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The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. The high adoption of SLPs by leading OEMs, surge in demand for smart consumer electronics and wearable devices, and impactful benefits of SLPs are the major factors driving the growth of the substrate-like PCB market. AT&S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck Electronics (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); LG Innotek (South Korea) are major players in the substrate-like PCB market.
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
The overall intelligent virtual assistant (IVA) market was valued at USD 1.36 Billion in 2016 and is expected to reach USD 17.72 Billion by 2023, at a CAGR of 38.82% between 2017 and 2023. The report aims at estimating the market size and future growth potential of the IVA market based on product, user interface, type, industry, and geographic analysis. Major companies in the overall IVA market that have been included in this report are Alphabet (US), Amazon.com (US), Apple (US), Nuance Communications (US), IBM (US), Microsoft (US), Samsung Electronics (South Korea), Inbenta Technologies (US), Baidu (China), and Blackberry (US).
The Interactive voice response Market is witnessing strong global expansion as enterprises increasingly adopt AI-driven customer engagement systems, automated call handling, and intelligent contact center solutions. In 2025, the global Interactive voice response Market size is estimated at approximately USD 6 billion, and it is projected to reach nearly USD 18 billion by 2035, growing at a CAGR of 11 % – 12 % during the forecast period 2025–2035.
The sensor hub market was valued at USD 9.87 Billion in 2016 and is expected to reach USD 32.53 Billion by 2023, at a CAGR of 18.9% during the forecast period. The sensor hub market is driven by factors such as the steady growth in the number of integrated sensors in smartphones and the increasing use of 6-axis and 9-axis sensor solutions or use of sensor fusion within devices. Major players involved in the sensor hub market include Microchip Technology, Inc.(US), STMicroelectronics N.V. (Switzerland), Robert Bosch GmbH (Germany), NXP Semiconductors N.V.(Netherland), RoHM Co. Ltd. (Japan), Analog Devices, Inc.(US), InvenSense, Inc. (US), Intel Corp (US), Infineon Technologies AG (Germany), RoHM Co. Ltd. (Japan) and Memsic, Inc. (US).
The ballast water treatment (BWT) market was valued at USD 14.29 Billion in 2016 and is expected to reach USD 118.77 Billion by 2022, at a CAGR of 37.19% during the forecast period. The growth of this market is propelled by the increasing government rules and regulations for the installation of BWT systems in the ships.
The global G.fast chipset market is expected to grow from USD 41.0 Million in 2016 to USD 4,216.3 Million by 2022, at a CAGR of 116.5% between 2016 and 2022. The increased competition among the broadband service providers accelerates the demand for the G.fast chipset market across the world.
The M&A activity in the 3D printing industry has picked up pace in terms of the value as well as the number of deals. The analysis of many M&A deals reveals that 3D printing companies look for small- and mid-sized players that have lower operating expenses compared to their growth potential in the 3D printing industry value chain. Small-to mid-sized companies lacking the scale to grow have become attractive takeover targets for major players. There were maximum M&A deal announcements in 2014; it was a record year since 2010; this was followed by the number of announcements between 2013 and 2015.
The power management IC (PMIC) market is estimated to reach USD 34.86 Billion by 2022, at a CAGR of 8.08% between 2016 and 2022. The report aims at estimating the size and future growth potential of the PMIC market across different segments on the basis of product, application, and region. The base year considered for the study is 2015 and the market size is forecasted between 2016 and 2022. The rise in adoption of power management IC (PMICs) in the consumer electronics, wearable electronics, healthcare, and automotive sectors is expected propel the growth of the market for PMICs in the next five years.
Sputter coating is one of the popular and fastest growing physical vapour deposition techniques. The technology has major applications in electronics & semiconductor sector and is expected to remain an important market during the forecast period. The sputter coating market for target materials and equipment is expected to grow from USD 4166.3 Million in 2014 to USD 5613.8 Million in 2020, at a CAGR of 4.96 % during the forecast period (2015-2020).
Video walls provide various features, one of them being high-brightness screens; they are designed to release more light than the normal commercial-grade digital signs in the market, which are capable of surviving harsh external usage conditions. These screens are much more robust than the consumer-grade televisions that are commonly supplied to withstand these harsh environments. The video wall technology is emerging in both the developed and developing countries; it has a relatively lower turnaround time in the developing countries as this technology is available at higher prices with respect to the concerned economy.
Advanced process control (APC) encompasses a broad range of sophisticated technologies and tools that are used to optimize plant performances across a range of applications. It is used to optimize plant performance and stabilize plant operations by minimizing the fluctuations of key process variables. Today, APC technology is available all across the globe and is being increasingly used in new applications apart from its conventional use in oil & gas and petrochemical industry.
The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.
A standard SoC consists of the application processing IP and peripherals. It also consists of analog IP, digital IP, memory IP, ASIC/FPGA/Programmable Logic IP and others. Mixed Signal System-on-a-Chip (MxSoC) is a relatively new category in SoC which is designed for mixed signal (handling both analog and digital purposes). Today the application area of mixed signal technology has spread in all end user sectors from Computers, ICT sectors to Consumer Electronics, Industrial and others. Technological advancements of IC technology have enabled a system level integration on a System-on-a-Chip making MxSoC a suitable and efficient solution for applications in the LSI industry.
Urbanization, increasing infrastructure, and government initiatives are the factors resulting into increase in modern lighting products. Incandescent lighting turns out to be a very costly and poor medium of lighting source. This stirs the push to LED lighting. COB LED technology has emerged due to its features such as low power consumption, cost effective lighting, and high intensity output. COB LED market contributes around 7 to 8% to the overall market for LED and is expected to reach around 20% in the near future.
The global LED chips market is thus witnessing an increasing demand, and companies are expanding their manufacturing capabilities to meet this demand. High brightness LED chips currently enjoy high growth as the backlighting application in TVs is shifting from traditional CCFL technology to LED technology.
This report highlights the basic structure of the nanophotonics market and its various sub-segments, including LEDs (Light-Emitting Diodes), OLEDs (Organic Light-Emitting Diodes), NFO (Near Field Optics), Nanophotonic ICs (Integrated Circuits), Optical Switches, Optical Amplifiers and Holographic memory. These individual markets are further broken down into their respective sub-segments based on products, ingredients and applications.