taiwan), Telstra (Australia), Murata Manufacturing Co., Ltd. (Japan), Sterlite Technologies Limited (India), Renesas Electronics (Japan), H3C Technologies Co., Ltd. (China), Keysight Technologies (US), LitePoint (US), Rohde & Schwarz (Germany), Cambium Networks, Ltd. (US), Senscomm Semiconductors Co., Ltd. (China), XUNISON (Ireland), Redway Networks Ltd. Company (England), VSORA SAS (France), WILUS Inc. (South Korea), Federated Wireless, Inc. (US), Actiontec Electronics (US), ADB Global (Switzerland), SDMC Technology (China), and Edgewater Wireless (Canada).
- Published: August 2023
- Price: $ 4950
- TOC Available:
-
High Power LED Market by Packaging Type (Flip Chip, Mesa, and Vertical), Application (General Lighting, Automotive, Flash Lighting, Backlighting,) and Geography (APAC, North America, Europe, Rest of the World) - Global Forecast 2025-2036
The global high power LED market was valued at USD 4.23 billion in 2025 and is estimated to reach USD 6.08 billion by 2036, at a CAGR of 3.4% between 2025 and 2036.. The major high power LED vendors include Cree (US), Nichia (Japan), OSRAM (Germany), Samsung (South Korea), Everlight (Taiwan), Lumileds (Netherlands), Epistar (Taiwan), LG Innotek (South Korea), Broadcom (US), MLS (China), and Seoul Semiconductor (South Korea). The other companies include Luckylight Electronics (China), Plessey Semiconductors (UK), Betlux Electronics (China), Effilux (France), Lite-On Technology (Taiwan), Crescent LED (UK), Vollong Electronics (China), and Stanley Electric (Switzerland).
- Published: March 2026
- Price: $ 4950
- TOC Available:
-
System-on-Chip (SoC) Market by Core Count (Single-core, Dual-core, Quad-core, Hexa-core, Octa-core), Core Architecture (ARM, X86, RISC-V), Device (Smartphone, Tablet, Laptop, Smart TV & STB, Infotainment System, Router, Gateway) - Global Forecast to 2029
The System-on-Chip (SoC) market size is expected to grow from USD 138.46 billion in 2024 to USD 205.97 billion by 2029, at a compound annual growth rate (CAGR) of 8.3% during the forecast period.The kay players Qualcomm Technologies, Inc. (US), MediaTek Inc. (Taiwan), Samsung (South Korea), Apple Inc. (US), Broadcom (US), Intel Corporation (US), Advanced Micro Devices, Inc. (US), NVIDIA Corporation (US), HiSilicon (China), Microchip Technology Inc. (US).
- Published: January 2025
- Price: $ 4950
- TOC Available:
-
Digital Signage Market Size, Share & Trends by Product (Video Walls, Kiosks, Billboards, Menu Boards, System-on-chip Displays), Resolution (4K, 8K, FHD, HD), Installation Location (Indoor, Outdoor), Software, Display Size, Application, and Region - Global Forecast to 2030
The digital signage market is expected to grow from USD 21.45 billion in 2025 to USD 28.88 billion by 2030, registering a CAGR of 6.1%. The key players SAMSUNG (South Korea), LG Electronics (South Korea), Sharp NEC Display Solutions (Japan), LEYARD (China), Sony Group Corporation (Japan), Barco (Belgium), Panasonic Corporation (Japan), AUO Corporation (Taiwan), Shanghai Xianshi Electronic Technology Co., Ltd. (China), and BrightSign LLC (US).
- Published: January 2026
- Price: $ 4950
- TOC Available:
-
Advanced Process Nodes Market by Node Size (= 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, = 10 nm), Packaging Technology (SiP, Flip-Chip, 2.5D/3D, WLCSP, FO), Processor Type (CPU, GPU, FPGA, ASIC, SoC), Architecture, Application, Region - Global Forecast to 2032
The major players in the global Advanced Process Nodes Market
- Published: March 2026
- Price: $ 4950
- TOC Available:
Records 41 to 50 of 50