Here are relevant reports on : fuzzy-logic-market

• Power SCADA Market by Architecture (Hardware, Software, Services), Component (Remote Terminal Unit, Programmable Logic Controller, Human Machine Interface, Communication Systems, Protection relays, MTU), End User and Region - Global Forecast to 2028

  The power SCADA market is projected to reach USD 2.9 billion by 2028, a notable compound annual growth rate (CAGR) of 7.1% during the forecast period. Key players in the global power SCADA market include ABB (Switzerland), Rockwell Automation (US), Siemens (Germany), Schneider Electric (France), and Emerson (US).

  • Published: January 2024
  • Price: $ 4950
  • TOC Available:

• Logic Analyzer Market by Type (Modular Logic Analyzers, PC-Based Logic Analyzers), Channel Count (2-32, 32-80, >80), Vertical (Electronics & Semiconductor, Automotive & Transportation, Aerospace & Defense), and Geography - Global Forecast to 2024-2036

  The global logic analyzer market was valued at USD 416.1 million in 2024 and is estimated to reach USD 1,038.7 million by 2036, at a CAGR of 8.0% between 2025 and 2036.Keysight Technologies (US), Fortive (US), Rohde & Schwarz (Germany), National Instruments (US), Yokogawa Electric (Japan), Teledyne (US), Advantest Corporation (Japan), ARM Limited (UK), GAO Tek (Canada), Rigol Technologies (China), Saleae, Inc (US), Good Will Instrument Co., Ltd. (Taiwan), Zeroplus Technology Co., Ltd (Taiwan), Qingdao Hantek Electronic Co., Ltd. (China), NCI Logic Analyzers (US), Scientech Technologies Pvt. Ltd. (India), OWON Technology (China), IKALOGIC (France), Red Pitaya (Europe), and GSAS Micro Systems Pvt Ltd. (India) are among the major companies operating in the logic analyzer market.

  • Published: January 2026
  • Price: $ 4950
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• 3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028

  The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).

  • Published: September 2023
  • Price: $ 4950
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• 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028

  The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).

  • Published: May 2023
  • Price: $ 4950
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• Electro Hydraulics Market for Off-Highway Equipment by Type (Excavators, Backhoe Loaders, Wheel Loaders, Agriculture Loaders), Component (Hydraulic Cylinders, Electric Motors, Hydraulic Pumps, Control Valves, Sensors, Electronic Control Unit, Programmable Logic Controller), Type, and Region - Global Forecast to 2032

  The electro hydraulics market for off-highway equipment is projected to grow from 92,501 units in 2025 to 234,487 units by 2032 at a CAGR of 14.2%. Europe is projected to account for the largest share of the global electro hydraulics market for off-highway equipment during the forecast period, at ~40%. The growing demand for electro hydraulics in this region is driven by the need for more efficient technologies, higher productivity, and the strong presence of major electro hydraulics technology providers. The dominance of the European market is further enhanced due to the presence of key technology providers, such as Bosch Rexroth (Germany), Power-Packer Europa B.V. (Netherlands), Poclain (France), and Walvoil S.p.A (Italy). The region also has a strong presence of several leading off-highway equipment manufacturers, including AB Volvo (Sweden), Liebherr (Switzerland), J C Bamford Excavators Ltd. (UK), and CNH Industrial N.V. (Italy). These technology providers have developed advanced electro hydraulic systems for many off-highway machines.

  • Published: July 2025
  • Price: $ 4950
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• Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027

  The thin wafer market is expected to grow from USD 11.4 billion in 2022 to USD 20.6 billion by 2027, at a compound annual growth rate (CAGR) of 12.5% during the forecast period.The Key Players Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), and Applied Materials (US). Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US).

  • Published: September 2022
  • Price: $ 4950
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• IoT Node and Gateway Market Size by Hardware (Processor, Connectivity IC, Sensor, Memory, Logic Devices), End-use Application (Consumer Electronics, Building Automation, Automotive & Transportation, Wearable Devices, Retail) and Region - Global Forecast to 2029

  The IoT Node and Gateway market is expected to grow from USD 424.6 billion in 2024 to USD 604.7 billion by 2029, at a compound annual growth rate (CAGR) of 7.3% during the forecast period.The key players Intel Corporation (US), Qualcomm Technologies, Inc. (US), Texas Instruments Incorporated (US), STMicroelectronics (Switzerland), Microchip Technology Inc. (US), Huawei Technologies Co., Ltd. (China), NXP Semiconductors N.V. (Netherlands), Cisco Systems, Inc. (US), Hewlett Packard Enterprise Development LP (US), TE Connectivity Ltd (Switzerland), Advantech Co., Ltd. (Taiwan), Dell Technologies (US).

  • Published: May 2024
  • Price: $ 7150
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• Industrial IoT Market Size, Share & Industry Trends Growth Analysis Report by Offering (Hardware (Processors, Connectivity ICs, Sensors, Memory Devices, Logic Devices), Software (PLM, MES, SCADA, OMS), Platforms), Connectivity Technology, Deployment, Vertical and Region - Global Forecast to 2029

  The industrial IoT market is expected to grow from USD 194.4 billion in 2024 to USD 286.3 billion by 2029, at a compound annual growth rate (CAGR) of 8.1% during the forecast period.The key players ABB (Switzerland), General Electric (US), Emerson Electric Co. (US), Intel Corporation (US), Cisco Systems, Inc. (US), SAP SE (Germany), Honeywell International Inc. (US), Siemens (Germany), Huawei Technologies Co., Ltd. (China), Rockwell Automation (US), Arm Limited (UK), PTC (US), Dassault Systèmes (France), IBM (US), Robert Bosch GmbH (Germany), NEC Corporation (Japan), ANSYS, Inc. (US), Worldsensing (Spain), Arundo (Norway), Software AG (Germany).

  • Published: June 2024
  • Price: $ 4950
  • TOC Available:

• Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029

  The global interposer and FOWLP market size is expected to grow from USD 35.6 billion in 2024 to USD 63.5 billion by 2029, at a compound annual growth rate (CAGR) of 12.3% during the forecast period.The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea).

  • Published: January 2024
  • Price: $ 4950
  • TOC Available:

• High-Integrity Pressure Protection System (HIPPS) Market Size, Share, Statistics and Industry Growth Analysis Report by Component (Field Initiator, Logic Solver, Valves, Actuators), Service (Maintenance, TIC), Industry (Oil & Gas, Chemical) and Region (2025-2030)

  The global High Integrity Pressure Protection System market is anticipated to grow from USD 422.0 million in 2025 to USD 564.2 million by 2030, recording a CAGR of 6.0% during 2025–2030. A few of the key players in the HIPPS market are Emerson Electric Co. (US), Yokogawa Electric Corp. (Japan), HIMA (Germany), Rockwell Automation Inc. (US), Schneider Electric (France), Honeywell International (US), ABB (Switzerland), Siemens (Germany), Schlumberger (US), and Baker Hughes (US) are among the major players in the HIPPS market.

  • Published: January 2022
  • Price: $ 4950
  • TOC Available:

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