The rapid growth of wireless connectivity is boosting the demand for semiconductor materials and components that deliver higher performance in smaller form factors. The demand for h ....see more
The Die Bonder Equipment Market is expected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% during the forecast period. BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France) are the key players in the die bonder equipment market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to increase their market share.
The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. The high adoption of SLPs by leading OEMs, surge in demand for smart consumer electronics and wearable devices, and impactful benefits of SLPs are the major factors driving the growth of the substrate-like PCB market. AT&S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck Electronics (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); LG Innotek (South Korea) are major players in the substrate-like PCB market.
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
The Interactive voice response Market is witnessing strong global expansion as enterprises increasingly adopt AI-driven customer engagement systems, automated call handling, and intelligent contact center solutions. In 2025, the global Interactive voice response Market size is estimated at approximately USD 6 billion, and it is projected to reach nearly USD 18 billion by 2035, growing at a CAGR of 11 % – 12 % during the forecast period 2025–2035.
The ballast water treatment (BWT) market was valued at USD 14.29 Billion in 2016 and is expected to reach USD 118.77 Billion by 2022, at a CAGR of 37.19% during the forecast period. The growth of this market is propelled by the increasing government rules and regulations for the installation of BWT systems in the ships.
The M&A activity in the 3D printing industry has picked up pace in terms of the value as well as the number of deals. The analysis of many M&A deals reveals that 3D printing companies look for small- and mid-sized players that have lower operating expenses compared to their growth potential in the 3D printing industry value chain. Small-to mid-sized companies lacking the scale to grow have become attractive takeover targets for major players. There were maximum M&A deal announcements in 2014; it was a record year since 2010; this was followed by the number of announcements between 2013 and 2015.
Sputter coating is one of the popular and fastest growing physical vapour deposition techniques. The technology has major applications in electronics & semiconductor sector and is expected to remain an important market during the forecast period. The sputter coating market for target materials and equipment is expected to grow from USD 4166.3 Million in 2014 to USD 5613.8 Million in 2020, at a CAGR of 4.96 % during the forecast period (2015-2020).
The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.
This report highlights the basic structure of the nanophotonics market and its various sub-segments, including LEDs (Light-Emitting Diodes), OLEDs (Organic Light-Emitting Diodes), NFO (Near Field Optics), Nanophotonic ICs (Integrated Circuits), Optical Switches, Optical Amplifiers and Holographic memory. These individual markets are further broken down into their respective sub-segments based on products, ingredients and applications.