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The Die Bonder Equipment Market is expected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% during the forecast period. BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France) are the key players in the die bonder equipment market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to increase their market share.
The Ion Milling System Market is expected to grow from USD 1.5 billion in 2019 to USD 2.3 billion by 2024, at a CAGR of 8.5% during the forecast period. Key players in the market include Veeco Instruments Inc. (US), Leica Microsystems Gmbh (Germany), Hitachi High-Technologies Corporation (Japan), Gatan, Inc. (US), Intlvac Thin Film Corporation (US), AJA International Inc. (US), Nano-Master, Inc. (US), Nordiko Technical Services Ltd. (UK), scia Systems GmbH (Germany), and Technoorg Linda co. ltd. (Hungary).
The overall pneumatic tube system market is expected to grow from USD 1.9 billion in 2019 to USD 2.6 billion by 2024, at a CAGR of 6.9%. The growth of market is driven by factors such as demand for automation in material handling across industries, growing medical automation for reproducibility and accuracy, emerging e-commerce industry, and enhanced productivity enabled by improved supply chain processes. Thriving recycling and waste treatment worldwide and technological innovation with improved capabilities are expected to provide huge growth opportunities to players in the market. The report profiles the most promising players in the market. The market is highly dynamic because of the presence of a significant number of big and small players operating in it. Key players in the market are Aerocom Systems (Germany), Swisslog Holding (Switzerland), Pevco (US), Kelly Systems (US), Quirepace (UK), Eagle Pneumatic (US), Telecom Bedrijfscommunicatie (Netherlands), Siebtechnik (Germany), Hamilton Security (US), Airlink International (US), Hanazeder Electronic (Austria), Colombo Pneumatic Tube Systems (US), Hanter Ingenjörsteknik (Sweden), Oppent (Italy), S&S Engineering (Japan), Air-Log (Germany), Thalmayr (Austria), Zip Pneumatics (US), Lamson Group (US), and Sumetzberger (US).
The high density interconnect (HDI) market is expected to grow from USD 9.5 billion in 2018 to USD 16.9 billion by 2023, at a CAGR of 12.3% from 2018 to 2023. A few key factors driving the growth of this market are increasing adoption of advanced electronics and safety measures in the automotive vertical and growing demand for smart consumer electronics and wearable devices. Unimicron (Taiwan), Compeq Co. (Taiwan), TTM Technologies (US), Austria Technologie & Systemtechnik (Austria), Zhen Ding Tech. (Taiwan), IBIDEN (Japan), MEIKO ELECTRONICS Co. (Japan), FUJITSU INTERCONNECT TECHNOLOGIES (Japan), Tripod Technology Corp. (Taiwan), Unitech (Taiwan), SAMSUNG ELECTRO-MECHANICS (South Korea), Daeduck GDS Co (South Korea), DAP Corp. (South Korea), Korea Circuit (South Korea), CMK (Japan), NCAB Group (Sweden), SIERRA CIRCUITS (US), and Multek (Hong Kong) are among the major players in the HDI market.
The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. The high adoption of SLPs by leading OEMs, surge in demand for smart consumer electronics and wearable devices, and impactful benefits of SLPs are the major factors driving the growth of the substrate-like PCB market. AT&S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck Electronics (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); LG Innotek (South Korea) are major players in the substrate-like PCB market.
The market for power amplifiers is expected to grow from USD 21.4 billion in 2018 to USD 30.6 billion by 2023, at a CAGR of 7.4% during the forecast period. Key players in the power amplifier ecosystem include Infineon Technologies (Germany), Texas Instruments (US), Broadcom (US), Toshiba (Japan), STMicroelectronics (Switzerland), Maxim Integrated (US), Yamaha (Japan), Qorvo (US), NXP Semiconductors (Netherlands), Analog Devices (US), Skyworks Solutions (US), QSC Audio Products (US), Peavey Electronics (US), Qualcomm (US), MACOM (US), BONN Elektronik (Germany), Renesas Electronics (Japan), ETL Systems (UK), and OPHIR RF (US).
