Here are relevant reports on : die-bonding-technology-market
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Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024
The Die Bonder Equipment Market is expected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% during the forecast period. BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France) are the key players in the die bonder equipment market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to increase their market share.
- Published: November 2019
- Price: $ 4950
- TOC Available:
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029
The semiconductor & ic packaging materials market is expected to grow from USD 43.9 billion in 2024 to USD 70.9 billion by 2029, at a CAGR of 10.1% during the forecast period. The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc.
- Published: March 2024
- Price: $ 4950
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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).
- Published: September 2023
- Price: $ 4950
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Hybrid Bonding Market Size, Share & Trends By Wafer-to-Wafer (W2W), Die-to-Wafer (D2W), Die-to-Die (D2D), Wafer Bonder, Surface Prep Tool, Inspection & Metrology Tool, Cleaning & CMP System, 2.5D Packaging, and 3D Stacked IC - Global Forecast to 2032
The global hybrid bonding market is expected to grow from USD 164.7 million in 2025 to USD 633.9 million by 2032, at a compound annual growth rate (CAGR) of 21.2% during the forecast period. The Key Players EV Group (EVG) (Austria), Applied Materials, Inc. (US), SUSS MicroTec SE (Germany), Besi (Netherlands), Kulicke & Soffa Industries, Inc. (Singapore), Tokyo Electron (TEL) (Japan), and ASMPT (Singapore).
- Published: December 2025
- Price: $ 4950
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Bonding Films Market by Type (Epoxy, Acrylic, Polyurethane), Technology (Thermally Cured, Pressure Cured), End-Use Industry (Electrical & Electronics, Transportation, Packaging), Region - Global Forecast to 2022
The bonding films market was valued at USD 613.5 Million in 2016 and is projected to reach USD 985.5 Million by 2022, at a CAGR of 8.2% between 2017 and 2022. In this report, 2016 has been considered as the base year and the forecast period has been considered from 2017 to 2022. Henkel AG & Co. KGaA (Germany), 3M (US), Cytec Solvay Group (Belgium), Hitachi Chemical Co., Ltd. (Japan), Arkema S.A. (France), H.B. Fuller (US), Hexcel Corporation (US), Gurit (Switzerland), DuPont (US), Rogers Corporation (US), etc. are the key players operating in the bonding films market.
- Published: August 2017
- Price: $ 4950
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CAM Software Market by Application (Machining & Production (CNC Machining, Sheet Metal Fabrication), Product Design & Prototyping (Additive/3D Printing, Tool & Die Manufacturing), Quality Control & Inspection), 2D, and 3D - Global Forecast to 2030
The CAM Software Market size is projected to reach USD 5.69 billion by 2030 at a compounded annual growth rate (CAGR) of 9.0% during the forecast period. Some of the computer-aided manufacturing vendors include Autodesk (US), Siemens (Germany), Hexagon (Sweden), Dassault Systemes (France), Hypertherm (US), PTC (US), SolidCAM (US), TopSolid (France), CAMWorks (US) and MasterCAM (US).
- Published: November 2024
- Price: $ 4950
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Steel Casting Market by Type (Carbon Steel, Low-Alloy Steel, High-Alloy Steel), Process (Sand Casting, Investment Casting, Die Casting), Formulation (Solvent Based, Solventless, Emulsion), Application, & Region - Global Forecast to 2029
The steel casting market is expected to grow from USD 33.90 billion in 2025 to USD 42.18 billion by 2029, at a CAGR of 5.6% during the forecast period. The steel casting Market comprises major players such as ArcelorMittal (Luxembourg), Doosan Corporation (South Korea), Kobe Steel, Ltd., (Japan), Nucor Corporation (US), Isgec Heavy Engineering Ltd. (India), and Georg Fischer Ltd. (Switzerland), The Japan Steel Works, Ltd. (Japan), Nelcast Limited (India), Ferralloy, Inc. (US), POSCO (South Korea) and others are covered in the steel casting market. Expansions, acquisitions, joint ventures, and new product developments are some of the major strategies adopted by these key players to enhance their positions in the steel casting Market.
- Published: January 2025
- Price: $ 4950
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Mold Release Agents Market by Type (Water-based, Solvent-based), Application (Die-casting, Rubber Molding, Plastic Molding, Concrete, PU Molding, Wood Composite & Panel Pressing, Composite Molding), and Region - Global Forecast to 2030
The global mold release agents market is projected to grow from USD 2.39 billion in 2025 to USD 3.25 billion by 2030, at a CAGR of 6.32% between 2025 and 2030.The key players include Freudenberg Group (Germany), Daikin Industries, Ltd. (Japan), Henkel AG & Co. KGaA (Germany), LANXESS AG (Germany), Shin-Etsu Chemical Co., Ltd. (Japan), Dow Inc. (US), Michelman, Inc. (US), Marbocote Ltd. (UK), McGee Industries, Inc. (US), and Miller-Stephenson, Inc. (US).
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Aluminum Casting Market by Process (Die Casting, Permanent Mold Casting, Sand Casting), End-use Sector (Transportation, Industrial, Building & Construction), and Region (APAC, Europe, North America, South America, MEA) - Global Forecast to 2026
The aluminum casting market is projected to reach USD 100.5 billion by 2026. It is expected to grow at a CAGR of 7.4% during the forecast period.The key companies profiled in this report on the aluminum casting market include Alcoa Corporation (US), Ryobi Limited (Japan), Aluminum Corporation of China Limited (China), Rio Tinto (UK), United Company RUSAL (Russia) are key players in aluminum casting market.
- Published: October 2021
- Price: $ 4950
- TOC Available:
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Semiconductor Bonding Market Size, Share & Industry Growth Analysis Report by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type, Technology and Region - Global Growth Driver and Industry Forecast to 2036
The Semiconductor Bonding Market is estimated to be valued at approximately USD 4–6 billion in 2025 and is projected to reach around USD 12–15 billion by 2036, expanding at a compound annual growth rate (CAGR) of 9–11% during the forecast period. The market is experiencing strong and sustained growth as the global semiconductor industry undergoes rapid transformation driven by advanced packaging, miniaturization, and high-performance computing demands. The increasing adoption of Artificial Intelligence (AI), Internet of Things (IoT), 5G, and high-performance computing is significantly boosting demand for advanced semiconductor packaging technologies, where bonding plays a critical role. As chip architectures become more complex, bonding technologies such as wafer bonding, die bonding, and hybrid bonding are becoming essential for enabling higher integration density, improved performance, and reduced power consumption. Automation, robotics, and digital manufacturing are further enhancing bonding precision, yield rates, and scalability, making semiconductor bonding a crucial enabler of next-generation electronics.
- Published: October 2026
- Price: $ 4950
- TOC Available:
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