Here are relevant reports on : organ-on-chip-market
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Microfluidics Market by Product (Chip, Sensor, Valve, Pump, Needle), Material (Silicon, Polymer), Application [Diagnostics (Clinical, PoC), Research (Proteomics, Genomics, Cell), Therapeutics (Drug Delivery Wearables)], End User – Global forecast to 2030
The global Microfluidics market, valued at US$23.71 billion in 2024, stood at US$24.96 billion in 2025 and is projected to advance at a resilient CAGR of 8.3% from 2025 to 2030, culminating in a forecasted valuation of US$37.19 billion by the end of the period. Several significant factors are driving the growth of the microfluidics market, thereby enhancing its expansion and applications. There is a growing demand for point-of-care diagnostics, which require fast, accurate, and cost-effective instruments.
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Antenna-On-Chip (Aoc) And Antenna-In-Package (Aip) Market: By Application (Imaging, Display, Holographic, Measurement, And Remote Sensing) And Geography (2013 – 2018)
The recent development of a micron-scale spatial light modulator (SLM) by the researchers at Rice University (U.S.) is expected to change the approach regarding optical information processing. The SLM is similar to the one used in sensing and imaging devices, only with the potential to run several orders of magnitude faster. Its ‘antenna on a chip’ operates in 3D (free space) instead of the two-dimensional space in traditional semiconductor devices.
- Published: May 2026
- Price: $ 4950
- TOC Available:
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Data Center Chip Market by Offerings (GPU, CPU, FPGA, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory (DRAM (HBM, DDR)), Network (NIC/Network Adapters, Interconnects)) – Global Forecast to 2030
The global data center chip market is expected to grow from USD 206.96 billion in 2025 to USD 390.65 billion by 2030, at a compound annual growth rate (CAGR) of 13.5% during the forecast period.The key players AMD (US), Intel Corporation (US), NVIDIA Corporation(US), AWS (US), Google (US), Samsung (South Korea), SK HYNIX Inc. (South Korea), Alibaba (China), Micron Technology (US), Monolithic Power Systems, Inc. (US).
- Published: December 2024
- Price: $ 4950
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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).
- Published: September 2023
- Price: $ 4950
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Chip Antenna Market by Product Type (Dielectric Chip and LTCC Chip), Application Type (WLAN/WiFi, Bluetooth/BLE, Dual Band/Multi-Band, and GPS/GNSS), End-User Industry (Automotive, Healthcare, and Industrial & Retail) - Global Forecast to 2022
The chip antenna market is expected to be worth USD 2.99 Billion by 2022, growing at a CAGR of 13.1% between 2016 and 2022. A key factor driving the growth of this market is the increasing demand for chip antennas for IoT applications such as smart homes, smart grids, industrial internet, and connected cars. The dielectric chip antenna segment is estimated to hold the largest share in the chip antenna market, by product type.
- Published: September 2016
- Price: $ 4950
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Wi-Fi 7 Market by Hardware (Access Point, Router, System on Chip), by Location Type (Indoor, Outdoor), by Applications (Immersive Technologies, HD Video Streaming, Smart Devices, Industry 4.0, Telemedicine, Public Wi-Fi & Dense Environments), by Solution (Access Point, Router, System on Chip) - Global Forecast to 2030
The Wi-Fi 7 market is projected to reach USD 24.2 billion by 2030, at a CAGR of 57.2% during the forecast period. The major vendors covered in the Wi-Fi 7 market Qualcomm (US), Broadcom (US), TP-Link (China), ZTE (China), Mediatek (Taiwan), Keysight Technologies (US), MaxLinear (US), Huawei (China), Commscope (US), Vantiva (France), LitePoint (US), Rohde & Schwarz (Germany), Intel (US), HFCL (India), Netgear (US), SDMC Technology (China), Senscomm Semiconductor (China), H3C (China), VVDN Technologies (India), Actiontec Electronics (US), ADB Global (Switzerland), Ruijie Networks (China), and Edgewater Wireless Systems (Canada).
- Published: June 2023
- Price: $ 4950
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HLA Typing for Transplant Market by Technology (PCR (SSO, SSP, Real-time), NGS, Sanger), Product (Instrument, Reagent, Software), Application (Chimerism, Antibody Screening), Type (Organ, Soft Tissue), End User (Hospital, Clinic) - Global Forecast to 2030
Global human leukocyte antigen (HLA) typing for transplant market valued at $1.0B in 2024, reached $1.1B in 2025, and is projected to grow at a robust 6.0% CAGR, hitting $1.4B by 2030. Market growth is driven by an increasing number of transplant procedures worldwide, a shift towards molecular assay technologies for HLA typing, favorable public-private investments and funding for research, and a strong focus by manufacturers on launching high-resolution HLA typing products.
- Published: May 2025
- Price: $ 4950
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Delivery Drones Market by Solution (Platform (Fixed Wing, Multirotor, Fixed Wing VTOL), Software (Route Planning & Optimizing, Live Tracking, Camera Vision, Inventory Management, Fleet Management), Infrastructure (Ground Control Station, Charging Station, Landing Pad, Micro-Fulfillment Centre)], End User [Retail & Food (E-Commerce Package Delivery, Restaurant Package Delivery, Store Package Delivery), Postal & Logistics (Postal Delivery, Parcel Delivery), Healthcare & Pharmacy (Medicine Supply, Blood Supply, Organ Transport, Equipment Transport)), Range (Short Range, Medium Range, Long Range), Payload Capacity (<5 Kilograms, 5-10 Kilograms, >10 Kilograms), Speed (>100 Km/Hour, 100-150 Km/Hour, >150 Km/Hour) and Region - Global Forecast to 2030
Exhaustive secondary research was undertaken to obtain information on the delivery drones market, the peer market, and the parent market. The next step was to validate these findings, assumptions, and sizing by industry experts across the value chain through primary research. Both, top-down and bottom-up approaches were employed to estimate the complete market size. Thereafter, market breakdown and data triangulation were used to estimate the size of segments and subsegments.
- Published: May 2026
- Price: $ 4950
- TOC Available:
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Al Chip Market By Offerings (GPU, CPU, FPGA, NPU, TPU, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory {DRAM (HBM, DDR)}, Network {NIC/Network Adapters, Interconnects}), Function (Training, Inference), & Region - Global Forecast to 2032
The AI chip market is expected to grow from USD 203.24 billion in 2025 to USD 564.87 billion by 2032, at a compound annual growth rate (CAGR) of 15.7% during the forecast period. The Key Players NVIDIA Corporation (US), Advanced Micro Devices, Inc. (AMD) (US), Intel Corporation (US), Micron Technology, Inc. (US), Google (US), Qualcomm Technologies, Inc. (US), Apple Inc. (US), Huawei Technologies Co., Ltd. (China), SK Hynix Inc. (South Korea), Samsung (South Korea), Imagination Technologies (UK), Graphcore (UK), and Cerebras (US).
- Published: December 2025
- Price: $ 4950
- TOC Available:
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Semiconductor Bonding Market Size, Share & Industry Growth Analysis Report by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type, Technology and Region - Global Growth Driver and Industry Forecast to 2026
The global semiconductor bonding market size is projected to reach USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% during the forecasting period. The semiconductor bonding market is dominated by a few globally established players such as Intel Corporation (US), Google. Inc (US), NVIDIA Corporation (US), Xilinx Inc. (US), IBM Corporation (US), Advanced Micro Devices, Inc (US), Marvell Technology (Hamilton), and Qualcomm Technology (US).
- Published: September 2021
- Price: $ 4950
- TOC Available:
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