The application processor market is expected to be valued at USD 29.0 billion in 2018 and is likely to reach USD 38.2 billion by 2023, at a CAGR of 5.63% during the forecast period. High demand for application processors from the consumer electronics industry is one of the major factors driving the growth of the market. Moreover, these processors are also increasingly being used in the automotive industry in automotive infotainment systems and ADAS systems; this factor is also expected to considerably boost the growth of the said market in the coming years. A few major players operating in the application processor market are Apple (US), Samsung Electronics (South Korea), Qualcomm (US), MediaTek (Taiwan), NXP Semiconductors (Netherlands), Texas Instruments (US), NVIDIA (US), Toshiba (Japan), and HiSilicon Technologies (China).
According to MarketsandMarkets, the mobile AI market is expected to reach USD 17.83 billion by 2023 from USD 5.11 billion in 2018, at a CAGR of 28.41% during the forecast period. The growth of this market can be attributed to the increasing demand for AI-capable processors for use in mobile devices, rise in cognitive computing, and growing number of AI applications. Major players in the mobile AI market are Huawei (China), Samsung Electronics (South Korea), Qualcomm (US), Intel (US), NVIDIA (US), Apple (US), IBM (US), Microsoft (US), MediaTek (Taiwan), and Google (US).
The integrated passive devices (IPD) market is expected to grow from USD 1,011.2 million in 2018 to USD 1,544.9 million by 2023, at a CAGR of 8.8% between 2018 and 2023. The growth of the IPD market is driven by factors such as increasing adoption of IPD in consumer durables, integration of IPDs into RF applications, increasing demand for miniaturized and high-performance electronic devices, continuous innovations, and the introduction of advanced and efficient technologies in the electronics industry. The increasing incorporation of infotainment and navigation features, such as global positioning system (GPS), in automobiles is supporting the market growth. Key players in the IPD market include STATS ChipPAC (Singapore), ON Semiconductor (US), Infineon (Germany), STMicroelectronics (Switzerland), Murata (Japan), Johanson, (US), OnChip Devices, (US), Global Communication Semiconductors, (US), 3DiS (France), and Advanced Furnace Systems (Taiwan).
The overall on-board magnetic sensor market is estimated to be worth USD 1.26 Billion in 2018 and is expected to reach USD 1.89 Billion by 2023, growing at a CAGR of 8.4% between 2018 and 2023. The growth of this market is driven by the continuous growth in the use of on-board magnetic sensors for consumer electronics applications and role of on-board magnetic sensors in navigation, and developments in the on-board magnetic sensor ecosystem through organic and inorganic growth strategies such as product launches, agreements, partnerships, collaborations, mergers and acquisitions, and expansions. Major companies involved in the development of on-board magnetic sensors include Asahi Kasei Microdevices (Japan), Sanken Electric (Allegro Subsidiary) (Japan), Infineon Technologies (Germany), TDK Corporation (Japan), and Melexis NV (Belgium), Murata Manufacturing (Japan), Honeywell International (US), TE Connectivity (Switzerland), AMS (Austria), and NXP Semiconductors N.V. (Netherlands), among others.
The overall HMC and HBM market is expected to increase from USD 922.7 Million in 2018 to USD 3,842.5 Million by 2023, at a CAGR of 33.02% between 2018 and 2023. The growing need for high-bandwidth, low power consuming, and highly scalable memories; increasing adoption of artificial intelligence; and rising trend of miniaturization of electronic devices are some of the factors driving market growth. Samsung (South Korea), Micron (US), SK Hynix (South Korea), Intel (US), and AMD (US) are the major players included in the report with ranking analysis. The report also covers various major contributors involved in the HMC and HBM market. Fujitsu (Japan), Xilinx (US), NVIDIA (US), IBM (US), and Open-Silicon (US) are the other important key companies in the HMC and HBM market. In addition, Arira (US), Cadence (US), Marvell (US), Cray (US), ARM (UK), and Rambus (China) are a few other companies involved in the market.
The GaN power device market was valued at USD 327.3 Million in 2016 and is expected to reach USD 1,890.2 Million by 2023, at a CAGR of 29.1% during the forecast period. The base year considered for the study is 2016 and the forecast period is between 2017 and 2023. The objective of the report is to provide a detailed analysis of the market on the basis of device type, voltage range, application, vertical, and geography. The report also provides information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the growth of the GaN power device market, along with the detailed value chain. The report also profiles the most promising players in the GaN power device market. The competitive landscape of the market presents an interesting picture of the strategies adopted by a large number of players. The key players in this industry are Cree (US), Qorvo (US), MACOM (US), Microsemi Corporation (US), Analog Devices US), Efficient Power Conversion (US), Integra Technologies (US), Transphorm (US), Navitas Semiconductor (US), Texas Instruments (US), Sumitomo Electric (Japan), Northrop Grumman Corporation (US), Qromis (US), Polyfet (US), TOSHIBA (Japan), Sumitomo Electric (Japan), Mitsubishi Electric (Japan), Panasonic (Japan), GaN Systems (Canada), VisIC Technologies (Israel), GaNPower (Canada), Infineon (Germany), Exagan (France), Ampleon (Netherlands), and EpiGaN (Belgium).
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
The overall intelligent virtual assistant (IVA) market was valued at USD 1.36 Billion in 2016 and is expected to reach USD 17.72 Billion by 2023, at a CAGR of 38.82% between 2017 and 2023. The report aims at estimating the market size and future growth potential of the IVA market based on product, user interface, type, industry, and geographic analysis. Major companies in the overall IVA market that have been included in this report are Alphabet (US), Amazon.com (US), Apple (US), Nuance Communications (US), IBM (US), Microsoft (US), Samsung Electronics (South Korea), Inbenta Technologies (US), Baidu (China), and Blackberry (US).
The universal flash storage market is valued at USD 1.65 Billion in 2016 and is estimated to grow at a CAGR of 18.3% to reach USD 4.50 Billion by 2023. This growth can be attributed to the growing demand for electronic devices with faster performance and improved responsiveness, rising adoption of high-speed data transfer technologies, and increasing demand for wearable electronics. Major players operating in the universal flash storage market include Arasan Chip Systems Inc. (US), Cadence Design Systems, Inc. (US), GDA Technologies Inc. (US), Micron Technology, Inc. (US), Phison Electronics Corporation, Inc. (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Silicon Motion Technology Corporation (US), SK Hynix, Inc. (South Korea), Synopsys, Inc. (US), and Toshiba Corporation (Japan).
The overall interactive voice response market is projected to exhibit a lucrative growth potential between 2017 and 2023. The interactive voice response (IVR) market was valued at USD 3.73 Billion in 2017 and is expected to reach USD 5.54 Billion by 2023, at a CAGR of 6.83% during the forecast period. The growth of the IVR market is attributed to the increasing integration of advanced technologies and rise in the cloud-based services that meet the industry standards for the IVR systems. The key market players in the North America are inContact Inc. (US), Nuance Communications, Inc. (US), Convergys Corporation (US), Avaya Inc. (US), Cisco Systems, Inc. (US), AT&T Inc. (US), West Corporation (US), Genesys Telecommunication Laboratories, Inc. (US), Verizon Communications Inc. (US), and 24/7 Customer, Inc. (US).
The Bluetooth Smart and Smart Ready market was valued at USD 4.55 Billion in 2016 and is expected to reach USD 5.34 Billion by 2023, at a CAGR of 2.23% during the forecast period. Growth of this market is being fueled by technological advancements over the past few years. Some of the major companies operating in the Bluetooth Smart and Smart Ready market are Qualcomm Inc. (US), Broadcom Corporation (Singapore), Cypress Semiconductor Corporation (US), Dialog Semiconductor PLC (UK), Marvell Technology Group, Ltd. (Bermuda), Mediatek, Inc. (Taiwan), Nordic Semiconductor ASA (Norway), Bluegiga Technologies (Finland), Texas Instruments Incorporated (US), Fanstel Corporation (US), Toshiba Corporation (Japan), Murata Manufacturing Co., Ltd. (Japan), Renesas Electronics Corporation (Japan), Microchip Technology Inc. (US), and CEVA, Inc. (US).
The sensor hub market was valued at USD 9.87 Billion in 2016 and is expected to reach USD 32.53 Billion by 2023, at a CAGR of 18.9% during the forecast period. The sensor hub market is driven by factors such as the steady growth in the number of integrated sensors in smartphones and the increasing use of 6-axis and 9-axis sensor solutions or use of sensor fusion within devices. Major players involved in the sensor hub market include Microchip Technology, Inc.(US), STMicroelectronics N.V. (Switzerland), Robert Bosch GmbH (Germany), NXP Semiconductors N.V.(Netherland), RoHM Co. Ltd. (Japan), Analog Devices, Inc.(US), InvenSense, Inc. (US), Intel Corp (US), Infineon Technologies AG (Germany), RoHM Co. Ltd. (Japan) and Memsic, Inc. (US).
According to the new research report, the interposer and fan-out WLP market is expected to be valued at USD 13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and 2022. The growth of this market is mainly driven by the rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of advanced wafer level packaging technologies in MEMS and sensors.
The stretchable conductive material market was valued at USD 0.1 Million in 2015 and is expected to reach USD 6.5 Million by 2022, growing at a CAGR of 79.10% during the forecast period. The increasing use of stretchable conductors in consumer electronics and advancements in design strategies, assembly techniques, and materials and the higher operational speed through the miniaturization of electronic products are the major drivers for the stretchable conductive material market.
The ballast water treatment (BWT) market was valued at USD 14.29 Billion in 2016 and is expected to reach USD 118.77 Billion by 2022, at a CAGR of 37.19% during the forecast period. The growth of this market is propelled by the increasing government rules and regulations for the installation of BWT systems in the ships.
Factors such as demand for inexpensive and reliable land mobile radios, significance of efficient critical communications, application of land mobile radios in diverse industries, and transition of communication devices from analog to digital are expected to drive the growth of the land mobile radio (LMR) market. The global LMR market was valued at USD 8.24 Billion in 2015 and is expected to grow at a CAGR of 14.3% between 2016 and 2022. The base year considered for the study is 2015 and the forecast period is between 2016 and 2022. The objective of the report is to provide a detailed analysis of the LMR market, based on type, technology, frequency, application, and region. The report provides detailed information regarding major factors influencing the growth of the land mobile radio market. The report also gives a detailed overview of the value chain of the LMR market and analyzes the market trends with the help of Porter’s five forces analysis.
The global G.fast chipset market is expected to grow from USD 41.0 Million in 2016 to USD 4,216.3 Million by 2022, at a CAGR of 116.5% between 2016 and 2022. The increased competition among the broadband service providers accelerates the demand for the G.fast chipset market across the world.
The M&A activity in the 3D printing industry has picked up pace in terms of the value as well as the number of deals. The analysis of many M&A deals reveals that 3D printing companies look for small- and mid-sized players that have lower operating expenses compared to their growth potential in the 3D printing industry value chain. Small-to mid-sized companies lacking the scale to grow have become attractive takeover targets for major players. There were maximum M&A deal announcements in 2014; it was a record year since 2010; this was followed by the number of announcements between 2013 and 2015.
The power management IC (PMIC) market is estimated to reach USD 34.86 Billion by 2022, at a CAGR of 8.08% between 2016 and 2022. The report aims at estimating the size and future growth potential of the PMIC market across different segments on the basis of product, application, and region. The base year considered for the study is 2015 and the market size is forecasted between 2016 and 2022. The rise in adoption of power management IC (PMICs) in the consumer electronics, wearable electronics, healthcare, and automotive sectors is expected propel the growth of the market for PMICs in the next five years.
Sputter coating is one of the popular and fastest growing physical vapour deposition techniques. The technology has major applications in electronics & semiconductor sector and is expected to remain an important market during the forecast period. The sputter coating market for target materials and equipment is expected to grow from USD 4166.3 Million in 2014 to USD 5613.8 Million in 2020, at a CAGR of 4.96 % during the forecast period (2015-2020).
A grow light is a type of electronic lamp designed to accelerate plant growth by emitting electromagnetic spectrum ideal for photosynthesis. LED grow lights make use of LED technology for illumination. The LED grow light market is analyzed by different product types, range of light spectrum emitted by them, and on the basis of new or retrofit type of installation. The application segments considered for market estimation of LED grow light include indoor farming, commercial greenhouses, vertical farming, turf & landscaping, and research purposes. The LED grow light market is expected to rise to more than $1.9 Billion by 2020, growing at a Compound Annual Growth Rate (CAGR) of 26.93% between 2015 and 2020.
Video walls provide various features, one of them being high-brightness screens; they are designed to release more light than the normal commercial-grade digital signs in the market, which are capable of surviving harsh external usage conditions. These screens are much more robust than the consumer-grade televisions that are commonly supplied to withstand these harsh environments. The video wall technology is emerging in both the developed and developing countries; it has a relatively lower turnaround time in the developing countries as this technology is available at higher prices with respect to the concerned economy.
Advanced process control (APC) encompasses a broad range of sophisticated technologies and tools that are used to optimize plant performances across a range of applications. It is used to optimize plant performance and stabilize plant operations by minimizing the fluctuations of key process variables. Today, APC technology is available all across the globe and is being increasingly used in new applications apart from its conventional use in oil & gas and petrochemical industry.
The global DSP market has returned to the growing phase after the global economic recession and is expected to grow steadily over the next 5 years. Large scale adoption of digital signal processing in the latest range of consumer electronics has lead to increased consumption of DSP chips, which are penetrating into several applications which use advanced state-of-the art digital signal processing.
The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.
A standard SoC consists of the application processing IP and peripherals. It also consists of analog IP, digital IP, memory IP, ASIC/FPGA/Programmable Logic IP and others. Mixed Signal System-on-a-Chip (MxSoC) is a relatively new category in SoC which is designed for mixed signal (handling both analog and digital purposes). Today the application area of mixed signal technology has spread in all end user sectors from Computers, ICT sectors to Consumer Electronics, Industrial and others. Technological advancements of IC technology have enabled a system level integration on a System-on-a-Chip making MxSoC a suitable and efficient solution for applications in the LSI industry.
The principle of BIPV is that the PV panels or modules are incorporated into the envelope of a building/façade/roof and they generate electricity at that specific location. This, in turn, maximizes the energy efficiency by eliminating the transmission losses that generally occur when electricity is supplied through the national grid.
Urbanization, increasing infrastructure, and government initiatives are the factors resulting into increase in modern lighting products. Incandescent lighting turns out to be a very costly and poor medium of lighting source. This stirs the push to LED lighting. COB LED technology has emerged due to its features such as low power consumption, cost effective lighting, and high intensity output. COB LED market contributes around 7 to 8% to the overall market for LED and is expected to reach around 20% in the near future.
The global LED chips market is thus witnessing an increasing demand, and companies are expanding their manufacturing capabilities to meet this demand. High brightness LED chips currently enjoy high growth as the backlighting application in TVs is shifting from traditional CCFL technology to LED technology.
This report highlights the basic structure of the nanophotonics market and its various sub-segments, including LEDs (Light-Emitting Diodes), OLEDs (Organic Light-Emitting Diodes), NFO (Near Field Optics), Nanophotonic ICs (Integrated Circuits), Optical Switches, Optical Amplifiers and Holographic memory. These individual markets are further broken down into their respective sub-segments based on products, ingredients and applications.